Yinzhou Chen

ORCID: 0000-0002-5401-3398
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About
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Research Areas
  • Microwave Engineering and Waveguides
  • Electromagnetic Compatibility and Noise Suppression
  • Advanced Antenna and Metasurface Technologies
  • Radio Frequency Integrated Circuit Design
  • Photonic and Optical Devices

University of Electronic Science and Technology of China
2018

This paper presents a novel compact low loss switchable bandpass filter (BPF) with self-packaging by using substrate-integrated suspended line (SISL) technology. The proposed self-packaged BPFs are designed two kinds of controllable resonators, which smaller than quarter-wavelength resonator and the commercial p-i-n diodes used as control elements. method is investigated an equivalent circuit model. center frequency SISL BPF at 1 GHz 56% fractional bandwidth. measurement results show that...

10.1109/tie.2018.2874576 article EN IEEE Transactions on Industrial Electronics 2018-10-12

In this letter, a novel Ka-band transition from substrate integrated suspended line (SISL) to rectangular waveguide (RWG) is proposed. order broaden the bandwidth, T-shaped patch adopted. A back-to-back prototype has been designed and fabricated. From 24.6 38.5 GHz, i.e., fractional bandwidth of 44%, measured return loss better than 12 dB insertion less 0.34 with minimum 0.11 dB. Fabricated by using standard printed circuit board process, proposed SISL-to-RWG advantages low manufacturing...

10.1109/lmwc.2018.2849203 article EN IEEE Microwave and Wireless Components Letters 2018-07-18

This paper proposes a novel V-band transition from substrate integrated suspended line (SISL) to rectangular waveguide (RWG). The is realized by inserting probe orthogonal the E-plane of air-filled (AF-SIW), and then convert AF-SIW RWG. air cavities dimensions both SISL are optimized broaden bandwidth suppressing high-order modes. To further reduce transmission loss, supporting hollowed as much possible while maintaining mechanical strength. Simulated results show broad 43.9% 48 GHz 75 low...

10.1109/mwsym.2018.8439141 article EN 2022 IEEE/MTT-S International Microwave Symposium - IMS 2022 2018-06-01
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