A5026216018- Microstructure and mechanical properties
- Electronic Packaging and Soldering Technologies
- Metallurgy and Material Forming
- Intermetallics and Advanced Alloy Properties
- Titanium Alloys Microstructure and Properties
- Metal and Thin Film Mechanics
- Aluminum Alloys Composites Properties
- Particle accelerators and beam dynamics
- Metal Forming Simulation Techniques
- Aluminum Alloy Microstructure Properties
- 3D IC and TSV technologies
- Superconducting Materials and Applications
- Microstructure and Mechanical Properties of Steels
- Advanced materials and composites
- Physics of Superconductivity and Magnetism
- Advanced Welding Techniques Analysis
- High Temperature Alloys and Creep
- High-Velocity Impact and Material Behavior
- Semiconductor materials and interfaces
- Integrated Circuits and Semiconductor Failure Analysis
- Advanced ceramic materials synthesis
- Magnesium Alloys: Properties and Applications
- Metallurgical and Alloy Processes
- Superconductivity in MgB2 and Alloys
- MXene and MAX Phase Materials
Michigan State University
2016-2025
Michigan United
2022
Material Sciences (United States)
2018-2020
IMDEA Materials
2019
National High Magnetic Field Laboratory
2017
National Superconducting Cyclotron Laboratory
2004-2011
Iowa State University
2010
Ames National Laboratory
2010
National Tsing Hua University
2010
Intel (United Kingdom)
2010
The size and crystal orientation of Sn grains in Pb-free, near eutectic Sn-Ag-Cu solder joints were examined. A clear dependence the thermomechanical fatigue response these on grain was observed (Sn has a body centered tetragonal structure). Fabricated tend to have three orientations cyclic twin relationship, but among population balls, this triplet appears be randomly oriented. In thermally cycled joints, balls with dominant having particular c-axis nearly parallel plane substrate fail...
In some applications, contacts between two devices are the first cause of dysfunctions. The aim this paper is to transfer contactless power energy add new functions a tool (e.g., drill machine). A bidirectional communication also needed. This realized with an ironless high-frequency transformer for both and information transmission. Different coil geometries have been studied reduce mutual inductance coils. solution enables build low-cost smart systems including communication.