A5101434652- Mechanical Behavior of Composites
- Thin-Film Transistor Technologies
- Metal and Thin Film Mechanics
- Cellular and Composite Structures
- High-Velocity Impact and Material Behavior
- Structural Analysis of Composite Materials
- Ultrasonics and Acoustic Wave Propagation
- Traffic control and management
- GaN-based semiconductor devices and materials
- Silicon and Solar Cell Technologies
- Structural Health Monitoring Techniques
- Risk and Safety Analysis
- Infrastructure Maintenance and Monitoring
- Copper Interconnects and Reliability
- Advanced Surface Polishing Techniques
- Railway Systems and Energy Efficiency
- Silicon Nanostructures and Photoluminescence
BOE Technology Group (China)
2017
Abstract Honeycomb sandwich composites play an important role in the aviation structural components, especially aircraft radomes. Due to multiple production processes, failure of honeycomb composite usually occurs. This would affect working stability mechanical components made mainly materials. In present work, collapse radome was investigated. The observation and analysis results show that mode structure is compression instability failure. There are a lot pore defects some local bonding...
Abstract In the research on new generation of intelligent rail transit system, prevention train collision accidents is still a focus. Virtual coupling technology controls running speed and interval distance two or more trains cooperatively through Train-to-Train (T2T) direct communication technology. The aim to form coordinated logical system jointly complete control dispatching. this paper, virtual formation method based model predictive (MPC) framework proposed. From establishment...
Abstract The corrosion resistance of MoNb/AlNd/MoNb film during different sputter conditions was studied for G6 rotating target equipment. results show that with the increase power and thickness, top MoNb tends to form coarse columnar crystals, metal thin films, at first, increases then decreases thickness. As temperature increases, grains while is poor. result also release speed, becomes loose so it difficult play a protective role because its poor ability. Under same conditions, planar...
Comprehensive the above results, SiOxNy peeling on OC photoresist layer has a serious impact yield of products. This paper found that reason is process acid attacking surface, which resulted in 200‐800Å expansion zone. The characterization confirmed organic material was residue also shows substance vaporized after high temperature and dense film result difficult to release gas, furthmore bubble appearance. experiment results show by adding 230℃ anneal Metal etching Strip process, Peeling can...
The misty mura defect of OGM products seriously affects the product appearance yield. It was found that is caused by insufficient adhesion photoresist. In this paper, etch and photo process conditions were optimized verified. We extending metal oven time increasing temperature can significantly decrease Mura level. addition, adding anneal (140 °C, 15min) after oven, be completely alleviated without any other problems at same time.