A fully-integrated 16-element 60-GHz phased-array receiver is implemented in IBM 0.12-μm SiGe BiCMOS technology. The employs RF-path phase-shifting and designed for multi-Gb/s non-line of sight links the ISM band (IEEE 802.15.3c 802.11ad). Each RF front-end includes variable-gain LNAs phase shifters with each capable 360° variable shift (11.25° resolution) from 57 GHz to 66 coarse/fine gain steps. detailed analysis noise trade-offs array design presented motivate architectural choices....

A phased-array transmitter (TX) for multi-Gb/s non-line-of-sight links in the four frequency channels of IEEE 802.15.3c standard (58.32 to 64.8 GHz) is fully integrated a 0.12-μm SiGe BiCMOS process. It consists an up-conversion core followed by 1:16 power distribution tree, 16 phase-shifting front-ends, and digital control unit. The TX two-step sliding-IF chain with synthesizer that features 40 dB gain programmability, I/Q balance LO leakage correction, modulator common-mode signaling....

A low-cost, fully-integrated antenna-in-package solution for 60 GHz phased-array systems is demonstrated. Sixteen patch antennas are integrated into a 28 mm × ball grid array together with flip-chip attached transmitter or receiver IC. The packages have been implemented using low temperature co-fired ceramic technology. interconnects, including transitions and via structures, optimized full-wave simulation. Anechoic chamber measurement has shown ~ 5 dBi unit antenna gain across all four IEEE...

A multilayer organic package with embedded 60-GHz antennas and fully integrated a phased-array transmitter or receiver chip is demonstrated. The includes sixteen antennas, an open cavity for housing the flip-chip attached RF chip, interconnects operating at DC-66 GHz. 28 mm ball grid array manufactured using printed circuit board processes uses combination of liquid-crystal polymer glass-reinforced laminates, allowing excellent interconnect antenna performance. measured return loss gain each...

What package improvements are required for dense, high-aggregate bandwidth buses running at data rates beyond 10 Gb/s per channel, and when might optical interconnects on the board be required? We present a study of distance speed limits electrical on-board module-to-module links with an eye to answering these questions. Hardware-validated models advanced organic modules printed circuit boards were used explore limits. Simulations link performance performed internal modeling tool allowed us...

A simple circuital approach to evaluate the shielding effectiveness (SE) of rectangular enclosures with apertures is proposed, considering oblique incidence and polarization. The scope proposed model extended beyond 1 GHz, including higher order modes cavity. Furthermore, are not required be on front face enclosure. In model, SE enclosure multiple sides can simply calculated by vector decomposition. has been successfully verified using a conventional full-wave simulation tool. We also...

This article summarizes the development of mature and highly integrated SiGe BiCMOS ICs for gigabit-per-second communications according to requirements IEEE 802.15.3c 802.11.ad-draft standards. A single-element transceiver chipset point-to-point is described with emphasis on a feature-rich yet compact 60-GHz receiver. Next, 16-element phased-array non-line-of-sight described, new power-efficient transmitter. Examples line-of-sight link experiments are provided, system-level implementation...

A 0.12-μm SiGe phased-array Rx IC for beam-steered wireless communication in the 60-GHz band is described. It has 16 RF phase-shifting front-ends with 11° digital phase resolution and hybrid passive-active signal combining. achieves 7.4-7.9 dB NF (not including 12-dB array gain) over 4 IEEE channels. The a double-conversion superheterodyne core maximum of 72 power gain 1-dB steps, on-chip synthesizer <; -90 dBc/Hz noise at 1MHz offset. draws 1.8 W 2.7 V die area 38 mm <sup...

A low-cost, fully-integrated antenna-in-package solution for 60-GHz phased-array system is demonstrated. Sixteen patch antennas are integrated into a 28 mm × ball grid array together with flip-chip attached transmitter or receiver chip. The packages have first been fabricated using low temperature co-fired ceramic technology, and then built conventional printed circuit board processes lower manufacturing cost. Antenna chamber measurement has shown ~5 dBi unit antenna gain across the...

We demonstrated biocompatible, optically transparent and flexible electrodes by embedding AgNWs just below the surface of silk fibroin film.

This paper introduces a mixed-mode matrix representation of scattering parameters that is suitable for the investigation wireless communication based on orbital angular momentum (OAM). For this purpose, unitary transformation defined, which contains transmitted and received amplitudes as basis vectors corresponding to OAM-based between two antenna arrays. The then obtained from similarity standard available, e.g., numerical simulations or measurements. allows better physical insight into by...

In high-speed digital systems, most of the electromagnetic interference (EMI) from system is caused by clock drivers and synchronized circuits. To reduce EMI clocks, spread spectrum (SSC) techniques that modulate frequency have been proposed. A conventional SSC generator (SSCG) has implemented with a phase locked loop (PLL) controlling period jitter. However, SSCG PLL becomes more difficult to implement at higher frequencies, in gigahertz range, because random jitter PLL. Furthermore,...

<para xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> A 40-Gb/s packaging solution that uses low-cost wire-bonded plastic ball grid array (WB-PBGA) technology is presented. Since such a high speed was beyond the reach of conventional package designs, new design methodology proposed—discontinuity cancellation in both signal-current and return-current paths. The 3-D structures bonding wires, vias, solder pads, power distribution networks were...

We propose a new analysis method to determine the bandgap characteristics of an electromagnetic structure with defected ground (DGS). The proposed is based on 1-D segmented transmission line model and piecewise linear approximation Zo within unit cell. Although previous only applicable rectangular DGSs (RDGSs), any DGS shapes. As example, applied circular shows good agreement full-wave simulations cell measurements 11 × cells. achieves 15% improvement in stopband bandwidth over RDGS same...

Radio waves carrying orbital angular momentum (OAM) have been intensively studied in recent years with respect to generation, propagation, and communication. In this article, the effect of an infinite ground on OAM wave propagation communication is investigated numerically using method moments (MoM). A circular array half-wavelength dipoles taken as a uniform array, for generation reception waves. First, electromagnetic image theory adopted analysis numerical investigation arrays their...

A low-cost, fully-integrated antenna-in-package (AiP) solution for 60-GHz phased-array systems is demonstrated. Sixteen patch antennas are integrated into a multilayer organic (MLO) ball grid array (BGA) together with flip-chip attached transmitter or receiver IC. Compared to the previous package design, enhanced 24 mm × not only reduces footprint area by 27%, but it also eliminates open IC cavity which improves yield and assembly significantly. Printed circuit board processes used in...

Differential signaling has become a popular choice for high-speed digital interconnection schemes on printed circuit boards (PCBs), offering superior immunity to crosstalk and external noise. However, conventional differential lines PCBs still have unsolved problems, such as radiated emission. When more than two pairs run in parallel, line is coupled the adjacent it because all are parallel fixed order. Accordingly, that constitute pair subject differential-mode cannot be canceled out by...

A practical multiport measurement method is presented for the precise characterization of an N-port device using a two-port vector network analyzer. Because 2 unused ports need not be terminated with matched loads, test fixture can simplified. Any influence reflections from unterminated deembedded by port renormalization. The proposed was verified coupled microstrip line structure.

We propose a new wideband and compact electromagnetic bandgap (EBG) structure with balanced slots (BS-EBG). In conventional EBG structures, significant number of cells are required to ensure periodicity meet noise-suppression requirements. However, the large space requirements structures limit their use in practical designs. The force power/ground noise pass through each every cell, improving thereby enhancing characteristics. An analytical model for proposed BS-EBG is developed based on...

This paper presents near-field (NF) and far-field (FF) analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure in packages boards. Three test vehicles have been designed fabricated for NF FF measurements. Simulation results using a full-wave solver (SONNET) compared with measurement results. investigates the radiation due to return current on different reference planes. The from simulations measurements provide important guidelines design AI-EBG based power distribution...

Crosstalk induced in a meander delay line produces significant amount of waveform distortion and data-dependent jitter at the output port. This paper introduces an interpretation eye-diagram generation mechanism based on time-domain even- odd-mode analysis coupled transmission structure. From proposed analysis, this proposes jitter-estimation equations for both short long unit cases. The timing are predicted estimated, respectively. In order to verify equations, series microstrip-type...

Aggregate chip bandwidths in server and high performance computing have exceeding Tb/s, if present trends are to continue would lead doubling the number of signal pins each generation. For bandwidth switch applications, requirements could exceed package pin limit as early 2012. We defined metrics compare electrical optical interconnects, which includes density (Gb/s/mm2/port), media bandwidth*distance product (GHz*m), power consumption (mW/Gb/s/Port), technology comparison metric...

System-in-package provides highly integrated packaging with high-speed performance. Many SiP packages contain low-cost 3D stacked chips interconnected by fine wire bonds. In a high-frequency spectrum, these bonds can cause discontinuities causing signal degradation. This article addresses problems bonding in and proposes design methodologies to reduce discontinuities.

Wireless communication of radio waves carrying orbital angular momentum is investigated in this paper, to explore the impact orientations transmitting and receiving arrays. As an example, two circular arrays, each containing eight dipoles, are taken as a transmitter receiver different OAM modes. A mixed-mode matrix, taking consideration all possible modes, used interpret performance. Thanks advantage received power mode combination generated modes at transmitter. The studied using method...

Meander (serpentine) delay lines are generally used for controlling the skew of traces in high-speed Printed Circuit Board (PCB) applications. They consist equal-length unit closely packed to each other. However meander deteriorate total time and waveform distortion end lines, since line is tightly coupled. In this paper, predict accurate Time-Domain Reflectometry/Time-Domain Transmit (TDR/TDT) waveforms by crosstalk single differential line, simple TDR/TDT equations proposed point signal...