A5100608047- Advanced materials and composites
- Metallurgy and Material Forming
- Microstructure and Mechanical Properties of Steels
- Aluminum Alloys Composites Properties
- Advanced Photocatalysis Techniques
- Metal Alloys Wear and Properties
- Metal and Thin Film Mechanics
- Advanced biosensing and bioanalysis techniques
- Aluminum Alloy Microstructure Properties
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Advanced Surface Polishing Techniques
- High-Temperature Coating Behaviors
- Metal Forming Simulation Techniques
- High Entropy Alloys Studies
- Advanced Nanomaterials in Catalysis
- Metallurgical Processes and Thermodynamics
- Fusion materials and technologies
- Injury Epidemiology and Prevention
- High-Velocity Impact and Material Behavior
- Advanced oxidation water treatment
- Pregnancy-related medical research
- Extracellular vesicles in disease
- Nuclear Materials and Properties
- Nuclear reactor physics and engineering
Huazhong University of Science and Technology
2011-2023
Wuhan Union Hospital
2023
Henan University of Science and Technology
2006-2021
Nanchang University
2015-2021
Central South University
2020
State Council of the People's Republic of China
2016
City University of Hong Kong
2015
Fairchild Semiconductor (United States)
2009-2010
Wuhan National Laboratory for Optoelectronics
2009-2010
Graphitic carbon nitride (g-C3N4) is a new type of metal-free semiconducting material with promising applications in photocatalytic and photoelectrochemical (PEC) devices. In the present work, g-C3N4 coupled CdS quantum dots (QDs) was synthesized served as highly efficient photoactive species PEC sensor. The surface morphological analysis showed that QDs size ca. 4 nm were grafted on closely contacted interfaces. UV-visible diffuse reflection spectra (DRS) indicated absorption visible region...
Aluminum alloy sheets have drawn more and attention in recent years the automobile industry for purpose of weight loss energy saving. Hot forming-quenching (HFQ) integrated process (also called hot stamping) has been developed recently heat-treatable aluminum forming to improve formability, overcome springback part. In this paper, order investigate formability lubricationof a B-pillar stamping with 6061 7075 sheets, different solution heat treatment (SHT) temperatures, SHT time lubricants...
Lightweight of automobile has drawn increasing attention due to the demand for energy saving and emission reduction. High strength aluminum alloy sheet shows great potential in industry its high low density. Hot stamping been developed improve formability reduce springback. However, solution time this technology is too long. In order time, several experiments have carried out. The heating curves bare sheets BN or graphite coated radiant furnace were measured theoretical efficiency was...
Hydrogen produced by splitting water is receiving significant attention due to the rising global energy demand and growing climate concerns.
Transient responses of 3D stacked-die package with through silicon via (TSV) structure under board level drop test load following the JEDEC standard are investigated using Input-G finite element simulation method. In order to reduce mesh size investigation is modeled details while others simplified as blocks equivalent material properties. The deflection and velocity located at center obtained. stress strain copper via, micro solder pumps dies checked compared. results show that critical...
The conduction heating overcomes shortage of the radiation because rapid and high energy efficiency. It is suitable for blanks with an appropriate length/width ratio. In this study, a system was developed in terms Joule’s Law. Sensitivity blank shapes on temperature distribution hot stamping boron steel during investigated. Heating experiments irregular-shapes, such as ladder, joist rectangle variable cross-section were implemented system. results showed that steady decided by shape blanks....
Wire bonding is one of the main processes LED packaging which provides electrical interconnection between chip and lead frame. The gold wire process has been widely used in industry currently. However, due to high cost wire, copper a good substitute for can significant saving. In this paper, on power are compared analyzed with finite element simulation. This modeling work may provide guidelines parameter optimization packaging.