A5074699550- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Carbon Dioxide Capture Technologies
- Aluminum Alloys Composites Properties
- Nanofabrication and Lithography Techniques
- Electromagnetic Compatibility and Noise Suppression
- Integrated Circuits and Semiconductor Failure Analysis
- Phase Equilibria and Thermodynamics
- Catalytic Processes in Materials Science
- Advanced Data Storage Technologies
- Catalysts for Methane Reforming
- Spectroscopy and Quantum Chemical Studies
- Photochemistry and Electron Transfer Studies
- Microstructure and mechanical properties
- Caching and Content Delivery
- Additive Manufacturing and 3D Printing Technologies
- Distributed systems and fault tolerance
- Chemical Looping and Thermochemical Processes
- Manufacturing Process and Optimization
- Blockchain Technology Applications and Security
- Mercury impact and mitigation studies
- Copper Interconnects and Reliability
- User Authentication and Security Systems
- Stress Responses and Cortisol
- Advancements in Photolithography Techniques
Kunming University of Science and Technology
2023
Johns Hopkins University
2022
Tongfu Microelectronics (China)
2022
Carbon Solutions (United States)
2020
University of Waterloo
2019
Advanced Semiconductor Engineering (Taiwan)
2009-2018
Children's Healthcare of Atlanta
2017
Emory University
2017
Rambus (United States)
2016
ON Semiconductor (United States)
2014
Distributed storage systems for large clusters typically use replication to provide reliability. Recently, erasure codes have been used reduce the overhead of three-replicated systems. Reed-Solomon are standard design choice and their high repair cost is often considered an unavoidable price pay efficiency This paper shows how overcome this limitation. We present a novel family that efficiently repairable offer higher reliability compared codes. show analytically our optimal on recently...
Distributed storage systems for large clusters typically use replication to provide reliability. Recently, erasure codes have been used reduce the overhead of three-replicated systems. Reed-Solomon are standard design choice and their high repair cost is often considered an unavoidable price pay efficiency This paper shows how overcome this limitation. We present a novel family that efficiently repairable offer higher reliability compared codes. show analytically our optimal on recently...
Fabrication of high aspect ratio through silicon vias (TSVs) in a Si interposer and fine pitch solder microbumps on top die is discussed this paper. Chip stacking result the also presented. TSVs with 25 μm higher than 10 are etched BOSCH process. To avoid difficulties wetting sidewall TSVs, bottom-up plating method used to fill Cu. In order from bottom, first sealed bottom by plated Cu current 1 A. The as seed layer then conducted 0.1 Good filling without voids or only tiny has been...
High density three dimensional (3D) interconnects formed by high aspect ratio through silicon vias (TSVs) and fine pitch solder microbumps are presented in this paper. The of the TSV is larger than 10 filled with Cu without voids; there electrical nickel immersion gold (ENIG) pads on top as under bump metallurgy (UBM) layer. On Si chip, Cu/Sn 16µm diameter 25µm fabricated. After singulating chip carrier, joined together interconnection between them micro bumps TSV.
In this study, the reliabilities of low Ag SAC alloys doped with Mn or Ce (SACM SACC) were evaluated under JEDEC drop, dynamic bending, thermal cycling, and cyclic bending test conditions against eutectic SnPb, SAC105, SAC305 alloys. The cost SAC105 achieved a higher drop reliability than SAC305, exceeded SnPb for some conditions. More significantly, being slightly both SACM SACC matched in cycling performance. other words, better performance plus desired high mechanism can be attributed to...
Abstract Clinical management of neonatal hypoxic-ischemic encephalopathy (HIE) suffers from the lack reliable surrogate marker tests. Proteomic analysis may identify such biomarkers in blood, but there has been no proof-of-principle evidence to support this approach. Here we performed in-gel trypsin digestion plasma proteins four groups 10-d-old mice [untouched and 24 h after low-dose lipopolysaccharide (LPS) exposure, hypoxia-ischemia (HI), or LPS/HI injury; n = 3 each group) followed by...
The Time-Frequency and Time-Scale communities have recently developed a large number of overcomplete waveform dictionaries. Decomposition into systems is not unique, several methods for decomposition been proposed--including the Method Frames, Matching Pursuit, and, special dictionaries, Best Orthogonal Basis. Basis Pursuit principle decomposing signal an `optimal' superposition dictionary elements-- where optimal means having smallest l<SUP>1</SUP> norm coefficients among all such...
This paper compares the attributes of embedded wafer level BGA (eWLB) and a flip chip package structure, called Fan-Out Chip Last Package (FOCLP). The comparison involves study in finite element modeling, advanced warpage metrology, reliability testing physical structure comparisons. purpose this is to understand similarities differences between these two structures. It clear from studies that packages are very similar form, format function. In other words, FOCLP may be practical replacement...
Developments of ultra fine pitch and high density solder microbumps for advanced 3D stacking technologies are discussed in this paper. CuSn with 25 ¿m fabricated at wafer level by electroplating method the total thicknesses platted Cu Sn 10 ¿m. After plating, micro bumps on Si chip reflowed 265°C variation bump height measured within a die is less than 5%. The under metallurgy (UBM) layer carrier used electroless plated nickel immersion gold (ENIG) thickness 5 Assembly conducted FC150 flip...
Two promising combustion modification approaches applicable to pulverized coal fired boilers are presented: "Oxygen-Enriched Combustion" (OEC) for NOx control and "Oxy-Combustion" (PC-OC) CO2 capture. Oxygen-enriched air rather than is used as an oxidizer in the OEC technology. Unlike flue gas treatment technologies, directly impacts formation process by significantly reducing conversion of bound nitrogen NOx. Pilot-scale full-scale tests have shown 20 30% reduction from optimized staged-air...
Traditional FOWLP (fan out wafer level package) requires relative expensive semiconductor equipment to form RDL layers. On the other hand, fan chip last package (FOCLP) uses low cost substrate and packaging produce essentially same final structure. As transmission lines transitions within a are crucial RF millimeter wave performances, this paper will investigate performances of several different line structures in stacking coreless substrates FOCLP. The loss beta on these be compared provide...
A new pore size distribution (PSD) model is developed to readily describe PSDs of microporous materials with an analytical expression. Results from this can be used calculate the corresponding adsorption isotherm compare calculated experimental isotherm. This aspect provides another check on validity model's results. The basis a 3-D equation that derived statistical mechanical principles. Least-squares error minimization solve PSD without any preassumed function. In comparison several...
Abstract One promising approach for removing mercury from coalfired, utility flue gas involves the direct injection of sorbents. Although this method has been effective at in municipal waste incinerators, tests conducted to date on coal‐fired boilers show that removal is much more difficult gas. EPRI conducting research investigate using sorbents application. Bench‐scale, pilot‐scale, and field have determine ability different remove simulated actual streams. This paper focuses recent...
The rapid ramping of fine pitch copper wire bonding production is a perfect example market driven technology implementation. explosive increase in gold commodity pricing has paved the road for this conversion. Several challenges known from thick had to be overcome make viable technically and economically. Some fundamental studies full spectrum die surfaces wafer nodes was available at beginning manufacturing implementation but over last year, large number research papers have been published...
Wire bonding has been the predominant interconnect technology for more than 40 years and even today is holding a market share of 85%. The standard wire material gold albeit copper aluminum wires have used 20 or so in power applications. In past few years, economics, i.e. explosive increase commodity pricing, lead to rapid conversion fine diameter packages packages. was by consumer products which were most price sensitive perceived be least demanding reliability due nature application...
In this study, the reliabilities of low Ag SAC alloys doped with Mn or Ce (SACM SACC) were evaluated under JEDEC drop, dynamic bending, thermal cycling, and cyclic bending test conditions against eutectic SnPb, SAC105, SAC305 alloys. The cost SAC105 achieved a higher drop reliability than SAC305, exceeded SnPb for some conditions. More significantly, being slightly both SACM SACC matched in cycling performance. other words, better performance plus desired high mechanism can be attributed to...
In face of currently economic globalization and rapid development knowledge, the competition in high-tech industry has developed from regionally to globally. The fierce technology knowledge no longer exclusive advantages. A business constantly innovate establish unique resources pursue better performance activity remain competitive When drafting executing innovation strategy, a should first measure internal/external environment objectives consider organizational propose proper coping...
Advanced memory technologies such as DDR4 and LPDDR4 are able to receive transmit huge amount of data in faster more efficient ways than ever before. At the same time, reducing power noise designing dense traces become a challenging part design processes. In particular, high signal density on package naturally restricts resources for robust delivery when keeping layer count. While costly thin-core packaging technology is widely available, embedded trace substrate (ETS) another viable...
In brain-computer interface (BCI) systems, acquiring EEG signals is relatively easy, but labeling challenging. Supervised learning widely used in existing BCI research, its generalization ability poor due to the influence of labeled data, which not conducive promotion and application BCI. fields computer vision natural language processing, self-supervised becoming a popular research direction that can use unlabeled data for learning. this study, we propose contrastive method identifying...
The submodeling technique is a powerful analysis tool. method promotes more accurate and also helps enhance productivity. It has been shown that by using displacement-force cut boundary condition method, it can be made even versatile. local stress phenomena of the solder microbump have solved with this approach to demonstrate concept. From simulation model, known ENIG pad thickness an effect on aluminium in silicon chip. This important as shear will damage circuitry Previously not reported...