Compositions in the Zn 2 TiO 4 + x system ( = 0–0.43) were synthesized via solid‐state reaction route, using high‐purity (≥99.99%) metal‐oxide powders. The incorporation of titanium, form , spinel ceramics was investigated by analyzing crystal structure and measuring dielectric properties. results analyses suggested that levels ≤ 0.33 could be incorporated into at temperatures T > 945°C, whereas solid solubility titanium decreased for < 945°C. When ≥ 0.28, Ti 3 O 8 phase formed grain...

Order-disorder transition of Ba(Ni 1/3 Nb 2/3 )O 3 ceramics was investigated using X-ray diffraction, transmission electron microscopy, and energy-dispersive spectroscopy. Before sintering samples were pre-fired at 1300° C for 100 h to achieve higher chemical homogeneity. A from ordered disordered state observed 1500° the accompanied by formation liquid phases. The compositions phases analyzed Microwave dielectric properties measured post resonator method cavity method. Variations such as...

Low-temperature solderless Cu-Cu bonding is an important technology for advanced packaging, such as fine-pitch 3-D packaging and heterogeneous integration. In this study, we prepared oxidation-free Cu surface using optimized N <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> plasma process in a two-step Ar/N treatment based on the design of experiment method, to improve direct quality at 260 °C. The was Minitab optimizer with chemical...

Low-temperature Cu-Cu bonding technology plays a key role in high-density and high-performance 3D interconnects. Despite the advantages of good electrical thermal conductivity potential for fine pitch patterns, Cu is vulnerable to oxidation high temperature process. In this study, chip-level using an Ag nanofilm at 150 °C 180 was studied air, effect investigated. A 15-nm prevented prior process air. process, diffused rapidly interface pure occurred. However, some observed due short time 30...

An in-pile performance test of HANA claddings was conducted at up to 67 GWD/MTU in the Halden research reactor Norway over a 6.5 year period. Four types (HANA-3, HANA-4, HANA-5, and HANA-6) reference Zircaloy-4 cladding were used for test. The evaluation parameters corrosion behavior, dimensional changes, hydrogen uptake, tensile strength after tested under simulated operation conditions Korean commercial reactor. oxide thickness ranged from 15 37 mm high flux region rods, all showed...

While device scaling of planar devices faces physical limitations, vertically stacked are becoming more important due to package miniaturization, cost reduction and enhanced functionality. 3D packaging technology improves performance electrical signal power integrities, becomes a key for the next generation heterogeneous integration. We demonstrated both Cu-Cu bonding SiO2-SiO2 at 300°C under 700 kPa using two step Ar-N2 plasma treatment process prior bonding. Currently, it is difficult...

One of the key requirements for mass production die-to-wafer Cu bonding is preventing copper surface oxidation. In this study, utilizing an Ag nanolayer was examined to achieve both oxidation prevention and low-temperature bonding. The primary focus evaluate impact annealing process on quality. coated with a 15-nm-thick layer using evaporation technique. wafer-to-wafer performed at temperature 180 °C 30 min, followed by 200 60 min. resulted in complete diffusion into interface, leading...

Using various particle sizes of starting , we investigated the effect stress on dielectric - temperature characteristics cerium-modified barium titanate. Transmission electron microscopy and energy dispersive spectroscopy confirmed three distinct areas: a grain core, shell, gradient regions. The size volume fractions core were somewhat proportional to . will be explained in terms inhomogeneous regions internal stress. characteristic large grains proved function variation values, whereas that...

Since improvement of wireless communication, IP based mobility management protocols have been studied to provide seamless communication and management. The vehicular ad hoc network (VANET) is one protocols, especially providing connection with inter/intra/inner vehicle communication. However, each moves fast that causes short-lived connections Access Router (AR). Based on vehicles' characteristic, it hard the availability services in VANET. most critical issue design scalable routing...

This article presents a filter design approach and the efficiency analysis of single-phase Neutral Point Clamped (NPC) three-level inverter with combined LC trap LCR system. The multilevel system using NPC type is suitable for high-power application. operates normally at low switching frequency. proposed comprised conventional output filter. By adding an filter, need low-value damping resistor cut-off frequency eliminated. Use high-value increases controller used DSP (TMS320C31)....