A5085892501- Additive Manufacturing and 3D Printing Technologies
- Electronic Packaging and Soldering Technologies
- Nanomaterials and Printing Technologies
- Surface Modification and Superhydrophobicity
- Machine Learning in Materials Science
- Aerosol Filtration and Electrostatic Precipitation
- Digital Transformation in Industry
- Fluid Dynamics and Heat Transfer
- Metal-Organic Frameworks: Synthesis and Applications
- Advanced Sensor and Energy Harvesting Materials
- Manufacturing Process and Optimization
- Enhanced Oil Recovery Techniques
Wuhan University
2021-2023
Flexible printed circuit boards (FPCB) are widely used in smart devices with high wiring density and light weight. In this paper, the chemical etching process of FPCB 18 μm line pitch is investigated. A geometric model shape "T" established simulated by finite element method. The time evolution cavity, concentration field velocity CuCl <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> solution studied, as well effects initial...
Abstract In the wet etching process of flexible printed circuit board (FPCB), to obtain a better profile and improve yield, it is necessary control spraying pressure time as far possible. this paper, numerical method implemented with Euler multiphase flow model proposed investigate impact on quality FPCB. The FPCB sample 18 μm line pitch manufactured based parameters obtained by simulations. A comparison between microscopic analysis actual structures cavity profiles predicted simulations...