A5100429126- Heat Transfer and Optimization
- Electronic Packaging and Soldering Technologies
- Gas Sensing Nanomaterials and Sensors
- Heat Transfer and Boiling Studies
- 3D IC and TSV technologies
- Analytical Chemistry and Sensors
- Heat Transfer Mechanisms
- Advanced Battery Technologies Research
- ZnO doping and properties
- Metal and Thin Film Mechanics
- Injection Molding Process and Properties
- Electric Vehicles and Infrastructure
- Silicon Carbide Semiconductor Technologies
- Advancements in Battery Materials
- Advanced Chemical Sensor Technologies
- Additive Manufacturing and 3D Printing Technologies
- Manufacturing Process and Optimization
- Refrigeration and Air Conditioning Technologies
- Electromagnetic Simulation and Numerical Methods
- Power Systems and Technologies
- Advanced Measurement and Detection Methods
- Concrete and Cement Materials Research
- Advanced Battery Materials and Technologies
- Thermal properties of materials
- Wind and Air Flow Studies
State Grid Corporation of China (China)
2022-2024
Institute of Microelectronics
2014-2024
Chinese Academy of Sciences
2019-2024
China Automotive Technology and Research Center
2020-2024
Beijing Institute of Technology
2024
Sichuan Agricultural University
2022-2023
Institut National des Sciences Appliquées de Rennes
2022-2023
Harbin Engineering University
2023
Tarim University
2021-2022
Zhejiang University
2022
A novel core-shell structure based on upconversion fluorescent nanoparticles (UCNPs) and dopamine-melanin has been developed for evaluation of the antioxidant capacity biological fluids. In this approach, nanoshells facilely formed surface UCNPs act as ultraefficient quenchers fluorescence, contributing to a photoinduced electron-transfer mechanism. This spontaneous oxidative polymerization dopamine-induced quenching effect could be effectively prevented by presence various antioxidants...
Semiconducting 2D metal oxides have attracted great research interests for gas-sensing applications because of their considerable specific surface area and highly homogeneous surface. Developing a method fabricating thin films is crucial minimizing the negative effects on sensing performance caused by slow diffusion. In this work, simple, versatile, reproducible self-assembly developed monolayer film sensors made from oxide nanosheets with much superior compared thick counterparts. To...
We report an open cavity, cantilever-based fiber optic Fabry-Perot interferometer hydrophone. The hydrophone is made of fused silica material, and its micro-cantilever beam directly fabricated by femtosecond (fs) laser micromachining. theoretical analyses experimental verifications the frequency response sensor are presented.
This paper focuses on characterizing the evolution of warpage, effects epoxy molding compound (EMC), and carrier 2 (the second in process) 12 inch RDL-first multi-die fan-out wafer-level packaging (FOWLP) during manufacturing process. The linear viscoelasticity properties EMC polyimide (PI) were characterized using dynamic mechanical analysis (DMA) frequency domain at different temperatures., elastic viscoelastic model used for PI EMC, finite element analyses (FEA) cured structure carried...
The study presents a novel fluid rotating microchannel heat sink (FR-MC) and reports its transfer performance. FR-MC features two cross ribs positioned in the channel. These are inclined direction of flow, with each rib inclining opposite directions. This design enables to ascend or descend along ribs, creating rotation after passing through center alter flow direction. Experimental validation confirms accuracy model numerical simulations. investigates capability comparative analysis,...
This paper proposes a multiphase modular fault-tolerant permanent-magnet (PM) machine with hybrid single/double-layer fractional-slot concentrated winding (FSCW). Comparisons between the proposed and conventional FSCW machines are made to indicate special characteristics in aspects of armature magnetomotive force harmonic distribution, cogging torque, magnetic isolation ability, torque capability. Then, influences specific structural parameters, including angle single-layer slot (SLS)...
With the development of artificial intelligence (AI) and high-performance computing (HPC), microelectronic industry is challenged with increased device integration density. Chiplet architecture can break through a variety limitations on system-on-chip (SoC) to create high-computility system. However, chiplet heterogeneous suffers from high heat flux serious thermal interaction problems. The factors affecting are not clear. In this paper, collective parameter model distribution developed...