A5079746942- Thermal properties of materials
- Dielectric materials and actuators
- Semiconductor Quantum Structures and Devices
- Advancements in Semiconductor Devices and Circuit Design
- Advanced Sensor and Energy Harvesting Materials
- Thermal Radiation and Cooling Technologies
- GaN-based semiconductor devices and materials
- Graphene and Nanomaterials Applications
- Polymer Nanocomposite Synthesis and Irradiation
- Electrochemical sensors and biosensors
- Conducting polymers and applications
- Adsorption and biosorption for pollutant removal
- Photonic and Optical Devices
- Semiconductor Lasers and Optical Devices
- Tribology and Wear Analysis
- Epoxy Resin Curing Processes
- Nanomaterials for catalytic reactions
National Yang Ming Chiao Tung University
2024
National Taiwan University of Science and Technology
2020-2022
In this study, a thermal conductivity of 0.22 W·m-1·K-1 was obtained for pristine epoxy (EP), and the impact hybrid filler composed two-dimensional (2D) flake-like boron nitride (BN) zero-dimensional (0D) spherical micro-sized aluminum oxide (Al2O3) on resin investigated. With 80 wt.% Al2O3-BN contents, EP composite reached 1.72 W·m-1·K-1, increasing approximately 7.8-fold with respect to pure matrix. Furthermore, different important properties application were analyzed, such as...
In this study, the effects of a hybrid filler composed zero-dimensional spherical AlN particles and two-dimensional BN flakes on thermal conductivity epoxy resin were studied. The (TC) pristine matrix (EP) was 0.22 W/(m K), while composite showed TC 10.18 K) at 75 wt% AlN-BN loading, which is approximately 46-fold increase. Moreover, various essential application properties examined, such as viscosity, cooling rate, coefficient expansion (CTE), morphology, electrical properties. particular,...
This research has successfully synthesized highly flexible and conductive nanohybrid electrode films. Nanodispersion stabilization of silver nanoparticles (AgNPs) were achieved via non-covalent adsorption with an organic polymeric dispersant inorganic carbon-based nanomaterials—nano-carbon black (CB), carbon nanotubes (CNT), graphene oxide (GO). The new dispersant—polyisobutylene-b-poly(oxyethylene)-b-polyisobutylene (PIB-POE-PIB) triblock copolymer—could stabilize AgNPs. Simultaneously,...
The avoidance and mitigation of energy wastage have attracted increasing attention in the context global warming climate change. With advances materials science, diverse multifunctional with high thermal conductivity shown excellent energy-saving potential. In this study, a hybrid film exhibiting stretchability washability was prepared. First, simple surface modification boron nitride (BN) performed to realize modified (BNOH) filler. Next, an organic dispersant synthesized enhance dispersion...
Abstract The heat dissipation optimization process is a crucial element in high power electron mobility transistor (HEMT) components fabricated using the Gallium Nitride grown on silicon (Si) substrate. In this study, Si substrate thinned from 1000 to 600 µm, and then partial device area (under HEMT two dimension (2D concentration gas channel) etched 20 µm by deep etching system. After, three different materials are utilized fill gap. There electroplate copper sheets, silver paste, paste....
A hybrid material obtained by blending β-chitosan (CS) with triethylenetetramine-functionalized graphene oxide (TFGO) (CSGO), was used as an adsorbent for a reactive dye (C.I. Reactive Blue 221 Dye, RB221), and the adsorption removal performances of unmodified CS mix-modified CSGO were investigated compared systematically at different pH values (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12). The capacities 45.5 56.1 mg/g, respectively, 2 5.4 37.2 12. This indicates that TFGO successfully introduced...
Abstract Thin film p-side up vertical-cavity surface-emitting lasers (VCSELs) with 940 nm wavelength on a composite metal (Copper/Invar/Copper; CIC) substrate has been demonstrated by twice-bonding transfer and removing techniques. The CIC is sandwich structure 10 µm thick Copper (Cu) layer/30 Invar layer/10 Cu layer. layer was composed of Iron (Fe) Nickel (Ni) proportion 70:30. thermal expansion coefficient the can match that GaAs substrate. It results VCSEL layers be successfully...