An innovative approach for covalent‐bond‐activated mechanoresponse by complexing rhodamine or spiropyran with cyclodextrin (CD) is reported. This endows diverse fluorophores perfect mechanochromism introducing a supramolecular system. Unique characteristics such as noncovalent chemical modification and convenient preparation make this promising practical applications. The strong hydrogen bonds provided CD play crucial role in triggering the mechanochromic switch. First, seize both sides of...

The interaction mechanism between zein and chlorogenic acid (CA) the effect of on performance coaxial nanofiber films were investigated. interactions CA characterized by multiple spectroscopic methods. Ultraviolet spectrum analysis revealed formation a zein-CA complex. Fluorescence pointed out that quenching was static. FTIR thermodynamic analyses showed hydrogen bonds electrostatic dominated CA. Zein-based successfully prepared electrospinning. enhanced mechanical properties but reduced...

The precipitation hardening is widely applied to strengthen Al alloys. Here, we report an alternative way achieve high-strength alloys via forming the dislocation gradient through pre-torsion. Remarkably, exhibit a sharp increase in ultimate tensile strength up 605 MPa yet nearly without reducing uniform elongation, thereby outperforming their counterparts. superior strength–ductility combination ascribed excellent strengthening and strain effects stemming from substantial...

Dual pH- and light-responsive nanomicelles self-assembled from amphiphilic random poly(methacrylic acid-co-methyl methacrylate-co-7-(4-vinylbenzyloxyl)-4-methylcoumarin) (P(MAA-co-MMA-co-VM)) have been successfully prepared employed as particulate emulsifiers to stabilize the oil/water interface. The self-assembling behavior of copolymers in a selective solvent is explored. structural transitions CP55 micelles based on copolymer with 55 mol % hydrophilic methacrylic acid units are...

Dual-functional emulsifying/antifogging polymeric micelles have been prepared by the self-assembly of poly(2-(dimethylamino)ethyl methacrylate-co-methyl methacrylate-co-7-acryloxy-4-methylcoumarin) P(DMAEMA-co-MMA-co-AOM). On one hand, spherical morphology and exhibit triple responsive behaviors. The sample with DMAEMA/MMA/AOM molar ratio 5/3/3 (T2) is chosen to investigate influence pH on emulsifying performance, configuration oil/water interface investigated. amount arranged surface...

This work demonstrates the fabrication of controllable morphology micrometer copper columns using localized electrochemical deposition (LECD) process, which is critical for MEMS and semiconductor related applications. Different morphologies deposited micro-columns can be obtained by controlling applied potential initial distance between electrodes LECD. Additionally, four kinds morphological models, i.e., cylinder structure, conical dendritic structure vine were proposed to define varied...

Defect-free filling of through-silicon-via (TSV) with high depth is still a challenge to obtain in the industry. Herein, physical quantities, i.e. deposited copper morphology, local current density, coverage additives and concentrations additives, were investigated process TSV depth. It was found that density controlled by accelerator. And competitive adsorption dominated suppressor. Therefore, limited diffusion suppressor gave rise pinch-off defect Moreover, ultrasonic vibration used...

The process of localized electrochemical deposition (LECD) offers the potential to fabricate complex structures using layer-by-layer movement an anode or a cathode, similar 3D printing. This work demonstrates fabrication micro sized copper walls LECD process, which is critical for MEMS and semiconductor-related applications. First, with different morphologies were deposited by moving layer controlling applied voltage between electrodes during LECD. Next, effect trajectory (layer height step...

Through-silicon-via (TSV) filling with optimum electrodeposition parameters is still a challenge in the industry, especially for via different depths. Herein, effects of depth on current density and patterns were investigated. It was found that deeper via, lower density. At low (4 mA cm−2), only affects size defect, but does not change pattern. However, at medium (7 pattern changes from super-conformal to sub-conformal increase depth, pinch-off position remaining constant about 70 µm top...

Endothelial dysfunction/loss is a key event in the development of vascular diseases, including native atherosclerosis (AS). Recent studies have shown that endothelial progenitor cells (EPCs) ability to repair been lost or damaged following AS. As result, therapy transplanting EPCs promising option for treatment However, therapeutic effect on AS with only transplantation has not satisfactory. The upregulation those genes, which prevent progress EPCs, novel strategy Because it can reduce...

Abstract An efficient macromolecular emulsifier as water‐tolerant antifogging coating based on coumarin‐containing copolymeric micelles is reported. Compared to the previous work using poly(methyl methacrylate‐co‐2‐(dimethylamino)ethyl methacrylate), coumarin unit in copolymer‐based can be photo‐crosslinked under UV light form an interchain network, successfully avoiding use of chemical crosslinking agents.

Current density is one of the process parameters with most significant effect on TSV filling. However, mechanism analysis influence current filling morphology lacks experimental demonstration. In this work, electrochemical deposition experiments and were carried out to investigate copper within deep high aspect ratio. Three typical morphologies corresponding evolution plating observed. Additionally, competitive adsorption relationship between accelerator suppressor was discussed based...

Through-silicon-via (TSV) is an advanced 3D electronic integration technology. In order to achieve the defect-free filling of deep TSV, forced convection commonly applied during TSV process. this study, interaction effect and current density on process systemically investigated. The morphology electrodeposited with different stirring rate were observed by scanning electron microscope (SEM). phenomenon that reduces ratio at low but promotes high was discovered. Additionally, influence results...

Based on the acoustic emission (AE) system and digital scattered-spot deformation monitoring system, uniaxial compression tests were conducted composite samples consisting of sandstone cemented coal gangue–fly ash backfill (CGFB) to investigate their failure characteristics. The results showed that average compressive strength was 83.09% higher than pure CGFB 92.28% lower samples. In samples, damage occurred in part, they obvious plastic On both sides intersection, deformed synergistically...