A5101472038- Electronic Packaging and Soldering Technologies
- Aluminum Alloys Composites Properties
- 3D IC and TSV technologies
- Gas Sensing Nanomaterials and Sensors
- TiO2 Photocatalysis and Solar Cells
- Aluminum Alloy Microstructure Properties
- Copper-based nanomaterials and applications
- Chalcogenide Semiconductor Thin Films
- Advanced Welding Techniques Analysis
- Powder Metallurgy Techniques and Materials
- Aerogels and thermal insulation
- Galectins and Cancer Biology
- Copper Interconnects and Reliability
- Intermetallics and Advanced Alloy Properties
Southwest Petroleum University
2023-2024
Kunming University of Science and Technology
2011-2023
Abstract Although Sn3.0Ag0.5Cu solder (SAC305) has higher reliability, there are a large number of harmful voids in joints. Larger can reduce thermal conductivity However, as microstructure growth inhibitor, the influences Ag nanoparticles on not clear at present. Herein, we prove that increase SAC305 solderability, but promote growth. and paste were mixed by mechanical stirring for 0.5 h. Next, SAC305- x P ( = 0, 0.1, 0.2, 0.3, 0.4 wt%) was obtained. The results indicated solderability...
TiO 2 doped with different amounts of Cu 2+ ions (from 0 to 3 mol%) was synthesized by sol-gel method. The samples were characterized X-ray diffraction (XRD) and Fourier-transform infrared spectroscopy (FTIR). XRD analysis showed that the Cu-doped exhibit anatase rutile phases. lattice parameters remain unchanged, independent content. Diameter increased significantly increasing concentrations . investigated results indicate a greater portion are well incorporated into lattices. stretching...
Cu6Sn5-xAg alloys (x = 0, 3, 6; %, mass fraction) were synthesized using Ag as a dopant through high-temperature melting technique. The microstructure of the alloy was analyzed X-ray diffraction (XRD), scanning electron microscopy (SEM), and other equipment, while hardness measured to investigate impact addition on structure Cu6Sn5 intermetallic compound. This study explored influence varying contents properties compounds, with calculations based first principles revealing mechanical density...
<title>Abstract</title> In this study, Ag<sub>3</sub>Sn and Cu<sub>6</sub>Sn<sub>5</sub> nanoparticles were synthesized using the redox method, SAC305-0.15Ag<sub>3</sub>Sn-<italic>x</italic>Cu<sub>6</sub>Sn<sub>5</sub> (<italic>x</italic> = 0 wt%, 0.05 0.1 0.15 0.2 wt%) composite solder was produced by incorporating these into Sn-3.0Ag-0.5Cu (SAC305) solder. The thermal properties, wettability, microstructure, Vickers hardness, tensile strength, reliability of joints in solders...
The purpose of this study is to investigate the influence Cu on TiO2 phase transformation and regioselectivity. samples doped with different amounts Cu2+ ions were synthesized by sol-gel method. vibrational mode characterized X-ray diffraction (XRD), Fourier infrared spectroscopy (FTIR), transmission electron microscope (TEM). XRD analysis shows that lattice parameters have not changed after incorporation. In addition, content rutile increased obviously doping. This indicated addition...