A5017078856- Advanced Surface Polishing Techniques
- Advanced machining processes and optimization
- Diamond and Carbon-based Materials Research
- Laser Material Processing Techniques
- Metal and Thin Film Mechanics
- Surface Modification and Superhydrophobicity
- Tunneling and Rock Mechanics
- Photonic Crystals and Applications
Huazhong University of Science and Technology
2020-2024
Single crystal Si subsurface damage and phase transformation caused by laser-assisted nanometric cutting were investigated in this paper through the ultraprecision experiments molecular dynamics simulation. Post-cutting examination of a crystal's revealed distorted SiI layer an amorphous with embedded nanocrystalline Si-III Si-XII. As result insufficient contact pressure during cutting, was directly generated from collapse lattice rather than intermediate high-pressure Si-II. The...
In robotic polishing, the strain rate effect induced by different processing speeds considerably affect material removal behaviour and machined surface quality. present study, spot polishing tests molecular dynamics simulation were conducted to investigate of machining speed on formation subsurface damage mechanism single-crystal silicon. The results indicate that plastic deformation workpiece is improved as increases. Besides, thinner amorphous layer less are observed, indicating crystal...
Abstract Silicon carbide (SiC) is a material of great interest in many industrial applications. However, due to the hardness and brittleness nature, achieving ultra-precision machining SiC still challenging. In recent years, function surface with micro-structures has been introduced cutting tool suppress wear process. But mechanism structured not revealed completely. Therefore, present research, molecular dynamic simulations were conducted investigate influence micro-structure on nano scale...
Abstract Silicon carbide (SiC) is an important material in many industrial applications. However, due to the hardness and brittleness nature, achieving ultraprecision machining of SiC still challenging. In recent years, function surface with microstructures has been introduced cutting tool suppress wear process. But mechanism structured not revealed completely. Therefore, present research, molecular dynamic simulations were conducted investigate performance microstructure on nanoscale...
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Abstract Laser-assisted diamond cutting is a promising process for machining hard and brittle materials. A deep knowledge of material removal mechanism attainable surface integrity are crucial to the development this new technique. This paper focuses on application laser-assisted single crystal silicon investigate key characteristics process. The influence laser power ductile machinability silicon, in terms critical depth cut ductile-brittle transition cutting, investigated quantitatively...