A5101833495- Heat Transfer and Optimization
- Heat Transfer Mechanisms
- Heat and Mass Transfer in Porous Media
- Nanofluid Flow and Heat Transfer
- Heat Transfer and Boiling Studies
- Phase Change Materials Research
- Water Systems and Optimization
- Flow Measurement and Analysis
- Superconducting Materials and Applications
- 3D IC and TSV technologies
- Physics of Superconductivity and Magnetism
- Cyclone Separators and Fluid Dynamics
- Aerosol Filtration and Electrostatic Precipitation
- Spacecraft and Cryogenic Technologies
- Engineering Applied Research
- Lattice Boltzmann Simulation Studies
- Metallurgical Processes and Thermodynamics
- Geothermal Energy Systems and Applications
- Climate change and permafrost
- Geophysical Methods and Applications
- Adsorption and Cooling Systems
- Thermal properties of materials
- Hydraulic and Pneumatic Systems
- Electrostatic Discharge in Electronics
- Solidification and crystal growth phenomena
China University of Petroleum, East China
2015-2025
China Energy Engineering Corporation (China)
2019-2025
Wenzhou University
2020-2024
Wenzhou University of Technology
2022-2024
Nanjing University of Posts and Telecommunications
2010-2020
Zhejiang Province Institute of Architectural Design and Research
2019
Huazhong University of Science and Technology
2012
Xi'an Jiaotong University
2012
China University of Petroleum, Beijing
2008
Although the dynamic van der Waals model has great potential in numerically simulating pool boiling, it is still limited to low liquid–vapor density ratios (about 10:1) due inherent thermodynamic inconsistency. This study proposes a consistency simplified simulate boiling with large ratios. based on relationship associating gradients of temperature and generalized chemical divergence reversible viscous stress tensor. A novel semi-discrete numerical algorithm that satisfies for this...
The phenomenon of coupled flow between free and porous media is characteristic fluid flowing across media, but the slip characteristics at coupling interface need to be further studied. purpose this work investigate velocity distribution turbulence with a high Reynolds number above in media. In paper, visual flume test bench built simulate as an accumulation spherical glass beads diameter 10 mm. crossing inside are measured by ultrasonic Doppler velocimetry. effects number, relative water...
Thermal management of microchips and integrated circuits becomes a more serious problem, since the density transistors grows. In this paper, new microchannel cooling method, heat sink with dimples, is investigated respect to transfer flow resistance for electronics thermal management. Five types sink, viz. one smooth channel, wavy three channels were studied by numerical method. The sizes single module are all 1 mm × 20 mm; equivalent diameters channel inlet 500 µm; flux W/mm2 set on bottom...
The present study presents a concept of biporous metal foam heat sink applicable to electronic cooling. This has two layers arranged in parallel along the primary flow direction, with different thickness, porosity, and pore density for each layer. forced convective transfer is numerically investigated by employing Forchheimer–Brinkman extended Darcy momentum equation local thermal nonequilibrium energy equation. effects geometrical morphological parameters on hydraulic performance are...
Abstract Experimental results of ultralightweight compact heat sinks with open-celled copper (Cu) foams under the impingement axial fan flows are presented. The thermal resistance system and pressure coefficient on sink base plate were measured, focusing influences foam height (Hf ) impinging distance between exit (H). With fixed at H/D = 0.5 (D being diameter), it is demonstrated that an optimum exists Hf /D 0.22, providing lowest resistance. Furthermore, reducing to level reduces further....