A5053525518- Acoustic Wave Resonator Technologies
- Semiconductor materials and devices
- Advanced MEMS and NEMS Technologies
- Thin-Film Transistor Technologies
- Ferroelectric and Negative Capacitance Devices
- ZnO doping and properties
- Radio Frequency Integrated Circuit Design
- Racial and Ethnic Identity Research
- Additive Manufacturing and 3D Printing Technologies
- Advanced Sensor and Energy Harvesting Materials
- Ferroelectric and Piezoelectric Materials
- Advancements in Semiconductor Devices and Circuit Design
- Electrostatic Discharge in Electronics
- Advanced Electrical Measurement Techniques
- Surface Roughness and Optical Measurements
- Mechanical and Optical Resonators
- Electronic and Structural Properties of Oxides
- MXene and MAX Phase Materials
- Ga2O3 and related materials
- Experimental Learning in Engineering
- Dermatological diseases and infestations
- Intimate Partner and Family Violence
- Microwave and Dielectric Measurement Techniques
- Shape Memory Alloy Transformations
- Reproductive tract infections research
University of Miami
2022-2024
University of Vermont
2024
Purdue University West Lafayette
2004-2023
Rochester Institute of Technology
2018
With the rapid proliferation of telecommunication and RF applications, so, too, has demand grown for tools to design characterize these devices. scikit-rf is a Python package designed make RF/microwave engineering both robust approachable. The provides modern, object-oriented library network analysis, circuit building, calibration, simulation.
A 10.5 nm silicon doped HfO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> film is deposited and examined on three different bottom electrodes: a TiN electrode such as would be found in capacitive FeRAM, lightly p-Si substrate present an FeFET, n+ Si electrode. The stack shown to have coercive voltage of 2.9 V compared 1.9 for the TiN. This due 1.2 oxide at /Si interface dropping 36% that applied ferroelectric stack. An FeFET fabricated...
This work reports for the first time ultrathin atomic-layer-deposited (ALD) InZnO as a novel back-end-of line (BEOL) channel material monolithic 3D integration. By tuning ratio of In to Zn with ALD cycles, transistors 3.5 nm thickness can achieve excellent subthreshold swings (SS) low 65 mV/dec, high on-off current up $10 ^{11}$, and sizeable on-current density (I <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ON</inf> ) 1.33 A/mm In-rich...
Abstract In radio communication, the growth of beamforming and multiple-input–multiple-output technologies, which increase transceiver complexity, have led to a drive reduce size, weight power components by integrating them into single system on chip. One approach is integrate frequency references acoustic microelectromechanical systems (MEMS) with complementary metal–oxide–semiconductor processes, typically through MEMS-first or MEMS-last that requires process customization. Here we report...
In this work, we report back-end-of-line (BEOL) compatible <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf> O xmlns:xlink="http://www.w3.org/1999/xlink">3</inf> RF transistors with cut-off frequencies (f xmlns:xlink="http://www.w3.org/1999/xlink">T</inf> ) up to 36GHz, which is the highest among all metal oxide semiconductor channel date. Due outstanding transport properties and high scalability of , record-high f value can be achieved V...
The remarkable dc performance of ultrathin indium oxide transistors offers a path toward high-performance back-end-of-line (BEOL) and monolithically integrated logic memory devices for next-generation computing. Its very low thermal budget, high reliability, scalability, 3-D conformality are additional factors that make these well-suited applications. Here, the radio frequency (RF) with working is characterized first time. A new record cutoff ( <inline-formula...
Micro-robotics is a burgeoning field, with potential applications in search and rescue, smart dust, advanced additive manufacturing micro-surgery. A critical component enabling micro-robotic systems efficient actuator materials. In this work we introduce thin films of NdNiO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> , prototypical perovskite nickelate, as material for MEMS actuation, providing up to 6.0% tensile volumetric strain...
Abstract A wide range of applications rely on the ability to integrate electrically conductive microstructures with microfluidic channels. To bypass planar geometric restrictions conventional microfabrication processes, researchers have recently explored use “Direct Laser Writing (DLW)”—a submicron‐scale additive manufacturing (or “3D printing”) technology—for creating microfeatures fully 3D configurations. Despite considerable progress in development DLW‐compatible photomaterials, thermal...
Monolithic integration of Microelectromechanical Systems (MEMS) directly within CMOS technology offers enhanced functionality for integrated circuits (IC) and the potential improvement system-level performance MEMS devices in close proximity to biasing sense circuits. While bulk CMOS-MEMS solutions involve post-processing chips define freely-suspended structures, there are key applications conditions under which a solid, unreleased acoustic structure composed stack is preferred. Unreleased...
Hispanic/Latinx youth vary in their immigration heritage (e.g., country of origin, familial migration history, etc.) and the structure communities. This study is a qualitative exploration experiences cultural stress Miami Los Angeles 2021.
Mass migration and COVID-19 represent two converging challenges affecting immigrant-receiving countries. Our understanding of intergroup emotion profiles—positive (happiness, hope, sympathy) negative (anger, fear, disgust)—among members immigrant destination societies in times global uncertainty remains limited. Drawing from panel samples nine countries ( N = 13,645), controlling for relevant covariates, we aimed to extract latent profiles emotions map these onto perceived COVID-19-related...
Here we present the first demonstration and in-depth study of unreleased acoustic resonators in 14nm FinFET technology IEEE X band, which offer a zero-barrier-to-entry solution for high Q, small footprint, resonant tanks integrated seamlessly advanced CMOS nodes. These devices leverage phononic waveguides confinement, exploit MOS capacitors transistors inherent to electromechanically drive sense vibrations. Sixteen device variations are analyzed across thirty bias points discern impact gate...
CMOS-MEMS resonators seamlessly integrated in advanced circuit (IC) technology have the unique capability to enable unprecedented integration of stable frequency references, acoustic spectral processors, and physical sensors. Demonstrations transducers leveraging piezoelectric properties emerging ferroelectric materials such as Hafnium Zirconium Oxide (HZO) Aluminum Scandium Nitride (AlScN) high figure merit (FOM=k2Q) over a wide range frequencies. CMOS-integrated using thickness-scaled...
Abstract Patients experiencing homelessness (PEH) are a patient group with high levels of morbidity and mortality. PEH have rates dermatophyte infections, although the exact incidence prevalence compared to general population has not been determined. This study characterizes tinea pedis in homeless individuals across geographic locations offers recommendations for treatment low-resource settings. A total 58 PubMed articles were analyzed inclusion criteria containing ‘tinea pedis’ ‘homeless’....
Ultra-thin indium oxide (In <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf> O xmlns:xlink="http://www.w3.org/1999/xlink">3</inf> ) from several nanometers to sub-nanometer thick has recently been revealed as an excellent n-type semiconductor channel material for back-end-of-line (BEOL) compatible transistors due its low thermal budget, subthreshold swing (SS), high on current and I xmlns:xlink="http://www.w3.org/1999/xlink">on</inf> /I...
3D Nanoprinting In article number 2100222, Ryan D. Sochol and colleagues introduce strategies for nanoprinting graphene-laden materials to enable the integration of geometrically sophisticated microelectronics with microfluidic systems. Fully electrically conductive microstructures comprising reduced graphene oxide are additively manufactured directly inside enclosed microchannels, offering a unique pathway microelectronics-based applications.