Jiho Lee

ORCID: 0000-0003-2408-2808
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About
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Research Areas
  • Additive Manufacturing and 3D Printing Technologies
  • 3D Printing in Biomedical Research
  • Energy Harvesting in Wireless Networks
  • Advanced Sensor and Energy Harvesting Materials
  • Dental materials and restorations
  • Manufacturing Process and Optimization
  • Multilevel Inverters and Converters
  • Silicon Carbide Semiconductor Technologies
  • Innovative Energy Harvesting Technologies
  • Antenna Design and Analysis
  • Photopolymerization techniques and applications
  • Thin-Film Transistor Technologies
  • Conducting polymers and applications
  • Advanced DC-DC Converters
  • Full-Duplex Wireless Communications
  • Electrospun Nanofibers in Biomedical Applications
  • Laser and Thermal Forming Techniques
  • Magnesium Alloys: Properties and Applications
  • UAV Applications and Optimization
  • Shape Memory Alloy Transformations
  • Metallurgy and Material Forming
  • Dental Implant Techniques and Outcomes
  • Advanced Cellulose Research Studies
  • Endodontics and Root Canal Treatments
  • Stochastic Gradient Optimization Techniques

Korea Advanced Institute of Science and Technology
2019-2025

Seoul National University
2024

UCLouvain Saint-Louis Brussels
2024

Bridge University
2024

Yonsei University
2024

Hyundai Motors (South Korea)
2024

Korea Electronics Technology Institute
2023

Korean Academy of Science and Technology
2023

Korea University
2020-2021

Kootenay Association for Science & Technology
2019

This paper presents our extensive investigation of the security aspects control plane procedures based on dynamic testing components in operational Long Term Evolution (LTE) networks. For LTE networks, we implemented a semi-automated tool, named LTEFuzz, by using open-source software over which user has full control. We systematically generated test cases defining three basic properties closely analyzing standards. Based property, LTEFuzz generates and sends to target network, classifies...

10.1109/sp.2019.00038 article EN 2022 IEEE Symposium on Security and Privacy (SP) 2019-05-01

The low mechanical properties and printing speed of fused filament fabrication (FFF) have remained important barriers to their widespread adoption in the industry. This study focused on proposal a layer stacking scheme that increases reduces time through continuously varied Infill Pattern (ConVIP). ConVIP method showed 15.2% 40% ultimate tensile strength, elongation at break, compared conventional infill pattern within polylactic acid (PLA) filament. In addition, had been increased by 29.37%...

10.1016/j.jmrt.2022.02.133 article EN cc-by-nc-nd Journal of Materials Research and Technology 2022-03-08

This study evaluated the fracture resistance, biaxial flexural strength (BFS), and dynamic mechanical analysis (DMA) of three-dimensional (3D) printing resins for esthetic restoration primary molars. Two 3D resins, Graphy (GP) NextDent (NXT), a prefabricated zirconia crown, NuSmile (NS), were tested. GP NXT samples printed using workflow recommended by each manufacturer. Data collected statistically analyzed. As result resistance test 0.7-mm-thick resin crowns with thickness similar to that...

10.3390/children9101445 article EN cc-by Children 2022-09-22

Among the various 3D printing methods, direct ink writing (DIW) through extrusion directly affects microstructure and properties of materials. However, use nanoparticles at high concentrations is restricted due to difficulties in sufficient dispersion deteriorated physical nanocomposites. Thus, although there are many studies on filler alignment with high-viscosity materials a weight fraction higher than 20 wt %, not much research has been done low-viscosity nanocomposites less 5 phr....

10.1021/acsomega.3c01165 article EN cc-by-nc-nd ACS Omega 2023-06-20

10.1007/s42835-024-01812-z article EN Journal of Electrical Engineering and Technology 2024-02-27

<title>Abstract</title> This study presents a novel technique for the direct 3D printing of TC-85, biocompatible material specifically designed orthodontic uses. method aims to overcome biomechanical constraints associated with conventional thermoforming process used in aligner fabrication. The investigation emphasizes analyzing TC-85's mechanical and viscoelastic properties, focusing on how temperature changes impact these characteristics their relevance clinical outcomes. Using Digital...

10.21203/rs.3.rs-4106282/v1 preprint EN cc-by Research Square (Research Square) 2024-05-07

This article presents an energy-harvesting (EH) interface chip system for triboelectric nanogenerators (TENGs). Despite TENG's numerous advantages, its high open-circuit voltage and large parasitic capacitance ( <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$C_{T}$ </tex-math></inline-formula> ) give a considerable burden to design TENG-EH integrated circuits (ICs). In this work, scalable...

10.1109/jssc.2022.3193738 article EN IEEE Journal of Solid-State Circuits 2022-08-02

This paper presents an OLED/μLED display driver IC with cascaded loading-free capacitive interpolation (LFCI) DAC and a high-slew buffer amplifier. The 12-bit color-depth is realized by combination of 7-bit R-DAC proposed 5-bit LFCI while occupying only 295×17μm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> , which ×2 reduction compared to the state-of-the-art. In-pixel MSB-conversion also presented reduce chip size further. 5V...

10.23919/vlsicircuits52068.2021.9492490 article EN Symposium on VLSI Circuits 2021-06-13

In this paper, we investigate the system outage performance of full-duplex (FD) two-way relay networks where all nodes are equipped with FD multiple-input multiple-output (MIMO) capability and two sources exchange information via decode-and-forward (DF) protocol in consecutive time slots. order to completely separate desired signal interference, consider a finite size buffer at relay. We propose zero-forcing based beamforming schemes for different cases buffer-aided non-buffer-aided derive...

10.1109/tvt.2020.3000603 article EN IEEE Transactions on Vehicular Technology 2020-06-08

Abstract We consider infinitely wide multi-layer perceptrons (MLPs) which are limits of standard deep feed-forward neural networks. assume that, for each layer, the weights an MLP initialized with independent and identically distributed (i.i.d.) samples from either a light-tailed (finite-variance) or heavy-tailed distribution in domain attraction symmetric $\alpha$ -stable distribution, where $\alpha\in(0,2]$ may depend on layer. For bias terms we i.i.d. initializations having same parameter...

10.1017/apr.2023.3 article EN Advances in Applied Probability 2023-07-03

Increasing power density—delivering more in a smaller footprint—stands as pervasive trend across multiple markets, including the sector for buck DC-DC converters. One of cardinal challenges achieving optimized density is navigating intrinsic trade-off between an inductor's volume and its parasitic DC resistance (DCR); miniaturizing inductor invariably leads to elevated DCR. To enhance efficiency even when using compact inductors, many hybrid converter topologies have been investigated [1–4]....

10.1109/isscc49657.2024.10454535 article EN 2022 IEEE International Solid- State Circuits Conference (ISSCC) 2024-02-18

The members of the avidin protein family are well known for their high affinity towards d-biotin and structural stability. These properties make avidins a valuable tool various biotechnological applications. In present study, two avidin-like biotin-binding proteins (named streptavidin C1 C2) from Streptomyces cinnamonensis were newly identified while exploring antifungal against Fusarium oxysporum f. sp. cucumerinum. Streptavidin reveals low correlation (a sequence identity approximately...

10.1107/s2052252520015675 article EN cc-by IUCrJ 2021-01-11

Triboelectric nanogenerators (TENGs) for collecting ambient mechanical vibration energy have gained popularity as a next-generation source owing to their numerous advantages including flexibility, high conversion efficiency, and low cost. However, ultra-high instantaneous open-circuit voltage (~110V) is the fundamental feature of TENGs, thus they are not very compatible with integrated circuits. Recent TENG-harvesting chips [1]–[3] fabricated in high-voltage BCD been reported be capable...

10.1109/isscc42614.2022.9731605 article EN 2022 IEEE International Solid- State Circuits Conference (ISSCC) 2022-02-20

10.14775/ksmpe.2023.22.11.0043 article EN Journal of the Korean Society of Manufacturing Process Engineers 2023-11-22

This Paper presents an antenna tracker-based web application for seamless and dependable connectivity between drone GCS (Ground Control System) interworking using IoT (internet of things) platform. Autonomous drone-aiming targeting tracker enables effective real-time UAV (unmanned aerial vehicle) operation supportive effortless communication. Proposed system structure supports both RF-based local communication LTE-based global method operation.

10.1109/cscn60443.2023.10453186 article EN 2023-11-06
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