A5030739817- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Additive Manufacturing and 3D Printing Technologies
- Intermetallics and Advanced Alloy Properties
- Metallurgical and Alloy Processes
- Aluminum Alloys Composites Properties
- Advanced Welding Techniques Analysis
- Recycling and Waste Management Techniques
- Advanced Sensor and Energy Harvesting Materials
- Dielectric materials and actuators
- Aluminum Alloy Microstructure Properties
- Polymer Nanocomposites and Properties
- Ferroelectric and Piezoelectric Materials
- Radiopharmaceutical Chemistry and Applications
- Polymer crystallization and properties
- Manufacturing Process and Optimization
- Bone Tissue Engineering Materials
- biodegradable polymer synthesis and properties
- Electrodeposition and Electroless Coatings
- Material Properties and Processing
- Metal and Thin Film Mechanics
- Textile materials and evaluations
- Innovations in Concrete and Construction Materials
- Metallurgical Processes and Thermodynamics
- Injection Molding Process and Properties
Czech Technical University in Prague
2016-2024
University of Pardubice
2020
Martin Luther University Halle-Wittenberg
2011-2013
Luther University
2011
University of Chemistry and Technology, Prague
2006
Textile Research Institute
1988
State Institute for Drug Control
1971
3D-printed electronics belong to new approaches how build a complex object with multiple desired functions. For that purpose, materials specific electric properties are needed: conductors, insulators, magnetics, or dielectrics high permittivity. However, such not commonly available in the form of filament for fused deposition modelling since development is still ongoing. This paper describes electrical PETG-ceramic composite filaments. PETG (polyethylene terephthalate glycol-modified) was...
Purpose The purpose of this paper is to increase the reliability manufactured electronics and reveal significant factors. experiments were focused especially on influence reflow oven parameters presented by a heating factor. Design/methodology/approach shear strength surface mount device (SMD) resistors their joint resistance analyzed. assembled with two Sn/Ag/Cu-based one Bi-based solder pastes, analysis was done for several values factor before after isothermal aging. measurement thickness...
Fused Deposition Modelling (FDM) is one of the most common methods 3D printing used in many fields industry, especially development departments. Since plastics are fundamental materials for electronics aim this work to examine dielectric properties objects printed from such materials. This work's contribution evaluation dependency on quality and use plastic components electronics.
Biodegradables are a promising path for the future of electronics in greener mindset. The review study focuses on their applications and past current research results. paper also investigates application nanomaterials as fillers to control or increase physical (electrical, mechanical, thermal) properties biodegradable biopolymers. These biodegradables nanocomposites already effectively used prototypes advanced areas with demanding requirements, such flexible wearable electronics, implantable...
Abstract Voids inside solder joints are empty spaces negatively affecting the mechanical, thermal, and electrical properties of joint. This article deals with this problematics using two novel approaches to reduce voids’ occurrence. The first approach is change roughness mask influence flux spreading around pad. second deposition same volume paste pads a modified, thicker stencil smaller apertures. experiments were performed for pastes containing SAC305 alloy types fluxes (ROL0/ROL1). Solder...
Sn–Bi alloys are desirable candidates for soldering components on printed circuit boards (PCBs) because of their low melting point and reduced cost. While certain tin–bismuth solders well characterized many new in this family have been developed which need proper characterization. The following study looks at the behavior four different alloys—traditional 42Sn58Bi 42Sn57Bi1Ag two alloys—in solder paste during reflow process. Each alloy was processed using profiles that had varying times...
This work presented an FEM (finite element method) mathematical model that describes the temperature distribution in different parts of a 3D printer based on additive manufacturing process using filament extrusion during its operation. Variation properties also originate from inconsistent choices parameters employed by individual manufacturers. Therefore, calculates changes (and resulting print) FFF (fused fabrication) was deemed useful, as it can estimate otherwise immeasurable (such...
Flux contained in solder paste significantly affects the process of joint creation during reflow soldering, including an intermetallic layer (IML). This work investigates dependence thickness on ROL0/ROL1 flux classification, glossy or matt mask, and OSP/HASL/ENIG soldering pad surface finish. Two original SAC305 pastes differing only used were chosen for experiment. The influence multiple reflows was also observed. thicknesses obtained by image analysis micro-section images. type proved to...
This work aimed to evaluate a new approach electronics manufacturing using recycled and recyclable 3D-printed polymers as an insulation substrate printing of conductive silver ink pattern. Furthermore, connection the board is realized via embedding components into ink's overprints. The first results from measurements showed that this type comparable adhesive joints regarding contact resistance. Also, behavior during accelerated aging by thermal shocks relatively acceptable reliability point...
Electrochemical migration (ECM) on the surface of printed circuit boards (PCBs) continues to pose a significant reliability risk in electronics. Nevertheless, existing literature lacks studies that address solder mask and pad design aspects context ECM. Therefore, objective this study was assess impact type with varying roughness susceptibility ECM using water drop test thermal humidity bias test. Hot air leveling-coated PCBs were tested. Furthermore, tests conducted applied no-clean paste...
The aim of this work was to evaluate the use FFF (Fused Filament Fabrication) technology in high and medium voltage applications. research is based on previous work, where dependence dielectric strength 3D printed objects printing resolution (the thickness one layer) examined. Four polymer materials designated for were chosen experiments - ABS (acrylonitrile butadiene styrene), PET-G (polyethylene terephthalate glycol modified), ASA (acrilonitrile styren acrylate) PP (polypropylene)....
A rapid method based on activation energy values for the lifetime assessment of PP films used as dielectrics capacitors is proposed. The determined from a nonisothermal measurement made by differential scanning calorimetry and an aging test at single elevated temperature. use onset temperature exothermal peak proposed to evaluate degradation film. Four types film were thermally aged 100 °C different times. For each time, capacitance was measured frequencies. According standards, two...
This work aimed to investigate the susceptibility of novel nanocomposite solder paste electrochemical migration (ECM). Bismuth-tin was filled with 0.1 wt.% $\mathrm{T}\mathrm{i}\mathrm{O}_{2}$ nanoparticles. The behavior evaluated using a water drop (WD) test. High-purity and 10 VDC bias voltage were applied. experiments performed on two types samples differing in surface finish conductive pattern- bare copper without protection applied galvanic gold finish. results revealed trend when mean...