A5102866173- Ion-surface interactions and analysis
- Electron and X-Ray Spectroscopy Techniques
- Semiconductor materials and devices
- Metal and Thin Film Mechanics
- Integrated Circuits and Semiconductor Failure Analysis
- Microstructure and mechanical properties
- Nuclear Physics and Applications
- Microstructure and Mechanical Properties of Steels
- Diamond and Carbon-based Materials Research
- Advanced Materials Characterization Techniques
- Semiconductor materials and interfaces
- nanoparticles nucleation surface interactions
- Metallurgical Processes and Thermodynamics
- Surface and Thin Film Phenomena
- Corrosion Behavior and Inhibition
- Hydrogen embrittlement and corrosion behaviors in metals
- X-ray Spectroscopy and Fluorescence Analysis
- Aluminum Alloy Microstructure Properties
- High Temperature Alloys and Creep
- Intermetallics and Advanced Alloy Properties
- Copper Interconnects and Reliability
- Advanced Surface Polishing Techniques
- Metal Alloys Wear and Properties
- High-Temperature Coating Behaviors
- Silicon and Solar Cell Technologies
Max Planck Institute for Intelligent Systems
2013-2023
Shantou University
2018-2023
GSI Helmholtz Centre for Heavy Ion Research
2011-2017
Max Planck Society
2004-2015
Max Planck Institute for Solid State Research
2002-2011
Oak Ridge National Laboratory
2011
X-ray Instrumentation Associates (United States)
2011
University of Tennessee at Knoxville
2011
Friedrich-Alexander-Universität Erlangen-Nürnberg
2010
Institute of Metal Research
1997-2008
Abstract Physical and chemical properties of solid materials are strongly. influenced by the composition internal interfaces, One crucial parameters affecting interfacial chemistry is atomic structure interface. Due to its importance. a considerable amount work was done elucidate relationship between interfaces. This article reviews present understanding an important fundamental part this relationship, namely, structural aspects grain boundary segregation. After brief outline geometry....
Beginning with some introductory remarks about aims and scope, historical background present state of the art, a brief survey technique sputter depth profiling is given. The fundamental principles ion/solid interactions during sputtering resulting changes in surface composition topography as well their influence on conversion time to sputtered are illustrated by examples. Together specific analysis method employed, such secondary ion mass spectrometry or Auger electron spectroscopy, these...
Abstract Two series of experiments on well‐characterized systems were performed to examine the probing depth soft x‐ray absorption spectroscopy (XAS) measured in total‐electron‐yield (TEY) mode. First we Ni 2 p 3/2 spectra Ni(100) covered with Tb as a function overlayer thickness. Secondly recorded O 1s Ta 5 films produced by controlled anodic oxidatio foils oxide The mean (MPD) was found be much shorter than previously assumed (for 1s, only 1.9 nm). relative importance those cascade...
(Ti,Al)N layers were prepared by reactive dc and radio‐frequency (rf) magnetron sputtering onto polished flat high speed steel (HSS) surfaces. The rectangular samples mounted on a special sample holder providing temperature gradient in the range of 500 °C to room along length sample. deposited at various N2 Ar pressures. target was Ti–50 at. % Al alloy. film morphology composition observed scanning electron microscopy (SEM) Auger spectroscopy (AES), respectively, correlated mechanical...
Abstract High‐resolution AES depth profiling of a GaAs/AlAs superlattice structure with 8.8/9.9 nm single‐layer thickness by sputtering 1.0 keV and 0.6 Ar + ions at an incidence angle 80° resulted in optimum resolution values for Δ z = 2.0 the low‐energy Al (68 eV) intensity profile high‐energy (1396 profile. A simple model description influence atomic mixing ( w ), surface roughness (σ) Auger electron escape (λ) was applied to calculate measured profiles. An excellent fit is obtained...
A theoretical model is presented which describes time dependent charging phenomena in insulators irradiated by an electron beam. This so called dynamic double layer (DDM) based on the simplified assumption of charge development two axi-symmetric cylindrical volumes at insulator surface and a certain depth below surface, respectively. Important physical interaction mechanisms like electrostatic between potential emitted secondary electrons, transport characteristics internally generated...
The dependence of technically important properties wear resistant nitride coatings on chemical composition requires advanced methods compositional analysis to establish optimized fabrication processes. High spatial resolution and bonding specificity are provided by such techniques as Auger electron spectroscopy (AES) in the form scanning microscopy (SAM) x‐ray photoelectron (XPS). A survey is given for study reactively sputter deposited Ti–N, Hf–N, Ti–Al–N high‐speed steel substrates using...
Abstract This review considers the well established and most frequently applied surface analysis techniques: AES, XPS, ISS SIMS in a comparative manner, confronting fundamental principles present instrumental performance with requests of scientist. The primary goal is determination elemental composition outermost atomic layer solid. In addition, characterization binding states, homogeneity structural details will often be required. Whereas information gathered generally contains also...