Bairi Sri Harisha

ORCID: 0000-0003-1477-8457
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About
Contact & Profiles
Research Areas
  • Supercapacitor Materials and Fabrication
  • Advanced battery technologies research
  • Advancements in Battery Materials
  • Conducting polymers and applications
  • Electrocatalysts for Energy Conversion
  • Nanomaterials for catalytic reactions
  • Surface Roughness and Optical Measurements
  • Additive Manufacturing and 3D Printing Technologies
  • Ocular and Laser Science Research
  • Metal-Organic Frameworks: Synthesis and Applications
  • Advanced Materials and Mechanics
  • Nanofabrication and Lithography Techniques
  • Advanced Sensor and Energy Harvesting Materials
  • Advanced Optical Sensing Technologies
  • Advancements in Photolithography Techniques

Yeungnam University
2021-2024

Abstract Electrode materials comprising SnO 2 quantum dots embedded within ZnO hexagonal prisms were successfully synthesized for building cost-effective energy-storage devices. Extensive structural and functional characterizations performed to assess the electrochemical performance of electrodes. SEM–EDS results confirm a uniform distribution across ZnO. The integration with markedly improved behavior. analysis electrode functionality conducted in 3 M KOH electrolyte revealed specific...

10.1515/ntrev-2024-0047 article EN cc-by Nanotechnology Reviews 2024-01-01

The illumination optical system using a laser diode has advantages such as small size and high efficiency compared to an conventional light source. In particular, its can be maximized in high-resolution spatial modulation. Based on these advantages, research apply scanning adaptive driving beam (ADB) is currently being actively conducted. To construct for ADB single source, the configuration of essential. general high-speed method, power at center relatively smaller with that edge because...

10.3390/app11020793 article EN cc-by Applied Sciences 2021-01-15

Abstract A mechanically reliable micrometric scale conductive wire fabrication method was developed using silver paste. In order to increase the bonding strength between particles, a for filling space particles with UV photopolymer. The photopolymer covers top of mold filled paste, after which vacuum forces are generated by evaporation solvent in paste and density difference solvent. This results penetration into fills interparticle air gaps inside positively modifies mechanical pattern....

10.1088/1361-6439/abd8e1 article EN Journal of Micromechanics and Microengineering 2021-01-06
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