This paper describes the design and experimental evaluation of a silicon micro-machined resonant accelerometer (SMRA). type works on principle that proof mass under acceleration applies force to two double-ended tuning fork (DETF) resonators, frequency output DETFs exhibits differential shift. The dies an SMRA are fabricated using silicon-on-insulator (SOI) processing wafer-level vacuum packaging. research aims high-sensitivity because high sensitivity allows for signal be easily demodulated...

A phase noise model is proposed for silicon oscillating accelerometers (SOAs), which can be used to estimate the frequency from accelerometer. This treats SOA as a time-varying system and employs unified approach decompose physical into amplitude modulation paths predict in SOA. Furthermore, also reveals relationship between mechanical displacement design specifications, serve guideline performance optimization. The soundness of this has been validated against both time-domain numerical...

Bias value and scale factor (SF) are two main performance indexes of silicon oscillating accelerometer(SOA). A deep research on that how temperature influence the SOA by changing effective stiffness resonators, is made so as to reduce sensitivity it in this paper. There a wide difference between testing theoretic parameters bias SF through experiment SOA, both which have obvious sensitivity. Then mechanism Young modulus bond stress deduced theoretically simulated. The resonant frequency...

In order to improve the bias stabilities in different temperature for silicon resonant accelerometer (SRA), a measurement method, which measure Temperature package cavity, was proposed based on chip integrated resonator. Firstly, frequency-temperature characteristics of resonators SRA is analyzed. Afterwards, heat transfer model resonator established, and error Then, hysteresis errors two methods external sensor are contrasted. At last, first-order linear compensation established after...

Vibrating beam accelerometers (VBAs) have significant application potential in navigation guidance. This article proposed a novel high-precision frequency readout method and integrated CMOS circuit implementation for VBAs, technologies, including sigma-delta modulation, up-sample split, data synchronization, nonlinearity correction, are employed the method, which is analyzed detail this article. The offers advantages of low quantization noise, enough range, fixed output rate, high linearity....

In this paper, a novel folded silicon resonant accelerometer is proposed. The proposed structure able to release the stress arising from mismatch of thermal expansion between and glass substrate compensate variation natural frequency with temperature. analysis has shown that both bias scale factor stability can be improved structure. concept verified by simulation results show temperature dependence common-mode output greatly reduced.

This paper describes a silicon resonant accelerometer implemented in SOI technology. With fully differential design and micro-lever system, the achieves sensitivity of 82Hz/g with nominal frequency 30 kHz. The MEMS device is placed ceramic vacuum package, so gets quality factor nearly 1e5. Readout circuit also introduced which includes two oscillators double channel measure circuit. A novel capacitance sense employing high carrier diodes ring used to avoid driving signal feed through. And...

Quality factor tuning is attractive in degenerate (DE) and nondegenerate (NDE) MEMS gyros for drift suppression or shock vibration immunity. This paper proposes three resistance-based Q-factor approaches without dedicated electrodes NDE gyro. The inherent sensing capacitance utilized as a Q-tuning mechanism low C-SWaP (cost, size, weight, power). Routing traces on ASIC chips well the input impedance of charge-sensitive-amplifier (CSA) are damping sources, respectively. theoretical...

Canceling and minimizing quadrature error is the key to improve performance of MEMS gyroscopes. This paper addresses how design suspension springs decrease which induced with manufacture asymmetric. According stiffness matrix spring, relationship among error, terms width mismatch was put forward. The off-diagonal term coupled between driven sensing directions has larger effect on than other system matrix. principle gyroscope forward, suggest that U-spring, serpentine spring folded-flexure...

A micromechanical silicon resonant accelerometer (SRA) with micro leverage mechanism amplifying the inertial force is presented. SRA consists of a pair double-ended tuning forks (DETF), proof mass and lever mechanism. Firstly, relation between frequency shift applied DETF modeled classical Bernoulli-Euler beams theory then simulated by finite element analysis (FEA). The conclusion that analytical results are very close to simulation results. Secondly presented, equations for calculating...

The study of nonlinear oscillation characteristics MEMS resonator is important, which affects the performance and other devices. studied in this paper electrostatic composed DETF combs. linear spring constant are derived with energy method, dynamics model established including force, damping constant. perturbation analysis multi-scale method adapted to analyze model, relationship between frequency amplitude established. numerical simulation results indicate that width ratio increased can...

This paper reports a method of measuring the on-chip thermal stress for silicon resonant accelerometer (SRA). could be used to evaluate stress-temperature characteristic SRA, and that would help focus problems exist in SRA. Clamp-clamp Double Ended Turning Fork resonator is as basic measurement unit. Analysis accuracy noise given. An implementation this on detail described. The Experiment shows precisely measured, test result more clear view state individual

MEMS gyros have sensitivity to acceleration due asymmetry of their mechanical designs and/or micromachining inaccuracies. This paper describes a tactical grade gyro with superior rejection. The structure has two proof masses and 12 modes. effects low-order modes on the were studied by theory analysis vibration experiments. reordered new anchor beam optimized structural parameters. was fabricated SOI technology packaged wafer level vacuum packaging. die ASIC stacked assembly in ceramic...

For highly accurate micro-electromechanical systems (MEMS) gyroscopes, comb gap errors influence mechanical coupling and limit performance. In this study, an in situ method was proposed to identify the gaps of drive combs, drive-sense sense combs MEMS gyroscopes that can be applied at wafer level. Negative electrostatic stiffness considered model construction mode <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math...

In this paper, we present work on the design, fabrication, readout technique and vacuum packaging of z-axis gyroscopes. A package that houses gyroscope its control electronics has bee built tested. The entire including is approximately phi42 times 24mm in dimensions. This packaged a scale factor 19.8mV/deg/sec with linear error less than 0.7% for range plusmn200deg/s, bias stability 20deg/hr

In this paper we present the recent improvement of a silicon micro-mechanical vibrating beam accelerometer (SVBA) which combine advantage low cost MEMS fabrication technology, small size vacuum wafer level package, noise power application-specific integrated oscillation circuit and digital frequency demodulation technology. Under room temperature, it has achieved bias instability 1µg (Allan variance), stability 10µg (1σ, one hour), resolution 13µg (direct test result, including all drift...

This paper describes a low temperature drift Z-axis silicon gyroscope with sensitivity interface circuit. The gyroscope's is optimized from two aspects: MEMS structure and its circuit design. Firstly, the sources of zero rate output(ZRO) are analyzed, then we point out that improving stability demodulation phase can reduce thermal effectively. A careful designed wafer level package introduced novel proposed to improve stability. Then newly tested, bandwidth above 100Hz full scale ±300°/s. In...

This paper gives a detail description of silicon vibration beam accelerometer which was fabricated by SOI technology and encapsulated in wafer level vacuum package. The package advantage small size low cost, but also produce additional residual stresses that increased the temperature coefficient beams. To solve this problem, sensing structure redesigned reduce from 50Hz/°C to 10Hz/°C. Moreover, with carefully assembly, control measure technology, system achieved reliable performance....

This article presents a self-temperature compensation method used for MEMS gyroscopes. Drive frequency of gyroscope is employed as temperature source, so that no external sensor needed. When starts to work, the circuit generates heat, providing input. Meanwhile, only 120 seconds needed calculate parameters without pre-calibration. Therefore, efficiency experiment and study can be improved by this method.

This paper describes a compact and low-power oscillating circuit for silicon accelerometer (SOA). The influence of oscillation amplitude control strategy on performance is analyzed. A rail to comparator replaces the traditional AGC (automatic gain control) control. It makes more compact, lower power consumption, reduces flicker noise introduced by greatly. experiment shows bias stability 13.3µg from 22.9µg, bias-instability 4.3µg 9.3µg, system consumption reduced 200mW 1.2W.

This study investigated the application of energy-consume concept on a silicon resonant accelerometer (SRA) to address design issues. Constrained by micro-fabrication technology, structure SRA is formed resonators, micro-lever mechanisms, proof mass and multi flexures. They are referred as compliant mechanisms. Based energy conservation law, an theoretical model sensor has been built structural parameters were obtained using this novel method. Sensitivity after optimization increased from...