A5058338381- Diamond and Carbon-based Materials Research
- Thermal properties of materials
- Metal and Thin Film Mechanics
- Graphene research and applications
- Advanced Surface Polishing Techniques
- Tribology and Wear Analysis
- Ion-surface interactions and analysis
- Carbon Nanotubes in Composites
- Lubricants and Their Additives
- Advanced materials and composites
- Thermal Radiation and Cooling Technologies
- Semiconductor materials and devices
- Heat Transfer and Optimization
- Advanced ceramic materials synthesis
- Force Microscopy Techniques and Applications
- MXene and MAX Phase Materials
- Electronic and Structural Properties of Oxides
- Nanowire Synthesis and Applications
- Surface Modification and Superhydrophobicity
- Advanced Thermoelectric Materials and Devices
- Advanced machining processes and optimization
- ZnO doping and properties
- High-Temperature Coating Behaviors
- Dielectric materials and actuators
- High Entropy Alloys Studies
Ningbo Institute of Industrial Technology
2015-2025
Chinese Academy of Sciences
2014-2025
Kogakuin University
2016-2025
University of Chinese Academy of Sciences
2023-2025
Engineering Systems (United States)
2015-2018
Advanced Processing Technology (United States)
2015
Kōchi University
2013
Kochi University of Technology
2000-2008
Kochi Technical High School
2001-2007
Kitakyushu National College of Technology
1996
3DSG incorporated into a polyimide matrix greatly enhanced its thermal conductivity (up to 2.63 W m<sup>−1</sup> K<sup>−1</sup>), approximately 10-fold enhancement in comparison with that of neat polyimide.
Abstract Urged by the increasing power and packing densities of integrated circuits electronic devices, efficient dissipation excess heat from hot spot to sink through thermal interface materials (TIMs) is a growing demand maintain system reliability performance. In recent years, graphene‐based TIMs received considerable interest due ultrahigh intrinsic conductivity graphene. However, cooling efficiency such still limited some technical difficulties, as production‐induced defects graphene,...
As the power density and integration level of electronic devices increase, there are growing demands to improve thermal conductivity polymers for addressing management issues. On basis ultrahigh intrinsic conductivity, graphene has exhibited great potential as reinforcing fillers develop polymer composites, but resultant reported graphene-based composites is still limited. Here, an interconnected highly ordered framework (HOGF) composed high-quality horizontally aligned sheets was developed...
The rapid increase of operation speed, transmission efficiency, and power density miniaturized devices leads to a rising demand for electromagnetic interference (EMI) shielding thermal management materials in the semiconductor industry. Therefore, it is essential improve both EMI conductive properties commonly used polyolefin components (such as polyethylene (PE)) electronic systems. Currently, melt compounding most common method fabricate composites, but difficulty filler dispersion high...
Thermal conductive polymer composite prepared by 3D printing technology, which has a highly vertically oriented carbon fiber structure.
Abstract In this study, we report a facile approach to fabricate epoxy composite incorporated with silicon carbide nanowires (SiC NWs). The thermal conductivity of epoxy/SiC NWs composites was thoroughly investigated. 3.0 wt% filler reached 0.449 Wm −1 K , approximately 106% enhancement as compared neat epoxy. contrast, the same mass fraction micron particles MPs) into matrix showed less improvement on conduction properties. This is attributed formation effective heat pathways among SiC well...
High thermal conductivity polymer composites at low filler loading are of considerable interest because their wide range applications. The construction three-dimensional (3D) interconnected networks can offer a high-efficiency increase for the composites. In this work, facile and scalable method to prepare graphene foam (GF) via sacrificial commercial polyurethane (PU) sponge templates was developed. Highly thermally conductive were then prepared by impregnating epoxy resin into GF...
Developing advanced thermal interface materials (TIMs) to bridge heat-generating chip and heat sink for constructing an efficient transfer is the key technology solve management issue of high-power semiconductor devices. Based on ultra-high basal-plane conductivity, graphene ideal candidate preparing high-performance TIMs, preferably form a vertically aligned structure so that consistent with direction TIM. However, actual interfacial efficiency currently reported TIMs far from satisfactory....
The rapid development of highly integrated microelectronic devices causes urgent demands for advanced thermally conductive adhesives (TCAs) to solve the interfacial heat-transfer issue. Due their natural 2D structure and isotropic thermal conductivity, metal nanoflakes are promising fillers blended with polymer develop high-performance TCAs. However, achieving corresponding TCAs conductivity over 10 W m-1 K-1 at filler content below 30 vol% remains challenging so far. This longstanding...
The implementation of passive cooling strategies is crucial for transitioning from the current high-power- and energy-intensive thermal management practices to more environmentally friendly carbon-neutral alternatives. Among various approaches, developing materials with high conductivity emissivity effective personal wearable devices in both indoor outdoor settings poses significant challenges. In this study, we successfully fabricated a patch by combining biodegradable silk fibroin boron...
Ceramic materials have obvious advantages in thermal stability, but impedance mismatch limited their ability to attenuate electromagnetic (EM) waves. Herein, a novel series of high-entropy (V<sub>0.2</sub>Nb<sub>0.2</sub>Zr<sub>0.2</sub>Ta<sub>0.2</sub>X<sub>0.2</sub>)B<sub>2</sub> (X=Mo, Ti, Hf) ceramics were successfully and rapidly synthesized using the ultrafast high-temperature sintering (UHS) method based on joule heating. The results indicated that effect component control magnetic...
Crystal/material quality and electrical properties of B-doped diamond films synthesized by microwave plasma chemical vapor deposition were investigated. Raman spectroscopy verified the presence indicated that crystal increased with B doping. Secondary-ion mass showed B/C ratios in larger than gas phase, possibly due to differences C sticking coefficients. Electrode patterns Pt fabricated on On undoped a residual concentration ∼5×1017 cm−3, these contacts rectifying small reverse leakage...
A highly flexible cellulose nanofiber/graphene composite film with metal-like thermal conductivity and outstanding strength was fabricated <italic>via</italic> simple vacuum-assisted filtration.
In the pursuit of effective thermal management for electronic devices, it is crucial to develop insulation interface materials (TIMs) that exhibit exceptional through-plane conductivity, low resistance, and minimal compression modulus. Boron nitride (BN), given its outstanding conduction properties, has garnered significant attention as a potential material this purpose. However, previously reported BN-based composites have consistently demonstrated conductivity below 10 W m
Visible luminescence between 2.0–3.5 eV of undoped and boron-doped diamond formed by plasma-assisted chemical vapor deposition has been investigated cathodoluminescence. Electroluminescence from Schottky diode semiconducting observed for the first time found to be due same luminescent center as that In particles or films where content nitrogen boron was greatly reduced, cathodoluminescence peaks occurred at 2.8–2.9 eV. The characteristics these emission spectra are very similar those...
Combining the advantages of high thermal conductivities and low graphene contents to fabricate polymer composites for applications in management is still a great challenge due defect degree exfoliated graphene, poor orientation matrices, horrible phonon scattering between graphene/graphene graphene/polymer interfaces. Herein, mesoplasma chemical vapor deposition (CVD) technology was successfully employed synthesize vertically aligned nanowalls (GNWs), which are covalently bonded by...