An ultra-thinning down to 4-μm using 300-mm wafer proven by 40-nm Node 2Gb DRAM has been developed for the first time. Three different types of thinning process including coarse grinding, fine and stress relief were optimized an atomic level vacancy less than 10-nm in depth at backside was formed successively. Thickness uniformity even after approximately 1-μm within wafer. No degradation terms retention characteristics distribution employing found ultra-thinning. This suggests that no...

An ultra-thinning down to 2.6-μm with and without Cu contamination at 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">13</sup> atoms/cm xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> using 300-mm wafer proven by 2Gb DRAM has been developed for the first time. The impact of Si thickness backside yield including retention characteristics is described. Thickness uniformity all wafers after thinning was below 2-μm within wafer. A degradation...

Effect of via bottom cleaning process and electrical characteristics through-silicon (TSV) are investigated using 300-mm wafer-on-wafer (WOW) process. Several kinds method including wet dry were employed after TSV SiO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> liner etching It was found that sequential O plasma Ar sputtering provides the lowest resistance smallest variation among conditions we have evaluated, which is 0.3 times...

This paper describes electrical characteristics of bumpless and dual-damascene TSV interconnects for three-dimensional integration (3DI) using Wafer-on-Wafer (WOW) technology. Process optimization counter to issues formation process is demonstrated test vehicle fabricated with 300-mm wafer characterized by chain resistance leakage current in the level.

In recent years, nanostructures have been required for industry and medical services, to perform functions such as reduction in friction, control of wettability, enhancement biological affinity. Ultrashort pulsed lasers applied meet these demands, actively studied both experimentally theoretically terms phenomena principles. this study, clarify the phenomenon fabrication laser-induced periodic surface structures (LIPSS), its application industry, experiments were conducted on SUS304,...

Functional surface creation technologies have garnered increasing attention over the years. These can provide various functions to a material by establishing fine structure on and responding needs of industrial products with distinguished or high values. In addition, creating “composite structure,” which is composed two kinds structures different scales, enhancement emergence new functionalities be expected. Hence, our study combined micrometer-scale V-shaped groove using an ultra-precision...

An ultra-thinning down to 2.6-um using 300-mm 2Gb DRAM wafer has been developed. Effects of Si thickness and Cu contamination at backside in terms yield retention characteristics are described. Total variation (TTV) after thinning was below 1.9-um within wafer. A degradation occurred while no 5.6-um for both package level test were found. In-depth analysis such as stress variations distributions, behavior diffusion from the back side ultra-thinned evaluated by TEM, EDX, TOF-SIMS, Positron...

Compared with traditional nanotexturing methods, an ultrashort-pulsed laser is efficient technology of fabricating nanostructures called laser-induced periodic surface structures (LIPSS) on material surfaces. LIPSS are easily fabricated when the pulse duration shorter than collisional relaxation time (CRT). Accordingly, lasers have been mainly used to study LIPSS, but they unstably irradiate while requiring high costs. Although long-pulsed low cost and stability, phenomena (such as effect...

We have developed permanent and temporary adhesives that are suitable for fabricating multilevel stacks using ultra-thin wafers of several micrometers or less [1]. In this paper, we describe a hot-melt type adhesive layer with thickness 10 μm formed on device wafer spin-on technique bumpless TSV interconnect applications. After stacking the carrier, was thinned to approximately grinding polishing processes. bonding process, an 2.5 μm-thick by technique, thin stacked top. There were no voids...

Electrochemical machining (ECM) technology has witnessed several research and development breakthroughs since its introduction in early 1900s. The ECM process serves as one of the key production processes aerospace, die-moulds, tooling automotive industries. Over time, demands on precision have increased this resulted developments focusing specifically improving processing. However, existing review papers not extensively focused methods parameters controlling process. Therefore, article...

Ultrashort-pulsed laser irradiation is a more efficient approach to the fabrication of fine surface structures than traditional processing methods. However, it has some problems: equipment expenses usually increase as pulse shortens, and process principle not been clarified completely, although collisional relaxation time (CRT) assumed be major factor. In this study, 20-ps pulsed was employed fabricate nanometer-sized periodic on stainless steel alloy, SUS304. The pitch length fabricated...

The material viscosities of permanent and temporary adhesives were examined using the rigid body pendulum method to reveal a suitable for wafer bonding process at 100 °C. Properties suited debonding adhesive is applied wafer-on-wafer (WOW) stacking with bumpless dual-damascene interconnect (via-last after bonding) technology, which enables multilevel ultra-thin wafers several micrometers or less low cost.

Electrochemical machining (ECM) is a well-established elution method with high processing speed, application to hard-to-cut material and less tool wear as noncontact between workpiece tool. However, ECM hard process precisely fabricate nanostructures. A short-pulsed laser (SPL), on the other hand, can fine periodic structures called LIPSS (laser-induced surface structures), which has been reported provide materials functionalities such reduction of friction, change wettability improvement...

Ultra-thinning less than 10 microns of Si wafer is expected to realize small TSV feature which provides low aspect ratio and coupling capacitance. However, a detail residual surface damage during thinning unrevealed. In this paper, subsurface following from the back 300 mm wafers using three different types process was investigated by means Raman spectroscopy, XTEM, Positron annihilation analysis, respectively. A coarse grinding generates significant rough ranged several micron layer...

Chip-on-Wafer (COW) stacking structure using stack-first and bumpless interconnects was successfully fabricated for the first time. Chips were arrayed bonded onto wafer by back-to-face gap filling between chips carried out organic material without void formation. on thinned down to 5 μm. Via-holes formed at off-chip area (outside chip). Copper redistribution line via-first Damascene method. Lower leakage current as low back ground found pads. No failure an approximate 100% yield achieved in...

In this study, we propose a method to estimate oxygen saturation by selecting the best bands from video images captured multiband camera. Oxygen is one of most important bioindicators for measuring human health. For example, when person contracts COVID-19, which currently prevalent, uptake does not work properly and drops without being aware it, may lead severe symptoms. Monitoring very so that receives treatment before such situation occurs. The commonly used contact sensor uncomfortable...

Short-pulsed laser-induced periodic surface structures (SPLIPSSs) have the possibility to control tribology, wettability and biocompatibility. Nevertheless, optimal structure depends on each functionality, which has not been clarified. The hybrid process with a short-pulsed laser electrochemical machining (SPLECM) is, then, proposed fabricate micro/nano modify composition for providing high functionalities material surfaces. Electrochemical is well-established micro-elution deposition method...

Ultrashort-pulsed laser irradiation is a more efficient approach for fabricating fine surface structures than traditional processing methods. However, it has some problems that the equipment expenses usually increase with shortening of pulse length, and process principle not been clarified completely, yet collisional relaxation time (CRT) assumed to be major factor. Thus in this study, 20-ps-pulsed was employed fabricate nanometer-sized periodic on stainless steel alloy, SUS304. The pitch...