A5102935799- Mechanical Behavior of Composites
- Structural Response to Dynamic Loads
- High-Velocity Impact and Material Behavior
- Terahertz technology and applications
- Composite Structure Analysis and Optimization
- Neuroscience and Neural Engineering
- Automotive and Human Injury Biomechanics
- Polymer Nanocomposites and Properties
- Ultrasonics and Acoustic Wave Propagation
- Cellular and Composite Structures
- Vibration and Dynamic Analysis
- Neurogenesis and neuroplasticity mechanisms
- Mechanical Engineering and Vibrations Research
- Electronic Packaging and Soldering Technologies
- Topology Optimization in Engineering
- Superconducting and THz Device Technology
- 3D IC and TSV technologies
- Tribology and Wear Analysis
- Structural Behavior of Reinforced Concrete
- Thermography and Photoacoustic Techniques
- Material Properties and Processing
- Adhesion, Friction, and Surface Interactions
- Advanced Materials and Mechanics
- Photonic and Optical Devices
- Transportation Safety and Impact Analysis
Hanyang University
2009-2019
Anyang University
2016-2017
In this paper, the warpage simulation of a high-density multilayer printed circuit board (PCB) for solid-state disk drive (SSD) and microelectronic package was performed using anisotropic viscoelastic shell modeling technique. The thermomechanical properties various copper patterns were homogenized with model, which considered their properties. Then, simulations an SSD PCB unit/array full performed; these accounted initial that occurred during fabrication ABAQUS combined user-defined...
Warpage of multi-layered printed circuit boards (PCB) during the reflow process is a serious problem which affects reliability solder ball connections between PCB and mounted semi-conductor packages in electronic devices. It essential to predict warpage accurately; however, complicated copper patterns PCBs render full modeling analysis impossible due excessive computing time required. To overcome this problem, we have developed analytical equations three Cu (line, square, grid) for...
Generally, the thermal residual stress which is generated during curing process of an adhesive significantly decreases tensile load capability adhesively bonded joints. In this work, a smart cure cycle with abrupt cooling and postcuring at room temperature was devised to eliminate produce sufficient interfacial wetting. For monitoring controlling reaction, dielectrometry used, where dissipation factor joint measured. These results showed that fabricated by greatly enhanced because reduced,...
The neurotrophic effects of Nerve growth factor (NGF) on basal forebrain cholinergic neurons are well established. However, its potential actions as a fast-acting neuromodulator and the related receptor not understood. aim this study is to investigate NGF-induced spatiotemporal neuronal activity changes in cultured rat organotypic hippocampal slices (OHCs), using multielectrode array (MEA) system. NGF treatment rapidly produced long-term potentiation (LTP) like field excitatory post-synaptic...