A5041215212- Semiconductor Lasers and Optical Devices
- Solid State Laser Technologies
- Electronic Packaging and Soldering Technologies
- Photonic and Optical Devices
- Semiconductor Quantum Structures and Devices
- Laser Material Processing Techniques
- 3D IC and TSV technologies
- Laser Design and Applications
- Advanced Fiber Laser Technologies
- Advanced Vision and Imaging
- Advanced optical system design
- Optical measurement and interference techniques
- Silicon Carbide Semiconductor Technologies
- Advanced Optical Sensing Technologies
- Heat Transfer and Boiling Studies
- Optical Coherence Tomography Applications
- Heat Transfer and Optimization
- Electromagnetic Compatibility and Noise Suppression
- Optical Systems and Laser Technology
- Heat Transfer Mechanisms
- Spectroscopy and Laser Applications
- Robotics and Sensor-Based Localization
- GaN-based semiconductor devices and materials
- Optical Coatings and Gratings
- solar cell performance optimization
Capital Medical University
2020-2025
Sinolight (China)
2015-2024
Tongji University
2018-2024
Lanzhou University of Technology
2023
China People's Public Security University
2022
China State Construction Engineering (China)
2022
Xi'an Institute of Optics and Precision Mechanics
2012-2021
University of Chinese Academy of Sciences
2018-2021
Chinese Academy of Sciences
2009-2020
State Key Laboratory of Transient Optics and Photonics
2011-2013
Abstract With the continuous depletion of global rhenium resources, separation and purification (Re) from secondary resources became very important. Herein, an imprinted composite membrane with “flexible chain” thermo‐responsive layer structure (Re‐TIICM) was prepared to achieve selective recovery Re complex composition. Re‐TIICM's occurred sol/gel phase transition by adjusting temperature, which effectively mitigated trade‐off between selectivity desorption. The performance Re‐TIICM under...
Abstract Background Circulating tumor DNA (ctDNA) has emerged as a potential novel biomarker to predict molecular residual disease (MRD) in lung cancer after definitive treatment. Herein, we investigated the value of ctDNA prognosing risk relapse and monitoring effect adjuvant therapy surgical non‐small cell (NSCLC). Methods We enrolled 58 NSCLC patients real‐world setting, tissues 325 plasma samples were analyzed. Tumor subjected targeted next‐generation sequencing (NGS) 1021 cancer‐related...
Solder joint thermal fatigue failure is a major concern for area array technologies such as flip chip and ball grid technologies. geometry an important factor influencing lifetime. In this paper, the effects of solder shape height on lifetime are studied. was evaluated using accelerated temperate cycling adhesion test. Scanning electron microscopy (SEM), energy dispersive x-ray analysis (EDX), scanning acoustic (nondestructive evaluation) optical were utilized to examine integrity detect...
Demands for increasing power density and levels of functional integration in switch-mode converters require electronics manufacturers to develop innovative packaging solutions semiconductor devices modules. Three-dimensional (3-D) techniques offer the potential lower resistance, higher current handling capability, smaller volume, better thermal management high reliability. In this paper, we present constructions some electrical thermomechanical analyses four 3-D approaches that have been...
Semiconductor pump lasers are an important component in erbium-doped fiber amplifiers and Raman amplifiers. Thermal management has become one of the major obstacles laser development. Understanding thermal behavior high-power packages is crucial to design optimization lasers. In this paper, we report on characteristics a discuss issues associated with heat dissipation. The modules mainly consists three aspects. One resistance reduction which reduces bulk temperature rise diode chip. second...
High power semiconductor lasers have found increased applications. Indium solder is one of the most widely used solders in high laser die bonding. has some advantages It also concerns, however, especially terms reliability. In this paper, reliability indium bonding broad area was studied. that bonded much shorter lifetime than AuSn devices. Catastrophic degradation observed lasers. Nondestructive optical and acoustic microscopy conducted during testing to monitor failure process destructive...
We present a scale-adaptive three-dimensional (3D) imaging architecture for coherent light detection and ranging (lidar) that incorporates Risley-prism-based beam scanning. An inverse design paradigm from steering to prism rotation is developed demand-oriented scan pattern generation motion law formulation, which allows the lidar perform 3D with adaptive scale configurable resolution. By combining flexible manipulation simultaneous distance velocity measurement, proposed can achieve both...
Synchronous multiple primary lung cancer (sMPLC) exhibits distinct histopathological characteristics among pulmonary nodules. However, a comprehensive understanding of the somatic mutation landscape and transcriptome heterogeneity is lacking. Therefore, our study aims to meticulously investigate genomic distinctions nodules within individual patients. We performed targeted DNA sequencing on tumor specimens conducted bulk RNA analysis 53 originating from 26 The same patient was determined as...
Fast imaging tracking technology exhibits attractive application prospects in the emerging fields of target and recognition. Smart compact model with fast flexible strategy can play a decisive role improving system performance. In this paper, an effective from to rotation Risley prism pair embedded camera is derived by beam vector propagation method. A boresight adjustment using inverse ray tracing iterative refinement method established accomplish function locating target. The influence...
Abstract Increasing social awareness concerning the design of excellent performance toughening agents to curb adverse effects insufficient toughness on wide range applications epoxy resin (EP). Herein, a small amount sorbitol was doped into carbocyclic inositol as core monomer, and bisphenol‐A epichlorohydrin were used produce epoxide‐terminated hyperbranched polyether by one‐pot preparation method. After that, prepared polymer modifier improve strength petroleum‐based EPs. Results...
We present the use of flip-chip technology, widely used in IC packaging, for fabrication three-dimensional packaged integrated power electronics modules (IPEMs). In IPEM (FC-IPEM), devices are bonded to flexible substrate with circuit pattern gate-drive components using triple-stacked solder bumps. The encapsulated underfill polymer materials distribute thermomechanical stresses caused by mismatching coefficients thermal expansion (CTEs) among silicon chips and substrates. semiconductor dies...
With the development of Internet, Information security is becoming more and important. Traditional cryptographic methods require user to remember keys, it not convenient. Biometrics based key generation techniques generate keys from biometrics directly. In this paper, we propose a biometric cryptosystem on face biometrics. At encryption stage, 128-dimensional principal component analysis (PCA) feature vector firstly extracted image. And 128 bit binary obtained by thresholding. Then select...
Scan blind zone and control singularity are two adverse issues for the beam scanning performance in double-prism Risley systems. In this paper, a theoretical model which introduces third prism is developed. The critical condition fully eliminated scan determined through geometric derivation, providing several useful formulae three-Risley-prism system design. Moreover, inverse solutions three-prism established, based on damped least-squares iterative refinement by forward ray tracing method....
We have extended the concept of flip-chip technology, which is widely used in IC packaging, to packaging three-dimensional (3-D) integrated power electronics modules (IPEMs). call this new approach on flex IPEM (FCOF-IPEM), because devices are bonded a flexible substrate with control circuits. developed novel triple-stacked solder bump metallurgy for improved and reliable device interconnections. In multilayer structure, we carefully selected materials that distribute thermo-mechanical...
High power diode lasers have found increased applications in pumping of solid state or fiber laser systems for industrial, military and medical as well direct material processing applications. The non-linearity the near-field emitters (or so called ldquosmilerdquo effect) a array poses significant challenges optical coupling beam shaping has become one major roadblocks broader arrays. Increasing linearity enables system manufacturer to improve compactness, efficiency, power, quality while at...
Abstract Unmanned aerial vehicle (UAV) image stitching is a key technology for remote sensing applications. Most existing methods based on optimal seamline searching algorithms can eliminate defects such as ghosting and distortion in stitched images, which unfortunately suffer from the problem that may cross those regions with significant geometric misalignment between different images. Therefore, novel method multi‐region segmentation proposed. The algorithm starts by performing multi‐scale...
High power semiconductor laser arrays have found increased applications in pumping of solid state systems for industrial, military and medical as well direct material processing such welding, cutting, surface treatment. Semiconductor array products are required to narrow spectral width applications. Increasing the accuracy by reducing pump diode enables system designer improve compactness, efficiency, power, beam quality while at same time thermal management cost system. Spectral is one key...