A5071981195- Electronic Packaging and Soldering Technologies
- Electromagnetic Effects on Materials
- X-ray Diffraction in Crystallography
- Crystallization and Solubility Studies
- Copper Interconnects and Reliability
- Thermal properties of materials
- 3D IC and TSV technologies
- Ferroelectric and Piezoelectric Materials
- Advanced battery technologies research
- Microstructure and mechanical properties
- Advancements in Battery Materials
- Microwave Dielectric Ceramics Synthesis
- Electrodeposition and Electroless Coatings
- Supercapacitor Materials and Fabrication
- Semiconductor materials and interfaces
- Metallurgical and Alloy Processes
- Intermetallics and Advanced Alloy Properties
- Advanced Welding Techniques Analysis
- Crystallography and molecular interactions
- Advanced Battery Materials and Technologies
- Electrocatalysts for Energy Conversion
- Advanced materials and composites
- Advanced ceramic materials synthesis
- Acoustic Wave Resonator Technologies
- Dielectric materials and actuators
Tianjin University
2016-2024
Chinese Academy of Sciences
2013-2024
North China Institute of Science and Technology
2024
Southern Medical University Shenzhen Hospital
2024
University of Science and Technology of China
2016-2023
Fujian Electric Power Survey & Design Institute
2018-2022
Ningxia University
2019
University of Jinan
2015
Institute of Metal Research
2002-2013
International Centre for Materials Physics
1993-2001
Abstract Layered vanadium oxides are promising cathode materials for zinc‐ion batteries (ZIBs) owing to their high capacity, but the sluggish electron/ion migration kinetics and structural collapse/dissolution severely limit Zn 2+ ‐storage performance. Herein, poly(3,4‐ethylenedioxythiophene) coated Mn ‐intercalated with rich oxygen vacancies (MnVOH@PEDOT) prepared as cathodes ZIBs. The PEDOT coating, synergistic vacancies, tailors electron conductivity, ‐intercalation enlarges interlayer...
The practical applications of solar-driven water splitting pivot on significant advances that enable scalable production robust photoactive films. Here, we propose a proof-of-concept for fabricating films by particle-implanting technique (PiP) which embeds semiconductor photoabsorbers in the liquid metal. strong semiconductor/metal interaction enables resulting efficient collection photogenerated charges and superior photoactivity. A photoanode liquid-metal embraced BiVO
Abstract Vanadium oxides (VO x ) feature the potential for high‐capacity Zn 2+ storage, which are often preintercalated with inert ions or lattice water accelerating migration kinetics. The inertness of these species storage and their incapability conducting electrons, however, compromise capacity rate capability VO . Herein, Ni‐BTA, a 1D conductive metal–organic framework (c‐MOF), is intercalated into interlayer space by coordinating organic ligands preinserted Ni Ni‐BTA improves...
In this letter, it is found that when the critical electric current pulse (ECP) passes through a Cu–Zn alloy with lead inclusions, those inclusions will disappear and transfer into grain boundaries or defects, forming many dispersed small particles of lead. Such kind can be produced by no other heat treatments than ECP. The theoretical analysis points out phenomenon attributed to its specific effect on reducing considerably diffusion activation energy in alloy. Therefore, ECP treatment would...
In this paper, microstructure evolution in metals induced by high density electric current pulses (ECPs) treatment, such as grain refinement, formation of oriented and redistribution inclusions, is carefully reviewed. The mechanism for these evolutions discussed. It suggested that there are usually several factors working during ECP: Joule heating (including temperature rise, the rate cooling rate), stress thermal compressive stress, skin effect, electron wind force) free energy change...
Abstract The low‐cost and high‐safety zinc‐ion batteries (ZIBs) are expected to be promising alternatives of lithium‐ion (LIBs). Nevertheless, sluggish kinetics unstable structure cathode lead the low‐rate capability poor cycling stability ZIBs, which severely hinder their commercial application. Herein, a (NH 4 ) x MnO 2 with ammonium ions + pre‐intercalation is reported. NH small molar mass expand layer spacing, accelerating ion diffusion act as “structural pillars”, preventing structural...
The relationship between the “polarity effect” of electromigration on interfacial intermetallic growth and Sn grain orientation was investigated in Sn-Ag-Cu solder joints. compound found to depend strongly orientation. When c-axes grains were closely aligned current flow direction, a severe polarity effect observed which anode interface covered with thick layer Cu-Sn while at cathode almost depleted. If rotated away from became less pronounced. c-axis perpendicular essentially disappeared....
A copper electroplating using single JGB additive was developed for through silicon via (TSV) filling. The micro-vias were perfectly void-free filled by additive. electrochemical analysis demonstrated a "bottom-up" deposition mode "V" shaped filling attributed to gradient suppressing effect along the micro-via depth. microstructure mainly contained fine equiaxed grains while PEG-SPS large columnar grains.
1-day vulnerabilities in binaries have become a major threat to software security. Patch presence test is one of the effective ways detect vulnerability. However, existing patch works do not perform well practical scenarios due interference from various compilers and optimizations, patch-similar code blocks, irrelevant functions stripped binaries. In this paper, we propose novel approach named PLocator, which leverages stable values both its context, extracted control flow graph, accurately...