Yong Yang Gan

ORCID: 0000-0001-8237-6594
Publications
Citations
Views
---
Saved
---
About
Contact & Profiles
Research Areas
  • Biodiesel Production and Applications
  • Thermochemical Biomass Conversion Processes
  • Catalysis and Hydrodesulfurization Studies
  • Algal biology and biofuel production
  • Biofuel production and bioconversion
  • Integrated Circuits and Semiconductor Failure Analysis
  • Process Optimization and Integration
  • Silicon and Solar Cell Technologies
  • Solar-Powered Water Purification Methods
  • Catalysts for Methane Reforming
  • Ionic liquids properties and applications
  • Petroleum Processing and Analysis
  • Ion-surface interactions and analysis
  • Material Properties and Processing
  • Industrial Vision Systems and Defect Detection
  • Semiconductor materials and devices
  • 3D IC and TSV technologies
  • Subcritical and Supercritical Water Processes
  • Advanced Surface Polishing Techniques
  • Nanofluid Flow and Heat Transfer
  • Solar Thermal and Photovoltaic Systems
  • Enzyme Catalysis and Immobilization
  • Electronic Packaging and Soldering Technologies
  • Thermal and Kinetic Analysis

Western Digital (Japan)
2023

University of Malaya
2018-2021

National Cheng Kung University
2019-2020

The rapid growth of high-performance power devices, 3D NAND technology, and advanced packaging applications has increased the need for unprecedented failure analysis techniques defect localization methods to identify mode root cause. Furthermore, characteristics or CMOS technology can be triggered by both operating non-operating conditions. Thermo Fisher Scientific ELITE system with Lock-in IR Thermography (LIT) is a non-destructive technique that been used localize defects measuring...

10.1109/ipfa58228.2023.10249052 article EN 2023-07-24

Flash memory has become the most important form of digital storage due to increased demand for devices. The 3D NAND structure been invented and continuously improved over time, encompassing advancements in XY scaling, stack height CMOS scaling from circuit-neighboring-array circuit-under-array Circuit Bonded Array. However, these have necessitated development failure analysis defect localization techniques identify location mode defects. One such technique is Optical Beam Induced Resistance...

10.1109/ipfa58228.2023.10249206 article EN 2023-07-24
Coming Soon ...