A5101647453- X-ray Diffraction in Crystallography
- Crystallization and Solubility Studies
- Crystallography and molecular interactions
- Dielectric materials and actuators
- Advanced battery technologies research
- Thermal Expansion and Ionic Conductivity
- Synthesis and properties of polymers
- Supercapacitor Materials and Fabrication
- Epoxy Resin Curing Processes
- Advanced Battery Materials and Technologies
- Advancements in Battery Materials
- Metal-Organic Frameworks: Synthesis and Applications
- Ferroelectric and Piezoelectric Materials
- Iron-based superconductors research
- Silicone and Siloxane Chemistry
- Advanced Semiconductor Detectors and Materials
- Magnetic and transport properties of perovskites and related materials
- Quantum Dots Synthesis And Properties
- Advanced Condensed Matter Physics
- 2D Materials and Applications
- Electromagnetic wave absorption materials
- MXene and MAX Phase Materials
- Advanced Battery Technologies Research
- Electrocatalysts for Energy Conversion
- Photopolymerization techniques and applications
Southern University of Science and Technology
2022-2024
Hong Kong University of Science and Technology
2016
University of Hong Kong
2016
Chinese Academy of Sciences
2008-2010
Hefei Institutes of Physical Science
2008
High Magnetic Field Laboratory
2008
Institute of Solid State Physics
2008
Sichuan University
2000
Abstract Traditional integrated circuit (IC) packaging materials and printed board substrate suffer from several limitations including low thermal conductivity, high coefficient of expansion (CTE), poor dielectric properties. Although significant efforts have been made to enhance these properties, achieving a single composite system with simultaneous extremely CTE, loss remains formidable task. In this study, we propose hybrid polymer that addresses challenges. Our approach involves...
Structural lithium batteries integrated with energy storage and mechanical load‐bearing capabilities hold great promise to revolutionize lightweight transport vehicles. However, the current development of structural faces critical challenges in balancing electrochemical properties electrolytes. Herein, a super strong quasi‐solid composite polymer electrolyte (QCPE) is successfully fabricated by reinforcing polyelectrolyte 3D situ self‐assembled metal–organic framework‐modified glass fiber...
Ultra-low-loss resin materials are widely utilized in the novel electronic packaging. In this study, we have investigated curing reaction kinetics of ultra-low-loss thermosetting systems represented by polyphenylene oxide/small molecule crosslinking agent triallyl isocyanurate/macromolecular 1,2-polybutadiene. Their process is very different from commonly used epoxy resin. First, such decelerating, unlike typical auto-accelerating systems. Due to high temperature, initiator concentration...
Abstract The mismatch of coefficient thermal expansion (CTE) components has created numerous reliability issues in electronic packages. Incorporating inorganic fillers into polymer matrices been proven to be an effective way reduce the CTE, but properly balancing CTE with other key properties composites is still a challenge. In current work, negative Zr 2 WP O 12 (ZWP) particles were prepared by high‐temperature solid‐phase synthesis method. Polyphenylene oxide (PPO)‐based different volume...
Ultralow-loss thermosetting resins cured via free-radical polymerization have been extensively applied as the polymeric matrix in high-frequency and high-speed printed circuit boards electronic packaging substrates. In recent years, silicon doping has commonly acknowledged for its potential to reduce dielectric loss of materials. Three silicon-containing cross-linkers are investigated this work use ultralow-loss poly(phenylene oxide) (PPO) The study compares influence these with two...
The structural, magnetic, electrical and thermal transport properties have been investigated in two-dimensional layered perovskite Sr1.05Ln0.95CoO4 (Ln = La, Ce Nd) compounds. variations of Jahn–Teller distortion the CoO6 octahedron effective magnetic moment indicate that induced holes are mostly accommodated t2g orbital states keeping intermediate-spin configuration. detailed comparison temperature dependence magnetization, resistivity, thermoelectric power conductivity suggests tolerance...
Abstract In high‐frequency applications such as 5G‐6G communication, internet of things, automotive radar, and automated driver‐assistance systems, substrate materials excel insulating layers owing to their superior dielectric properties. However, traditional methods for material development are often laborious costly. To overcome these limitations, we employed molecular dynamics (MD) simulations predict the properties at frequencies exceeding 10 7 Hz. Specifically, selected thermosetting...
High quality size of CdSe single crystal large was obtained by the modified growth technique, i.e. horizontal vapor phase located point nucleation (HVPLPN). The particular shape ampoule and less temperature gradients (7-8 K/cm) in interface used for growth. As-grown characterized varied methods including x-ray diffraction, SEM energy dispersive analyzer (EDAX) etc. Two cleavage faces (100) (110) found. has a stoichiometry ratio Cd : Se = 0.99 1 density dislocation is range 104-103/cm2...