A5002206385- Antenna Design and Analysis
- Microwave Engineering and Waveguides
- Advanced Antenna and Metasurface Technologies
- Radio Frequency Integrated Circuit Design
- Antenna Design and Optimization
- Energy Harvesting in Wireless Networks
- Electromagnetic wave absorption materials
- Advancements in PLL and VCO Technologies
- Millimeter-Wave Propagation and Modeling
- Metamaterials and Metasurfaces Applications
- Electromagnetic Compatibility and Noise Suppression
- Photonic and Optical Devices
- 3D IC and TSV technologies
- Analog and Mixed-Signal Circuit Design
- Laser and Thermal Forming Techniques
- Electronic Packaging and Soldering Technologies
- Civil and Geotechnical Engineering Research
- Vehicle License Plate Recognition
- Advanced Battery Technologies Research
- Simulation and Modeling Applications
- Optical measurement and interference techniques
- Extraction and Separation Processes
- Advancements in Battery Materials
- VLSI and Analog Circuit Testing
- Optical Systems and Laser Technology
Tianjin University
2020-2024
Central South University of Forestry and Technology
2021-2022
Central South University
2021-2022
Hebei Semiconductor Research Institute
2014-2017
Institute of Mechanics
2007-2008
Chinese Academy of Sciences
2007-2008
This brief introduces a compact, cost-effective broadband patch antenna based on ball grid array (BGA) packaging technology for 5G millimeter wave new radio (NR) FR2 band application. Based the low-cost FR-4 substrate and single-layer configuration, achieves an ultra-low cost, which is attractive large-scale millimeter-wave applications. Parasitic patches are added to obtain impedance bandwidth. To further reduce size eliminate bulky connectors, solder balls form BGA package with...
A low insertion loss, wideband 6-bit digital step attenuator is implemented in the 0.25-μm GaAs pHEMT process. Modified π- or T-type structures are adopted to expand operation frequency bandwidth and reduce phase violation. Furthermore, through-wafer via (TWV) analyzed influence of parasitic effect on high-frequency performance attenuator. The depletion mode single-gate switch transistors used control on-off state attenuator, which provides loss high isolation. 0.5 dB, attenuation range 31.5...
This article presents a differential-fed magneto-electric (ME) dipole with integrated balun based on ball grid array (BGA) packaging. The electric consists of four metal patches the top layer, and magnetic two rows plated through-holes (PTH) ground bottom layer. dipoles are excited simultaneously by double L-shaped probes. In addition, is implemented simple 180° delay line that provides pair differential signals to miniaturized size obtained BGA Antenna elements <inline-formula...
This article presents a cost-effective miniature surface-mount magnetoelectric (ME) dipole antenna. The antenna is realized by single-layer FR4 substrate and combined with ball grid array (BGA) packaging technology to achieve miniaturization in size. Due BGA technology, the capability allows interconnection between proposed other devices using flip-chip interconnect replacing bulky connectors. element very compact. Specifically, electric of consists four patches, whereas magnetic two rows...
A wideband true time delay is proposed based on 0.25- μm GaAs pHEMT technology. The novel trombone topology adopted for achieving low variation in insertion loss of different states. fourth-order and second-order inductive all-pass networks (APNs) are operating as cells between input output lines. By selecting transmission ways, 3 bit with the step 14 ps maximum range 98 realized. Measurement results show 3.8-10.5 dB over frequency bandwidth 6-16 GHz. less than ±1.4 dB. chip area pads 1.955...
A cost-effective ball grid array (BGA) packaged surface-mount off-center-fed dipole antenna element and its are proposed for 5G millimeter-wave new radio (NR) applications. The exhibits a compact size of 0.61 λ <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0</sub> ×0.61 ×0.16 ( is the wavelength in free space at center operating frequency) realized by only one FR4 layer to minimize cost. Plated through holes (PTHs) connect patch on top bottom...
A 5-bit switched-line true time delay (TTD) circuit is proposed based on 0.25-μm GaAs pHEMT technology. The structure within the TTD units formed by employing second-order all-pass networks (APNs). double-pole double-throw (DPDT) switch specifically designed to replace conventional cascading of two single-pole (SPDT) switches, thus, minimizing insertion loss introduced switches. To mitigate fluctuation across different states, several π-type resistive attenuators are incorporated into...
This letter presents a broadband, low insert loss (IL) 6-bit switch-type digital step attenuator (DSA) implemented in 0.25- <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\mu \text{m}$ </tex-math></inline-formula> GaAs pHEMT process. The notation="LaTeX">$\pi $ -type attenuation units adopt the proposed capacitive-inductive joint compensation technique, which inductor demonstrates an effective zero-pole...
A wideband, low phase variation 6-bit digital step attenuator (DSA) is presented. To further expand the operation bandwidth while keeping attenuation and error, modified π/T-type structures are introduced. In large unit, π-type structure adopted, which includes middle adjusting capacitance bypass compensating capacitance. Moreover, reduced T-type with compensation used in small units. The influence of introduced on various units analyzed. prove effectiveness extending bandwidth, a DSA broad...
Abstract A compact K/Ka‐Band dipole antenna element with ball grid array packaging is proposed. The divided into two parts, one a cuboid fabricated on FR4 printed circuit board, and the other grounded coplanar waveguide feed line motherboard. To minimize size of element, we use three‐dimensional structure to design element. patches are top layer bottom Plated through holes connect solder balls patches. Finally, mounted We designed, manufactured measured prototypes. details measurement...
Abstract A surface‐mount bowtie antenna element with a ball grid array (BGA) packaging is proposed. Compared to two‐dimensional end‐fire antenna, the proposed discrete three‐dimensional structure for obtaining broadside radiation pattern. The mounted on motherboard and fed by balun located at bottom layer of obtain wide impedance bandwidth. In addition, BGA provides cost‐effective solution integration devices same system board. performance prototype was verified measurements.