A5012076709- Epoxy Resin Curing Processes
- Fiber-reinforced polymer composites
- Polymer crystallization and properties
- Synthesis and properties of polymers
- Recycling and Waste Management Techniques
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Injection Molding Process and Properties
- Antimicrobial agents and applications
- Additive Manufacturing and 3D Printing Technologies
- Marine Biology and Environmental Chemistry
- Microplastics and Plastic Pollution
- bioluminescence and chemiluminescence research
- Mechanical Behavior of Composites
- Graphene research and applications
- Bacterial biofilms and quorum sensing
Henkel (Germany)
2025
University of Southern California
2015-2021
Henkel (United States)
2020
Shandong University of Science and Technology
2018-2019
Fully cured carbon fiber-epoxy composite materials are recycled by a manganese and aluminum catalyzed, aerobic catalysis process specifically designed for high-performance amine-linked epoxy commonly used in aerospace manufacturing.
As semiconductor chip design transforms to meet the increased functionality, performance, and miniaturization needs of applications such as 5G, high-performance computing (HPC) autonomous vehicles, advances in packaging materials technologies have become crucial enable tighter pitches, higher interconnect density, complexity new architectures. Liquid compression molded underfill (L-MUF) has drawn attention a wafer level material for its capability gap fill over mold simultaneously under low...
Complex structures manufactured using low-pressure vacuum bag-only (VBO) prepreg processing are more susceptible to defects than flat laminates because of complex compaction conditions present at sharp corners. Consequently, effective defect mitigation strategies required produce structural parts. In this study, we investigated the relationships between laminate properties, conditions, mold designs, and part quality in order develop science-based guidelines for manufacture Generic consisting...
Wafer level encapsulation is an important packaging process for several components in mobile and high-performance computing applications. In applications, electronic like application processors, radio-frequency System Package (RF-SiP) antenna modules are being manufactured using wafer fan-out processes. HPC, used chip-on-wafer (CoW) processing 2.5D / 3D that enables of processors high band width memory devices. Although encapsulant materials currently mass production, many pain points remain...
Wafer level encapsulation has become increasingly important to build up components for mobile and high-performance computing applications. Ranging from system-in-package antenna modules high band-width memory device, many of those wafer-level applications demand new features encapsulant materials. Besides provide mechanical protection, encapsulants are preferred bring in extra features: a) reducing package warpage during processing; b) being EU REACH compliant, c) showing excellent...