A5085663393- Photonic and Optical Devices
- Advanced Photonic Communication Systems
- Advanced Fiber Optic Sensors
- Semiconductor Lasers and Optical Devices
- Optical Network Technologies
- Mechanical and Optical Resonators
- Advanced Fiber Laser Technologies
National Technical University of Athens
2018-2023
Institute of Communication and Computer Systems
2021-2023
We present an extensive analysis of optical Blass-matrix architecture as a beamforming network with potential for multibeam operation in wireless systems. Its design relies on the use phase shifters and Mach-Zehnder Interferometers (MZIs) inside $M\times N$ matrix, enables generation M beams by N-element antenna arrays. start our from signal amplitude modulation discrete microwave tones, confirm possibility to translate its shifts matrix into equivalent domain. show this is possible when...
We propose a novel concept for the implementation of 2-dimensional (2D) optical phased arrays (OPAs) with end-fire waveguides as antenna elements (AEs), and we present its theoretical model experimental proof. The is based on use 3-dimensional (3D) photonic integrated circuits (PICs) multiple waveguiding layers PolyBoard platform. In their simplest form, 3D PICs comprise AEs at different layers, vertical lateral couplers distribution light among AEs, phase shifters execution 2D beam scanning...
We propose an optical beamforming network (OBFN) for multi-beam operation and continuous selection of the beam angles. The OBFN is based on use wavelength-division multiplexing elements generation manipulation signals that correspond to different beams antenna (AEs), delay lines introduction tunable time delays these signals. analyze operating principle proposed in downlink uplink directions a wireless system, we experimentally demonstrate its proof concept direction up photodetection stage,...
We propose and experimentally demonstrate a photonic integrated circuit (PIC) that operates as an optical equalizer (OE) with multi-rate multi-channel capability. The OE has the structure of 3-tap direct form finite impulse response (FIR) filter is based on use micro-ring resonators (MRRs) for tuning its delay lines. PIC fabricated TriPleX platform 17 reconfigurable elements in total including nine MRRs, five couplers three standalone phase shifters. Using this on-off keying system bandwidth...
We present simulation and characterization results for the design of a two-port grating coupler with achievable coupling efficiency up to 54% together three different multimode interference (MMI) structures, 1x2, 1x4 1x8 insertion loss output power imbalance as low 0.2 dB 0.05 dB, respectively. Both MMI photonic structures were designed on TriPleX platform. Finally, we these part novel, photonic, ultrasensitive biosensor.
Abstract We demonstrate a compact heterodyne Laser Doppler Vibrometer (LDV) based on the realization of optical frequency shift in silicon nitride photonic integration platform (TriPleX). theoretically study, and experimentally evaluate two different integrated shifters (OFSs), utilizing serrodyne single-sideband (SSB) modulation. Both OFSs employ stress-optic modulators (SOMs) non-resonant piezoelectrical actuation lead zirconate titanate (PZT) thin-films, deposited top waveguides with...
We propose a novel concept for the implementation of 2-dimensional (2D) optical phased arrays (OPAs) with end-fire waveguides as antenna elements (AEs), and we present its theoretical model experimental proof. The is based on use 3-dimensional (3D) photonic integrated circuits (PICs) multiple waveguiding layers PolyBoard platform. In their simplest form, 3D PICs comprise AEs at different layers, vertical lateral couplers distribution light among AEs, phase shifters execution 2D beam scanning...
We propose a novel concept for the implementation of 2-dimensional (2D) optical phased arrays (OPAs) with end-fire waveguides as antenna elements (AEs), and we present its theoretical model experimental proof. The is based on use 3-dimensional (3D) photonic integrated circuits (PICs) multiple waveguiding layers PolyBoard platform. In their simplest form, 3D PICs comprise AEs at different layers, vertical lateral couplers distribution light among AEs, phase shifters execution 2D beam scanning...