Recently, design for additive manufacturing has been proposed to maximize product performance through the rational and integrated of product, its materials, their processes. Searching solutions in such a multidimensional space is challenging task. Notably, no existing support method both rapid tailored process. In this study, we propose holistic approach that applies data-driven methods search optimization at successive stages More specifically, two-step surrogate model-based embodiment...

There are many inertial sensor-based foot pose estimation algorithms. In this paper, we present a methodology to improve the accuracy of using two low-cost distance sensors (VL6180) in addition an sensor unit. The is time-of-flight range finder and can measure up 20 cm. A Kalman filter with 21 states proposed estimate both calibration parameter (relative respect unit) pose. Once obtained, nine be used Through four activities (walking, dancing step, ball kicking, jumping), it shown that...

Composite materials are extensively used in aircraft structures, wherein they subjected to cyclic loads and subsequently impact-induced damages. Progressive fatigue degradation can lead catastrophic failure. This highlights the need for an efficient prognostic framework predict crack propagation field of structural health monitoring (SHM) composite structures improve functional safety reliability. However, achieving good accuracy growth prediction is challenging due uncertainties material...

This study presents a global sensitivity analysis to simplify surrogate-model-based uncertainty quantification of crude distillation unit with large number uncertainties. To overcome the computational limitation conventional surrogate model-based approach where simulations required grows exponentially as input dimension increases, novel two-stage was proposed in this study: first stage, multiplicative dimensional reduction method is applied identify factors that exert highest influence on...

Thin electronic packages are usually achieved by thinning the die and swapping standard core substrates to thin coreless variations. The decrease in thickness reduces flexural rigidity of package, resulting a warpage challenge that must be addressed design phase for high yield assembly process good reliability. Finite element analysis (FEA) is useful tool predict during process. However, computational time can too long, especially when models large parametric studies extensive. In this work,...

Nuclear power with strengthened safety regulations continues to be used as an important resource in the world for managing atmospheric greenhouse gases and associated climate change. This study examined environmentally benign separation of zirconium tetrachloride (ZrCl4) hafnium (HfCl4) nuclear reactor applications through extractive distillation using a NaCl-KCl molten salt mixture. The vapor–liquid equilibrium behavior ZrCl4 HfCl4 over system was correlated Raoult’s law. salt-based column...

Package design process has evolved from the early days, when any was subjected to vigorous analysis using Design of Experiments (DOE) methodology understand effect each parameter and material change, introduction finite element (FEA) reduce DOE runs or completely eliminate it in some cases. FEA proved be a valuable tool. With easy accessibility computing power recent advances AI-algorithms, this paper presents next evolution package – AI-assisted design. This framework incorporates both...

Warpage control of electronic packages has become a critical challenge given the requirement thinner packaging solutions for future. While modeling warpage using finite element models is good way to predict stresses and warpage, analysis results are only as assumed model inputs such material properties. This especially true with simulations anisotropic temperature-dependent properties substrate. With varying metal line patterns densities across substrate, substrate can be spatially in...

Thinned silicon dies and thin substrates using core coreless structures have enabled packages. For robust manufacturing reliability of these parts, solving the warpage problem is key. While current finite element methodologies can provide some insights at design stage, simulations are only as accurate inputs such material properties stress-free temperatures. Electronic especially challenging to characterize model they laminates consisting a with layers resin metal lines on either side. In...

Light emitting diodes (LEDs) are increasingly used in a number of applications such as display backlighting, signaling, general illumination, medical services etc. They have high efficiency, environmental resilience, reliability and long lifetime. Normally, one has to resort using sequential updating methods the particle filtering approach for effective prognosis lumen maintenance life prediction LEDs because their lifetime reliability. However, performance filter severely depends on...

Package warpage simulations carried out using finite element analysis typically require several assumptions to be made for simplicity and computational efficiency. These usually include the linear elasticity of materials negligible impact process dependence on (allowing loading condition a single-step temperature ramp down from stress-free temperature). For standard packages, these still yield acceptable results. However, ultra-thin packages with higher incoming bare substrate more complex...