A5016950225- Advanced MEMS and NEMS Technologies
- 3D IC and TSV technologies
- Advanced Surface Polishing Techniques
- Thin-Film Transistor Technologies
- Semiconductor Lasers and Optical Devices
- Nanofabrication and Lithography Techniques
- Photonic Crystals and Applications
- Electronic Packaging and Soldering Technologies
- Advanced Sensor and Energy Harvesting Materials
- Diamond and Carbon-based Materials Research
- Advanced Fiber Optic Sensors
- Modular Robots and Swarm Intelligence
- Analytical Chemistry and Sensors
- Microfluidic and Capillary Electrophoresis Applications
- Silicon Nanostructures and Photoluminescence
- Nanowire Synthesis and Applications
- Photonic and Optical Devices
State Key Laboratory of Transducer Technology
2024-2025
Shanghai Institute of Microsystem and Information Technology
2024-2025
Chinese Academy of Sciences
2024
University of Chinese Academy of Sciences
2024
Abstract Mechanical cross-axis coupling in biaxial scanning increases calibration workload and affects performance of tip-tilt (TT) micromirror. The integration gimbal inner-axis vertical comb-drive (VCD) actuator is a viable design for TT-decoupled key to developing such structure guaranteeing integrated VCD insulated from the electrically connected substrate while minimizing fabrication difficulty. For this purpose, paper introduces double-silicon-on-insulator (D-SOI) wafer that has two...
Temporary protective packaging is a critical enabler to the development of micromirror array (MMA) module. Herein, aimed at vertical integration optical-window-free through-silicon-via-based (TSV-based) MMA and its corresponding application specific integrated circuits (ASICs), this paper proposes temporary method that compatible with series back-end processing, including under-bumping-metallization (UBM), dicing, solder bumping flip-chip bonding. An ultraviolet-curing (UV-curing) strippable...
This paper, for the first time, introduces glass powders into through-silicon isolation, and fabricates a monolayered combs-angle-sensor-integrated biaxial gimbal with 250μm-thickness 1cm-diameter. Micron dry are filled through holes by silica-gel scraper, which is followed surface cleaning to wipe off residual reflow turn these incompact solidified liners respectively. These electrically insulate combs angle sensors from main body of while maintaining robust mechanical connections. applied...
The combination of double rotated serpentine springs (RSS) and vertical comb-drive is a suitbale solution for the development torsional micromirror with high fill factor, low fabrication difficulty good performance. However, alignment error between upper lower comb set caused by can induce force unexpected direction. And cross-axis coupled spring constants in (DRSSs) makes more susceptible to this error. Herein, order minimize deflection vertical-comb-driven micromirror, paper, first time,...