This paper presents a fringe capacitance formula of microstructures. The is derived by curve fitting on ANSYS simulation results. Compared with the and experimental results, deviation within ±2%. application to determine pull-in voltage an electrostatic micro-beam demonstrated, which agrees very well data. presented accurate, yields explicit physical meanings applicable common dimension ranges for MEMS devices.

This study successfully established a strip warpage simulation model of the flip-chip process and investigated effects structural design (molding, post-mold curing, pretreatment, ball mounting) on warpage. The errors between simulated experimental values were found to be less than 8%. Taguchi analysis was employed identify key factors affecting warpage, which discovered die thickness substrate thickness, followed by mold compound molding temperature. Although greater reduce they also...

This study investigated the impact of material properties epoxy molding compounds on wafer warpage in fan-out wafer-level packaging. As there is currently a lack comprehensive discussion various property parameters EMC materials, it essential to identify critical influencing factors and quantify effects each parameter warpage. The include Young's modulus compound before after glass transition temperature (Tg) range 25-35 °C (EL) 235-260 (EH), coefficient thermal expansion (α1, α2), change...

This paper derives an approximate analytical solution to the pull-in voltage of a micro bridge with elastic boundaries. The model considers boundary effect, fringing field capacitance, residual stresses and distributed flexibility bridge. accuracy present is verified by comparison simulation results commercial FEM packages other published closed-form solutions as well experimental measured data. deviation within 5% for wide beam narrow in small deflection regime. has explicit physical...

We propose an approximate analytical solution to the pull-in voltage of a microcurled cantilever beam. The model considers realistic situations, which include stress gradient, nonideal boundary conditions, and fringing field capacitance. proposed can be used at wafer level for extracting Young's modulus thin film beam is made. obtained based on Euler's minimum energy method. accuracy verified more accurate than other published models. presented in this work wafer-level evaluation material...

ABSTRACT Residual stress in MEMS is of inherent importance various respects. This study proposes a specific method using ANSYS including the birth and death combined with optimal (SCGM) to reduce residual stresses during CMOS fabrication process. The suitable cooling temperature for decreasing proposed available. It demonstrates that parameter on can devices without any extra manufacturing process or external apparatus. expand simulate realistic model effectively.

This paper develops the technologies of mechanical characterization CMOS-MEMS devices, and presents a robust algorithm for extracting properties, such as Young's modulus, mean stress, through external electrical circuit behavior micro test-key. An approximate analytical solution pull-in voltage bridge-type test-key subjected to electrostatic load initial stress is derived based on Euler's beam model minimum energy method. Then one can use aforesaid closed form extract modulus test...

This research aims at developing a flexible strain module applied to the strengthening of back muscles. Silver films were sputtered onto substrates produce sensor. Assuming that muscle elongation is positively correlated with variations in skin surface length, real-time resistance changes exhibited by sensor during simulated training sessions measured. The results used identify relationship between change sensors and stretch. In addition, length from ultrasound images determine feasibility...

This study established a simulation model for reliability of Ball Grid Array (BGA) IC package subjected to temperature cycling. COMSOL Multiphysics software was used and this Garofalo-Arrheniuss Law creep equation Modified Coffin-Manson estimate fatigue life chip cycling test (TCT). Since the thermal expansion coefficients between materials are mismatch, would occur warpage. The solder ball peripheral edge cracked firstly, estimated error is 15.7% compared with experimental value. could find...

Abstract A molded wafer-level package simulation model was successfully developed for calculating solder ball fatigue life during a temperature cycle test (TCT), revealing that the most crucial factor affecting life, rather than being maximal stress in balls, is equivalent strain range balls creep effect. Accordingly, TCT, of which are located from outer edge to center, negatively correlated with range; earliest rupture those at edges, have highest but not stress. Regarding distribution,...

This study constructed a system for real-time monitoring of knee extensor muscle training motion with flexible sensors. Knee is classified to three levels according their skin stretch and corresponding change in electrical resistance measured by The area the largest corresponds sensor location that measures resistance. Results show major sites standard exercise: rectus femoris (RF), vastus medialis (VM), lateralis (VL). In addition, sensors proposed can not only be used 24 repetitions but...

This paper develops a rapid algorithm to extract the Young's modulus and residual stress of structural material capacitive micro-device from measuring pre-pull-in capacitance variation micro test beam made be tested. The extracted modului stresses demonstrated samples agree very well with experimental measurement. present method is expected applicable wafer-level testing in manufacture compatible IC industry since pick-up signals are both electrical.

This study has successfully established a simulation model for dicing tape expansion. COMSOL Multiphysics software was used to investigate the spacing condition before separating dies, and Taguchi method identify key factors increasing between dies. analyzed five of influence on dies: anisotropic properties tapes, temperature, die thickness, rising height grip ring. According main effect plot, factor There little impact materials, tape, thickness dies (Δspacing) production line.

Abstract This study successfully established a strip warpage simulation model that is applied to the wire bonding process, and explored effects of structural designs, material types, processes such as molding, post mold cure (PMC), pretreatment, ball mounts on warpage. The error between experimental values less than 13.7%. In addition, Taguchi method used determine key factors affecting are die thickness compound thickness, secondary factor molding temperature. concluded in order reduce...

This paper successfully established an effective model for analyzing the fracture mechanism of silicon wafer when subjected to force by stealth laser beams. By using this model, simulations can be performed, in substitution experimentation a large quantity, quickly obtain trend at various machine parameters dicing (SD) is applied. A commercial software package, Abaqus, was used simulate effect tapes, SD crack percentage, die size, and thickness on development cracks specific parameters. The...

In this study, the robustness of a wafer-level testing algorithm was analyzed and Taguchi methods were used to perform variability analysis on effects differences in test key structural length (ΔL), material crystal direction, Young's modulus (E) mean stress (σ <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0</sub> ) thin films. The results study indicate that difference is most crucial prominent factor substantially affects convergence...

In this study, a flexible sensor module was developed that can be applied in the activation training of spinal muscles. Silver films were sputtered onto substrates to produce sensor. Assuming muscle elongation is positively correlated with variations skin surface length, real-time resistance changes exhibited by during simulated trainings measured. The results used identify relationship between change and length (the dependent variable). addition, ultrasound measurements electromyography...

This study successfully established a simulation model during the dicing wafer expanding and analyzed trends of spacing between separated dies. COMSOL Multiphysics software was used to investigate influence on dies in two directions MD CD under different raised heights die grip ring. Since height is from 0 5 mm process expanding, this discussed uniformity tape by comparing change with original when ring at an equal height. For standard deviations average both directions, it found that same...