- Advanced Sensor and Energy Harvesting Materials
- Additive Manufacturing and 3D Printing Technologies
- Advanced Materials and Mechanics
- Electronic Packaging and Soldering Technologies
- Conducting polymers and applications
- Adhesion, Friction, and Surface Interactions
- Dielectric materials and actuators
- Nanomaterials and Printing Technologies
- Interactive and Immersive Displays
- Advanced MEMS and NEMS Technologies
- Tactile and Sensory Interactions
- Injection Molding Process and Properties
- Textile materials and evaluations
- 3D IC and TSV technologies
- Neuroscience and Neural Engineering
- Muscle activation and electromyography studies
- Smart Materials for Construction
- solar cell performance optimization
- Silicon and Solar Cell Technologies
- Sensor Technology and Measurement Systems
- Modular Robots and Swarm Intelligence
- Advanced Fiber Optic Sensors
- Semiconductor Lasers and Optical Devices
- Social Robot Interaction and HRI
- Manufacturing Process and Optimization
Ghent University
2016-2025
IMEC
2012-2024
Joint Research Center
2022
Huazhong University of Science and Technology
2019
Purdue University West Lafayette
2019
Southern University of Science and Technology
2019
Southeast University
2019
Imec the Netherlands
2007-2017
Today electronics in “wearable systems” or “smart textiles” are mainly realised on traditional interconnection substrates, like rigid printed circuit boards mechanically flexible substrates. The electronic modules detachable to allow cleaning and washing of the textile. In order achieve a higher degree integration user comfort, technology for stretchable circuits was developed. system is completely embedded an elastomer material polydimethylsiloxane (PDMS, silicone), resulting soft modules....
This paper discusses the optimization of a stretchable electrical interconnection between integrated circuits in terms stretchability and fatigue lifetime. The is based on Cu stripes embedded polyimide-enhanced (PI-enhanced) layer. Design-of-experiment (DOE) methods finite-element modeling were used to obtain an optimal design define guidelines, concerning both stripe layer dimensions material selection. Stretchable interconnects with PI-enhanced fabricated optimized parameters tested. In...
The development and mechanical characterization of a novel technology for stretchable electronics is presented, which can be used the realization wearable textile biomedical implants. devices consist rigid or flexible component islands interconnected with meander-shaped copper conductors embedded in polymer, polydemethylsiloxane. uses standard printed circuit board manufacturing steps liquid injection molding techniques to achieve robust reliable product. device are designed accommodate...
Purpose The purpose of this paper is to present an update on the progress design and reliability stretchable interconnections for electronic circuits. Design/methodology/approach Finite element modelling (FEM) used analyse physical behaviour interconnects under different loading conditions. fatigue life a copper interconnect embedded into silicone matrix has been evaluated using Coffin‐Manson relation FEM. Findings mechanical properties substrate metal interconnection play important role...
The deformation behavior and failure mechanisms of parallel-aligned, horseshoe-patterned, stretchable conductors encapsulated in a polymer substrate were investigated by numerical experimental analyses. A design guideline for the optimal pitch between was proposed through analysis, two extreme cases—fine coarse pitches—were situ observations. results demonstrate that enable elongation up to 123 135% without metal rupture fine pitches, respectively. difference these numbers is much smaller...
Conformable electronics, i.e., electronics that can be applied on curved surfaces, is demanded nowadays in place of conventional rigid printed circuit board (PCB) based for a number applications. In the field stretchable there has been swift progress recent years. this paper we are presenting our contribution to ever growing topic, including thin-film polyimide (PI), supported Au meanders as well PCB Cu meanders. These by PI or poly(ethylene naphthalate)/poly(ethylene terephthalate)...
A method to fabricate thermoplastically deformable electronic circuits is presented, with the intent of achieving low‐cost 2.5D free‐form rigid smart objects. This by utilizing existing flexible circuit technology based stretchable circuits, in combination thermoplastic materials. After fabricating a flat state, thermoforming step shapes device heating it beyond its glass transition temperature, and pushing against mold. Preliminary tests show feasibility simple using off‐the‐shelf...
The integration of electronics into textiles has gained considerable attention in recent years, due to the development and high demand wearable flexible electronics. One promising fields is healthcare, which often involves utilization textile-based electrodes. These electrodes offer advantages such as conformability, breathability, comfort. This article presents 3D-formed together with a narrow fabric-based interconnect system. study showcases methods materials for fabrication system,...
Purpose In the past 15 years stretchable electronic circuits have emerged as a new technology in domain of assembly, interconnections and sensor assembly technologies. meantime wide variety processes with use many different materials been explored this field. The purpose current contribution is for authors to present an approach which inspired by conventional rigid flexible printed circuit board (PCB) technology. Two variants are presented: (SCB) mould interconnect (SMI)....
For user comfort reasons, electronic circuits for implantation in the human body or use as smart clothes should ideally be soft, stretchable and elastic. In this contribution initial results of an MID (moulded interconnect device) technology will presented, showing feasibility functional circuits. developed rigid flexible standard components are interconnected by meander shaped electroplated metallic wires embedded molding a substrate polymer, like silicone rubber polyurethane. The design...
In this paper, we present the developments of a new technology to realize 2.5-/3-D electronic circuits. The starting point is an circuit embedded in hard thermoplastic material, which transformed into shape using thermoforming process. consists stretchable copper interconnections combination with components. produced conventional printed board process steps: sheet laminated on such as Polycarbonate (PC) or Polyethylene Terephthalate Glycol (PET-G). structured lithography and wet etching,...
This contribution describes considerations and very preliminary results in the technology development of thermoplastically deformable electronics sensor circuits, with intention to eventually achieve low-cost fabrication 2.5D free-form rigid smart objects. The is based on one for elastic developed characterized before, which using soft polymers as materials circuit carrier. For 1-time circuits carrier needs be substituted by a thermoplastic material. An additional step thermoforming...
We present a str etchable and foldable passive matrix driven display using 45 by 80 RGB LED's mounted on meandering printed circuitry embedded in polyurethane film. The meander interconnections have been optimized with respect to their electrical mechanical properties provide 3 mm pitch between the pixels stretchability of up 10%. At an operating supply voltage 5 V, brightness exceeds 30 cd/m 2 .