Ryutaro Maeda

ORCID: 0000-0003-1693-0790
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Research Areas
  • Advanced MEMS and NEMS Technologies
  • Nanofabrication and Lithography Techniques
  • Mechanical and Optical Resonators
  • Acoustic Wave Resonator Technologies
  • Advanced Surface Polishing Techniques
  • Ferroelectric and Piezoelectric Materials
  • Advanced Sensor and Energy Harvesting Materials
  • Force Microscopy Techniques and Applications
  • Microfluidic and Capillary Electrophoresis Applications
  • Innovative Energy Harvesting Technologies
  • 3D IC and TSV technologies
  • Advancements in Photolithography Techniques
  • Semiconductor materials and devices
  • Adhesion, Friction, and Surface Interactions
  • Injection Molding Process and Properties
  • Energy Harvesting in Wireless Networks
  • Analytical Chemistry and Sensors
  • Sensor Technology and Measurement Systems
  • Advanced machining processes and optimization
  • Advanced Fiber Optic Sensors
  • Magnetic Field Sensors Techniques
  • Gas Sensing Nanomaterials and Sensors
  • Electronic Packaging and Soldering Technologies
  • Photonic and Optical Devices
  • Metal and Thin Film Mechanics

National Institute of Advanced Industrial Science and Technology
2016-2025

Nagoya University
2025

Xi'an Jiaotong University
2019-2024

Yantai University
2023

The University of Tokyo
2016-2022

Jilin University
2016-2022

Shanghai Jiao Tong University
2021

Ubiquitous Energy (United States)
2011-2020

Tohoku University
2018

Chiba University
2016

A method to bond silicon wafers directly at room temperature was developed. In this method, surfaces of two samples are activated by argon atom beam etching and brought into contact in a vacuum. By the infrared microscope KOH no void bonded interface detected all specimens tested. tensile test, fracture occurred not but mainly bulk silicon. From these results, it is concluded that realizes strong tight bonding promising assemble small parts made wafer process.

10.1063/1.115865 article EN Applied Physics Letters 1996-04-15

10.1016/j.jcis.2004.07.017 article EN Journal of Colloid and Interface Science 2004-09-14

Abstract Detection of volatile organic compounds (VOCs) using weight-detectable quartz microbalance and silicon-based microcantilever sensors coated with crystalline metal-organic framework (MOF) thin films is described in this paper. The two MOFs were grown from COOH-terminated self-assembled monolayers onto the gold electrodes sensor platforms. MOF layers worked as effective concentrators VOC gases adsorption/desorption processes VOCs could be monitored by frequency changes sensors....

10.1038/srep06247 article EN cc-by Scientific Reports 2014-09-01

Microelectromechanical system (MEMS) pressure sensors based on silicon are widely used and offer the benefits of miniaturization high precision. However, they cannot easily withstand temperatures exceeding 150 °C because intrinsic material limits. Herein, we proposed executed a systematic full-process study SiC-based MEMS that operate stably from -50 to 300 °C. First, explore nonlinear piezoresistive effect, temperature coefficient resistance (TCR) values 4H-SiC piezoresistors were obtained...

10.1038/s41378-023-00496-1 article EN cc-by Microsystems & Nanoengineering 2023-04-03

In this paper, a three-way microvalve system composed of three independent one-way valve units is presented. Each unit has membrane, which actuated by external negative air pressure. Intervals between the are smaller than 780 µm, opens up possibility realizing high-density array. The small intervals were realized providing with layer microchannels to conduct pressure units. spite extra microchannels, device been fabricated through simple process adopting polydimethylsiloxane (PDMS) as...

10.1088/0960-1317/10/3/317 article EN Journal of Micromechanics and Microengineering 2000-07-10

Using Ar beam etching in vacuum, strong bonding of Si wafers is attained at room temperature. With appropriate time, the occurs spontaneously without any load to force two together. However, surface roughness increases during etching. Because has a influence on wafer bonding, long time degrades strength. atomic microscope, we measured enhancement caused by etching, and investigated relationship between properties such as strength interfacial voids. The results agree well with theoretical...

10.1143/jjap.37.4197 article EN Japanese Journal of Applied Physics 1998-07-01

A micromixer using direct ultrasonic vibration is first reported in this paper. The was induced by a bulk lead-zirconate-titanate (PZT; 5 × 4 0.2 mm), which excited 48 kHz square wave at 150 V (peak-to-peak). Liquids were mixed chamber (6 6 0.06 mm) with an oscillating diaphragm driven the PZT. size of 0.15 mm. Ethanol and water used to test mixing effectiveness. laminar flows ethanol (115 μL/min) (100 effectively when PZT excited. entire process recorded video camera.

10.1002/(sici)1522-2683(20000101)21:1<116::aid-elps116>3.0.co;2-y article EN Electrophoresis 2000-01-01

In this paper, a novel optical method for monitoring of local pressure in microfluidic devices using deformable diffraction grating is presented. A test device was fabricated with transparent silicone elastomer - polydimethylsiloxane (PDMS) the replica moulding technique. The moulded PDMS chip and flat glass plate have bonding interface, which defines 2 mm×2 mm 200 µm wide, 20 deep microchannel. consists 5 rectangular grooves arrayed period 10 µm. All are connected to microchannel, deformed...

10.1088/0960-1317/12/1/301 article EN Journal of Micromechanics and Microengineering 2001-12-19

Piezoelectric bimorph cantilever is a typical structure for vibration energy harvesting. This paper studies the method to improve accuracy of FEA (finite element analysis) simulation piezoelectric cantilever. The COSMOL methods based on 1 D (dimension) model Euler Bernoulli beam, as well 2 and 3 models solid mechanics are proposed respectively. Compared with theory experiment results given by Erturk A, influences material parameters in modeling discussed. error can be reduced less than 1.2%...

10.1063/1.5119328 article EN cc-by AIP Advances 2019-09-01

Abstract The development of excellently stretchable, highly mobile, and sustainable power supplies is great importance for self‐power wearable electronics. Transpiration‐driven hydrovoltaic generator (HPG) has been demonstrated to be a promising energy harvesting strategy with the advantages negative heat zero‐carbon emissions. Herein, this work demonstrates fiber‐based stretchable HPG high output, portability, knittability, generation. Based on functionalized micro‐nano water diffusion...

10.1002/smll.202306318 article EN Small 2023-11-10

Abstract Flexible electronics have demonstrated various strategies to enhance the sensory ability for tactile perception and wearable physiological monitoring. Fibrous microstructures attracted much interest because of their excellent mechanical properties fabricability. Herein, a structurally robust fibrous mat was first fabricated by electrospinning, followed sequential process functionalization utilizing ultrasonication treatment in situ polymerization growth. Electrospun polyurethane...

10.1038/s41378-023-00593-1 article EN cc-by Microsystems & Nanoengineering 2023-09-15

10.1016/s0924-0136(02)00119-x article EN Journal of Materials Processing Technology 2002-09-01

This letter reports on the formation of a layered film structure and highly improved photovoltaic output lead lanthanum zirconate titanate (PLZT) employed. The current PLZT per unit width was more than 102 times larger that bulk PLZT, while voltage thickness in almost same as ceramics. These differences are due to characteristics configuration electrode. A simple model is used for phenomenological explanation effect film.

10.1063/1.1641528 article EN Applied Physics Letters 2004-01-13

Abstract This paper describes the detection of volatile organic compounds (VOCs) through analyses two output signals from integrated microcantilever sensor arrays coated with organic‐inorganic hybrid sensing layers. The surface TiO 2 porous films was modified by amphiphilic terthiophene monomers and adsorbed were polymerized at nanoparticles. covered polythiophene layers worked as highly sensitive interfaces to provide for weight resistance changes during exposure VOC vapor. When onto dyed...

10.1002/adfm.201101953 article EN Advanced Functional Materials 2011-11-25

In this work, the Cu electrodeposition was carried out for filling of through silicon via (TSV) using an additive-free electrolyte and periodic pulse reverse (PPR) current. It attempted to understand mechanism by PPR plating then explore a potential solution void-free in easy electrolytes. The results showed that void size continually reduced as decreasing current density. A obtained at low During growth process, "V" shape structure occurred upper ratio increased with decrease...

10.1149/2.073405jes article EN Journal of The Electrochemical Society 2014-01-01
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