A5101903900- Ferroelectric and Piezoelectric Materials
- Microwave Dielectric Ceramics Synthesis
- 3D IC and TSV technologies
- Acoustic Wave Resonator Technologies
- Multiferroics and related materials
- Microwave Engineering and Waveguides
- Dielectric materials and actuators
- Glass properties and applications
- Dielectric properties of ceramics
- Semiconductor materials and devices
- Nuclear materials and radiation effects
- Electromagnetic Compatibility and Noise Suppression
- Phase-change materials and chalcogenides
- Shape Memory Alloy Transformations
- Advanced ceramic materials synthesis
- Advanced Antenna and Metasurface Technologies
- Microstructure and Mechanical Properties of Steels
- Electronic Packaging and Soldering Technologies
- Chalcogenide Semiconductor Thin Films
- Silicon Nanostructures and Photoluminescence
- Magnetic Properties and Applications
- Antenna Design and Analysis
- Copper Interconnects and Reliability
- Perovskite Materials and Applications
- GaN-based semiconductor devices and materials
University of Electronic Science and Technology of China
2016-2025
National Engineering Research Center of Electromagnetic Radiation Control Materials
2016-2025
First Affiliated Hospital of Hebei Medical University
2025
Hebei Medical University
2025
State Key Laboratory of Electronic Thin Films and Integrated Devices
2009-2024
Institute of Microelectronics
2005-2023
Tongji University
2022
Harbin Institute of Technology
2021
Chengdu University
2020
Corteva (United States)
2020
The integrity and reliability of signal transmission in glass 3-D integrated circuits (ICs) can be improved by studying the effect sidewall roughness through-glass vias (TGVs) on microwave performance. Thus, this study, different TGVs electrical characteristics, such as loss, delay, impedance correction factors, are analyzed extracting S-parameters from CPW-TGVs-CPW model. An accurate RLGC model that considers is proposed. factor inductance verified found to greater than resistance through...
In this letter, a compact and high-performance filter based on single-layer slow wave substrate integrated waveguide (SW-SIW) is proposed. The topology integrates through vias blind glass using laser-induced wet etching (LIWE) (TGVs) technology. Compared to the printed circuit board (PCB) process, adopted TGV technology shows advantages of high precision, integration, simplified process. Meanwhile, according different application scenarios, LIWE process can be used prepare proposed filters...
The sidewall roughness of through-glass vias (TGVs) at high frequencies significantly impacts the integrity and reliability signal transmissions via inductance resistance-correction factors resulting from combined effect skin depth roughness. Here, to further investigate generation mechanism correction factors, a hemispherical physical model actual TGVs is proposed, <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math...
Abstract As most commonly used miniature solid‐state dosimeter, metal‐oxide‐semiconductor field effect transistors (MOSFETs) have been facing unavoidable gate leakage and robustness problems due to the double‐sided role of traps in oxide insulators. Herein, a new solution for X‐ray dosimeter has proposed which leverages conductivity change amorphous Ga 2 O 3 (a‐Ga ) channel instead charge trapping Increasingly negatively‐shifted threshold voltage (V th a‐Ga thin‐film transistor is recorded...
Tumor-initiating cells (TICs) play a pivotal role in the unfavorable outcomes of laryngeal tumor proliferation, recurrence, and resistance to chemoradiotherapy. This study aims explore expression CD271 (p75 neurotrophin receptor (p75NTR) human laryngocarcinoma Hep2 unravel its potential biological functions as marker TICs. Immunomagnetic cell sorting was utilized separate subsets Hep-2 based on high low levels CD271. Various aspects such proliferation activity, colony formation ability,...
CsPbX<sub>3</sub>(X = Cl<sup>−</sup>, Br<sup>−</sup>, I<sup>−</sup>) halide perovskites are investigated focusing on their triboelectric charging behaviors. A modified series containing inorganic is established with the order of CsPbBr<sub>3</sub>, CsPbI<sub>2</sub>Br, and CsPbCl<sub>3</sub> from negative to positive.
Compared with silicon-based inductors, the inductors through glass via (TGV) technology have significantly improved in quality ( <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$Q$ </tex-math></inline-formula> ) factor. On basis of TGV technology, a new type 3-D embedded inductor is designed for application scenarios high inductance density. Through this research, preparation process proposed to reduce...
Through glass via (TGV) is an essential complement to vertically interconnected components, which have emerged as a promising option for high-density, multifunctional, and miniaturized integration schemes. Far different from through silicon (TSV), the manufacturing process of TGV determines diversification its morphological structures, such hyperbolic, conical, cylindrical. The hyperbolic prepared by laser-induced etching technique representative persuasive morphology structure...
(1-x) BT-xBiNbO4 (BT-BN, x = 0, 0.05, 0.1, 0.2, 0.3 and 0.4) bulk ceramics were fabricated by conventional solid state method. XRD analysis suggests formation of perovskite structure. With increasing BN (x ≥ 0.1), a ceramic material, the coexistence small quantity secondary phase particles phase, was obtained. Through analyzing characteristics dielectric spectrum P-E hysteresis loops, very stable energy storage density in wide frequency band temperature ranges found BT-BN ceramics. addition...
In order to effectively employ through-glass vias (TGVs) for high-frequency software package design, it is crucial accurately characterize the S-parameters of vertical interconnection structures in 3D glass packaging. A methodology proposed extraction precise using transmission matrix (T-matrix) analyze and evaluate insertion loss (IL) reliability TGV interconnections. The method presented herein enables handling a diverse range interconnections, encompassing micro-bumps, bond-wires, variety...
Despite the promising field emission properties, as-grown carbon nanotubes (CNTs) are far from perfect and need improvement. We report on electron properties of hafnium coated CNTs. The result shows carbide (HfC) can be formed surface CNT films at an annealing temperature 1200 °C. This treatment improves current density, uniformity stability films. improvement by Hf coating benefits formation HfC, which is conductive, inert, robust low work function. approach may provide effective method for...
In nature, fish have gained wonderful swimming ability over the thousands of years evolution. As swims, its body, namely, it's dorsal or tail fin undulates and then alternating waves are sent down body towards tip tail. These generate a jet in wake hence forward force, namely thrust. Scientific studies already shown that undulatory is highly effective means continuous locomotion has been successfully adopted many kinds robotic fishes currently being developed. However, our latest research...