A5005969009- Thermal properties of materials
- Graphene research and applications
- Aluminum Alloys Composites Properties
- Electronic Packaging and Soldering Technologies
- Thermal Radiation and Cooling Technologies
- Advanced materials and composites
- Heat Transfer and Optimization
- Nanofluid Flow and Heat Transfer
- Advanced ceramic materials synthesis
- Powder Metallurgy Techniques and Materials
- Solar-Powered Water Purification Methods
- Carbon Nanotubes in Composites
- Graphene and Nanomaterials Applications
- Metal Forming Simulation Techniques
- Phase Change Materials Research
- Injection Molding Process and Properties
- MXene and MAX Phase Materials
- Electrohydrodynamics and Fluid Dynamics
- Nanomaterials and Printing Technologies
- Microstructure and Mechanical Properties of Steels
- Lubricants and Their Additives
- Heat and Mass Transfer in Porous Media
- 3D IC and TSV technologies
- Metal and Thin Film Mechanics
- Advancements in Battery Materials
Chalmers University of Technology
2018-2022
Nanosc (Sweden)
2020
Smart High Tech (Sweden)
2018
Almost 15 years have gone ever since the discovery of graphene as a single atom layer. Numerous papers been published to demonstrate its high electron mobility, excellent thermal and mechanical well optical properties. We recently seen more applications towards using in commercial products. This paper is an attempt review summarize current status research properties other 2D based materials including manufacturing characterization techniques their applications, especially electronics power...
Abstract With increasing demands of high-performance and functionality, electronics devices generate a great amount heat. Thus, efficient heat dissipation is crucially needed. Owing to its extremely good thermal conductivity, graphene an interesting candidate for this purpose. In paper, two-step temperature-annealing process fabricate ultrahigh conductive assembled films (GFs) proposed. The conductivity the obtained GFs was as high 3826 ± 47 W m −1 K . Extending time high-temperature...
During the last decade, graphene foam emerged as a promising high porosity 3-dimensional (3D) structure for various applications. More specifically, it has attracted significant interest solution thermal management in electronics. In this study, we investigate possibility to use such porous materials heat sink and container phase change material (PCM). Graphene (GF) was produced using chemical vapor deposition (CVD) process attached test chip sintered silver nanoparticles (Ag NPs). The...
Purpose This study aims to develop a bimodal nano-silver paste with improved mechanical property and reliability. Silicon carbide (SiC) particles coated Ag were introduced in improve bonding strength between SiC enhance high-temperature stability of paste. The effect sintering parameters such as temperature, time the proportion on reliability sintered structure investigated. Design/methodology/approach Sandwich structures consist dummy chips copper substrates nickel silver coating bonded by...
Graphene, the typical two-dimensional sp2 hybridized carbon allotrope, is widely used as a filler for improving mechanical performance of polymers. However, its superhydrophobic surface makes it big challenge to obtain stable graphene dispersions, especially in water-borne systems. On contrary, oxide (GO) shows excellent dispersibility water, but strong oxidants and acids destroy structure degrade properties. This largely limits application coatings. In this work, from exfoliation was...
Abstract Poor bonding strength between nanomaterials and cement composites inevitably lead to the failure of reinforcement. Herein, a novel functionalization method for fabrication functionalized graphene oxide (FGO), which is capable forming highly reliable covalent bonds with hydration products, therefore, suitable use as an efficient reinforcing agent composites, discussed. The aggregates was improved more than 21 times reinforcement FGO. fabricated FGO also demonstrated many important...
Abstract Functional fillers, such as Ag, are commonly employed for effectively improving the thermal or electrical conductivity in polymer composites. However, a disadvantage of strategy is that cost and performance cannot be balanced simultaneously. Therefore, drive to find material with both efficient fabrication process excellent attracts intense research interest. In this work, inspired by core–shell structure, we developed facile manufacturing method prepare graphene‐encapsulated Cu...
Graphene oxide (GO) and nitrogen-doped graphene (NG) coated copper nanoparticles (NPs) have been developed in this work investigated as nanofiller for water Heat Transfer Fluids (HTFs). The morphology composition of the coating were characterized to confirm presence functional groups nitrogendoping coating. Different fractions two types NPs between 0.1 10 wt.% dispersed water. thermal conductivity dispersions was evaluated at temperatures 20 50 °C. A positive correlation HTFs fraction...
High sinter density is desired in powder metallurgy components as the requirement for performance increasing day‐by‐day. One of promising ways to achieve improved densification during sintering through addition nanopowder conventional micrometer sized metal powder. It well known that surface chemistry has a decisive effect on and consequently properties produced. Extensive research hence been conducted elucidate its influence used metallurgy. Nanopowder, owing high volume ratio, can...
Abstract A promising method of improving the densification powder metallurgical steel components is to blend nanopowder with otherwise typically used micrometre-sized powder. The higher surface-to-volume ratio hypothesized accelerate sintering process and increase inter-particle contact area between particles. This supposed enhance material transport improve densification. In present investigation, water-atomized iron (− 45 μ m) was mixed separately pure low-carbon nanopowder, each at a 95 5...
Nano-silver paste with low sintering temperature and high operation was introduced to the application of bonding materials for GaN SiC devices. Thermal properties are critical issues die attach due heat dissipation requirements power The influence process parameters nano-silver on thermal investigated. conductivity sintered increased increase time because dense structure long time. To improve property, Ag coated micro-SiC particles were used as an alternative partly replace pure nano-Ag...
Mono- to few-layer graphene materials are successfully synthesized multiple times using Cu-Ni alloy as a catalyst after single-chemical vapor deposition (CVD) process. The synthesis is realized by extracting carbon source pre-dissolved in the substrate. Firstly, grown CVD method on substrates. Secondly, same Cu-Nicatalyst foils annealed, absence of any external precursor, grow atoms during This annealing process repeated synthesize until exhausted foils. After growth and each process,...
The integration of metallic nanoparticlcs (NPs) in nanofluids was found to enhance the thermal properties mixture and affect rheological base liquid. However, due their size electrochemical properties, added have a limited contribution transport stability hinders further development such an approach management. We investigated this work effect presence graphene as coating layer on copper nanoparticles dispersed water water-based coated nanofluid. Electronics microscopy deployed investigate...
Copper is generally considered as an electronic packaging material due to its good electrical, thermal properties and relatively low cost. However, copper needs high processing temperature, which negatively affects the electronics reliability. In this paper, silver nanoparticles sintering evaluated for propose decrease temperature of copper. Different fractions were mixed with 10μm Cu powder sintered at temperatures 250°C, 300°C, 400°C 500°C, under pressures 4MPa 8MPa, a pressure 100MPa...
Thermally conductive materials with electrically insulating properties have been extensively investigated for thermal management of electronic devices. The combined high conductivity, structural stability, corrosion resistance and electric resistivity make hexagonal boron nitride (h-BN) a promising candidate this purpose. Theoretical studies revealed that h-BN has in-plane conductivity up to 400-800 W m <sup xmlns:mml="http://www.w3.org/1998/Math/MathML"...
Abstract Thermally conductive materials with electrically insulating properties have been extensively investigated for thermal management of electronic devices. The combined high conductivity, structural stability, corrosion resistance and electric resistivity make hexagonal boron nitride (h-BN) a promising candidate this purpose. Theoretical studies revealed that h-BN has in-plane conductivity up to 400 - 800 W m−1 K−1 at room temperature. However, it is still big challenge achieve...
The current development of the electronics system requires capabilities beyond conventional heat transfer approaches. New solutions based on advanced materials are being developed to tackle challenges in systems and nanoscale 2D such as graphene at centre effort exploit intrinsic properties carbon nanomaterials. In this work, we introduce a new concept graphene-coated copper nanoparticles (G-CuNPs) explore their multifunctional potential applications metallic paste used electronics. powder...