Tuyen Nguyen

ORCID: 0000-0002-7930-7763
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About
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Research Areas
  • Supercapacitor Materials and Fabrication
  • Advanced battery technologies research
  • Electrodeposition and Electroless Coatings
  • Electrocatalysts for Energy Conversion
  • Advancements in Battery Materials
  • Conducting polymers and applications
  • Low-power high-performance VLSI design
  • Electromagnetic Compatibility and Noise Suppression
  • Magnetic Properties and Synthesis of Ferrites
  • VLSI and FPGA Design Techniques
  • VLSI and Analog Circuit Testing
  • ZnO doping and properties
  • Experimental Learning in Engineering
  • MXene and MAX Phase Materials
  • Radiation Effects in Electronics
  • Multiferroics and related materials
  • Transition Metal Oxide Nanomaterials
  • Power Line Communications and Noise
  • Electromagnetic Simulation and Numerical Methods
  • Electrical and Thermal Properties of Materials
  • CCD and CMOS Imaging Sensors
  • Lightning and Electromagnetic Phenomena
  • Embedded Systems Design Techniques
  • Integrated Circuits and Semiconductor Failure Analysis
  • Advancements in Semiconductor Devices and Circuit Design

University of Lisbon
2015-2019

Rede de Química e Tecnologia
2015-2018

Instituto Superior Técnico
2015-2018

Instituto Politécnico de Lisboa
2015-2018

Centre National de la Recherche Scientifique
2015-2016

Université Grenoble Alpes
2015-2016

Laboratoire des Matériaux et du Génie Physique
2015

IBM Research - Austin
1998-2002

IBM (United States)
1997-1999

University of Arkansas at Fayetteville
1988

Abstract Consecutive layers of Ni(OH) 2 and Co(OH) were electrodeposited on stainless steel current collectors for preparing charge storage electrodes high specific capacity with potential application in hybrid supercapacitors. Different prepared consisting films , Ni 1/2 Co (OH) layered to highlight the advantages new architecture. The microscopy studies revealed formation nanosheets particles agglomerates films. Important morphological changes observed double hydroxides Film growth by...

10.1038/srep39980 article EN cc-by Scientific Reports 2017-01-04

High energy density, rate performance and long cycle life hybrid γ-FeOOH-carbon nanofoam paper∥amorphous Ni–Mn hydroxide-carbon paper supercapacitors.

10.1039/c7ta05582j article EN Journal of Materials Chemistry A 2018-01-01

Structural evolution of electrodeposited Mn–Co hydroxide into spinel MnCo<sub>2</sub>O<sub>4</sub>nanosheets by thermal annealing.

10.1039/c5ra03047a article EN RSC Advances 2015-01-01

Controlling the surface morphology of mixed nickel manganese oxides prepared by electrodeposition and thermal annealing for use as charge storage electrodes.

10.1039/c5ta01453k article EN Journal of Materials Chemistry A 2015-01-01

This work reports the fabrication, by electrodeposition and post-thermal annealing, of hybrid electrodes for high rate electrochemical energy storage composed nickel manganese oxide (Ni0.86Mn0.14O) nanosheets over 3D open porous dendritic NiCu foams. The are made two different percolation networks dendrites, exhibit a specific capacitance value 848 F g−1 at 1 A g−1. tests revealed that display an excellent capability, characterized retention approximately 83% when applied current density...

10.1039/c5nr02888d article EN Nanoscale 2015-01-01

The initial growth stages nickel cobalt hydroxide films prepared by electrodeposition for energy storage applications.

10.1039/c6cp00709k article EN Physical Chemistry Chemical Physics 2016-01-01

Experimental measurements were conducted to study the problem of crosstalk in multilayer printed-circuit-board design. Experiments using both pulse and sinusoidal signals designed as a function coupling line lengths, spacings, shielding versus nonshielding (lines different layers). The mutual inductance capacitance between two similar transmission lines also extracted from simple models crosstalk. It is found that when sinusoid-driven signal was used voltage source, coupled acted...

10.1109/13.2294 article EN IEEE Transactions on Education 1988-05-01

Article Free Access Share on Simulation of coupling capacitances using matrix partitioning Authors: Tuyen V. Nguyen BM Austin Research Laboratory, Austin, TX TXView Profile , Anirudh Devgan Ali Sadigh Electronic Design Automation, HopeweIl Junction, NY NYView Authors Info & Claims ICCAD '98: Proceedings the 1998 IEEE/ACM international conference Computer-aided designNovember 1998Pages 12–18https://doi.org/10.1145/288548.288554Published:01 November 1998Publication History...

10.1145/288548.288554 article EN 1998-01-01

This paper presents a method based on multipoint Pade approximation in conjunction with the of characteristics for reduced order modeling and simulation coupled multiconductor transmission lines (MTL) frequency dependent losses. Specifically, skin-effect loss associated conductors is primary concern. Recursive algorithms generate sets frequency-shifted moments used approximation. The approach provides accurate broadband transfer function characteristic admittance. time accomplished via...

10.1109/isemc.2000.875542 article EN 2002-11-07

SOI represents a technology shift comparable in Impact to the from NMOS CMOS. It has impacts on many aspects of modeling, simulation and analysis, presents some unique challenges due presence number electrical phenomena SOI.In this tutorial, we will review technology, touching specifically devices models, as well impact floating body parasitic bipolar effects. We show examples these circuit behavior balance that against existing sources variation such power supply variations,...

10.5555/339492.340058 article EN International Conference on Computer Aided Design 1999-11-07

This paper presents a general method for incorporating state transformation in event driven explicit simulation. One inherent assumption this type of simulation algorithm is the independence, which allows to process states independently an manner at transistor level. Numerical problems arise when inappropriate representation circuit, are not truly independent, chosen. In principle, any similarity equation can be employed transform circuit into more convenient space numerical solution....

10.5555/266388.266494 article EN International Conference on Computer Aided Design 1997-11-13
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