A5103149774- Advanced ceramic materials synthesis
- High Entropy Alloys Studies
- Diamond and Carbon-based Materials Research
- Metal and Thin Film Mechanics
- Advanced materials and composites
- Metallurgy and Material Forming
- Additive Manufacturing Materials and Processes
- Advanced Sensor and Energy Harvesting Materials
- High-Temperature Coating Behaviors
- Microwave Dielectric Ceramics Synthesis
- Transition Metal Oxide Nanomaterials
- Thin-Film Transistor Technologies
- ZnO doping and properties
- Silicone and Siloxane Chemistry
- Magnesium Oxide Properties and Applications
- MXene and MAX Phase Materials
- Manufacturing Process and Optimization
- Conducting polymers and applications
- Supercapacitor Materials and Fabrication
- Metal Alloys Wear and Properties
- Electrical and Thermal Properties of Materials
- Welding Techniques and Residual Stresses
- Semiconductor materials and devices
- Microstructure and Mechanical Properties of Steels
- Additive Manufacturing and 3D Printing Technologies
Xinjiang University
2025
Shenyang University of Technology
2005-2024
State Council of the People's Republic of China
2016
Abstract A dense α‐Si 3 N 4 ‐based ceramic protective coating was successfully prepared on porous Si ceramics by a liquid infiltration and filling method. The composed of primary phase secondary O'‐Sialon, β‐Sialon, Y–Si–Al–O–N glass phase. After thermal shock at Δ T = 1000°C for five times, cracks were produced, but the tip crack stopped inside coating; so coated still had good waterproof ability its water absorption only 7%. During shock, toughening mechanisms involving needle‐like...
A dense α-Si<sub>3</sub>N<sub>4</sub>/Sialon ceramic coating was fabricated on porous Si<sub>3</sub>N<sub>4</sub> using the liquid infiltration and filling method.
A high‐temperature‐resistant flexible substrate is a critical component of high‐performance electronic components. Herein, method that does not require flowing gas and which suitable for volume production presented the preparation several‐millimeter‐long silicon nitride (Si 3 N 4 ) fibers with cross‐sectional dimension 0.1–1.0 μm. Further, square sheet paper weight 0.050 g, side lengths 105 mm each, thickness 15 μm fabricated using Si via conventional laboratory paper‐making method....
The flexible electronics offer promising prospects in the field of wearable electronics, artificial intelligence, and Internet Things due to their characteristics being thin, lightweight, flexible, bendable, stretchable. preparation usage semiconductor oxide temperature sensors require a specific high or defined range. However, utilization polymer substrates is limited inadequate resistance temperatures mismatched thermal expansion coefficients with inorganic compounds. substrate employed...