A5048972983- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Physics of Superconductivity and Magnetism
- Adhesion, Friction, and Surface Interactions
- 3D IC and TSV technologies
- Advanced Welding Techniques Analysis
- Metal and Thin Film Mechanics
- Copper Interconnects and Reliability
- GaN-based semiconductor devices and materials
- High Temperature Alloys and Creep
- Metal Forming Simulation Techniques
- Mechanical stress and fatigue analysis
- ZnO doping and properties
- Electrical Contact Performance and Analysis
- Nanowire Synthesis and Applications
- Advanced Memory and Neural Computing
- Advancements in Semiconductor Devices and Circuit Design
- Superconducting Materials and Applications
- Acoustic Wave Phenomena Research
- Semiconductor materials and interfaces
- Magnetic properties of thin films
- Magnetic and transport properties of perovskites and related materials
- Aluminum Alloys Composites Properties
- Advanced Condensed Matter Physics
- Advanced materials and composites
Showa Corporation
2002-2023
Osaka University
2010-2020
Kawasaki Heavy Industries (Japan)
2018-2020
Graduate School USA
2020
Hokkaido University
2011-2017
Shanghai Shipbuilding Technology Research Institute
2000-2015
Nihon University
2015
College of Industrial Technology
2015
Kyushu University
2014
Daido University
2013
Recent void shrinkage models are reviewed and refined. The role of surface selfdiffusion is discussed for modelling by along the bond interface. refinement existing makes it possible to discuss effect crushing power law creep, validity combining diffusion applicability models. discrepancies between various demonstrated reference stress dependence rate (log–log plots). due creep surrounding matrix highly dependent on degree bulk deformation, i.e. severity constraint. combined therefore...
The purpose of the present study is to understand interfacial deformation between pad and wire effect thickness, hardness, tool shape on deformation. relationship bondability (surface exposure produce clean surface) summarized, because largely affected by A simple model bonding proposed for numerical analysis. based finite element method rate sensitive materials applicable very large processes. simulation made it possible visualize contacting process which occurs several milli-seconds. It...
Interfacial microstructures between thick Al wires and pads formed by ultrasonic bonding were analysed to investigate the behaviour of bond preventing phases. The wire substrate form direct interface in central region area, whereas surfaces them peripheral are covered amorphous 2 O 3 layer. layer is chipped off application vibration forms a number spherical particles intervening substrate. consist matrix lamellae Al. grow accumulating on contact, moving outward area. area expands through...
A process for fabricating thin Si nanowires is proposed which can reduce the parasitic series resistance of nanowire. The includes electron cyclotron resonance plasma deposition a SiO2 film through openings patterned resist film. Since thickness decreases as opening narrows, be made thinnest in nanowire region. Therefore, during following reactive-ion etching, this region removed first and layer then selectively etched. fabricated shows quantized conductance at temperatures high 200 K.
The deformation behavior of thick Al wires and the expansion bond area during ultrasonic wedge bonding to Al–Si, Si SiO2 substrates were measured simultaneously in detail with a high-speed measuring system. wire by application force is completed immediately. restarts vibration. induced applying consists only elastic component, whereas that vibration plastic component. not work-hardened adhered expands direction perpendicular evolution show an intimate correlation each other.
This work aims to investigate the ultrasonic weldability of Al ribbon (width 2.0 mm × thickness 0.2 mm) Cu sheet (thickness 1.0 using a WC tool (sonotrode tip size) and understand joint formation process by examining microstructures fracture behavior for different bonding times. For selected conditions 20 W power, 30 N clamping force, 0.1–0.8 s time, it was found that sound lap joints could be readily obtained when time reached exceeded 0.4 s, which fractured within ribbon, but not along...
In this paper, the enhancement of bandwidth for beam squint reduction in leaky-wave antennas has been numerically and experimentally demonstrated based on pseudo-traveling-wave resonance by using nonreciprocal composite right-/left-handed metamaterial lines with almost dispersion-free phase-shifting nonreciprocities. We consider two different types metamaterials governed edge-guided mode propagation normally magnetized ferrite microstrip operating at frequencies far above or below magnetic...
Metalorganic deposition (MOD) using trifluoroacetates is considered to be one of the most promising methods for coated conductors, because it enables us obtain very high J/sub c/ films with low-cost facilities. We have optimized various processing conditions in this method and successfully obtained critical current density (J/sub c/) 4.1 MA/cm/sup 2/ (77 K, 0 T) YBa/sub 2/Cu/sub 3/O/sub 7-x/ (YBCO) film 1800 /spl Aring/ thickness on CeO/sub buffered YSZ single crystal, which was fired at...
We fabricated ramp-edge junctions with an interface-modified barrier on YBa/sub 2/Cu/sub 3/O/sub y/ (YBCO) liquid phase epitaxy (LPE) thick films. The LPE films were used as ground-planes. For the insulating layer between ground plane and base electrode, a SrTiO/sub 3/ (STO)/(LaAlO/sub 3/)/sub 0.3/-(SrAl/sub 0.5/Ta/sub 0.5/O/sub 0.7/ (LSAT)/STO multilayer dielectric constant of approximately 32 was employed. La-doped (La-YBCO) YbBa/sub (La-YbBCO) counter electrodes, respectively. exhibited...
Wire deformation processes during thermocompression bonding without ultrasonic vibration are simulated by a numerical model which is based on the finite-element (FE) technique. The growth process of interfacial contact between wire surface and lead frame also analyzed. If interface fixed, then lateral expands simultaneously with folding to frame, producing perimeter bond. On other hand, if can slide, center area largely does not extend, It follows that tends be but slide when bond produced,...
The plastic deformation, thermal behaviour and interfacial state during ultrasonic bonding of Al ribbon with substrate were analyzed based on numerical simulations. simulations carried out by finite difference element methods. change bond interface temperature the time t was simulated. It is suggested that frictional between does not only affect rising but also stress situation deformation behaviour, i.e., slip behaviours influence each other. found partial constraint (frictional slip) at...
With technological advance of the REBaCuO (RE: Rare Earth elements, REBCO) coated conductors (CC), development superconducting applications for its practical use has been carried out recently in various fields. In addition, improvement magnetic properties REBCO CCs makes devices feasible liquid nitrogen. The higher Ic values are required high fields by viewpoint requirement conjunction with CCs. Therefore is one most important problems to apply them a device (e.g., NMR, MRI, others). this...
The superconducting cable for an electric propulsion system of airplane was developed using coated conductors (CCs). To lighten the cable-weight, stacked without center core were employed, leading to reduction diameter and effectively reducing weight. demonstrated reasonable high <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">I<sub>c</sub></i> values DC current. Additionally, revised loading AC Gaps in insulators craft-papers spacers added...
Y <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">x</sub> Gd xmlns:xlink="http://www.w3.org/1999/xlink">(1 - x)</sub> Ba xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> Cu xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> O xmlns:xlink="http://www.w3.org/1999/xlink">y</sub> coated conductors (CCs) with artificial pinning centers (APCs) were fabricated by the trifluoroacetates-metal organic deposition method using a batch heat-treatment...