A5055971653- Electronic Packaging and Soldering Technologies
- Aluminum Alloy Microstructure Properties
- Advanced Welding Techniques Analysis
- Fuel Cells and Related Materials
- Electrocatalysts for Energy Conversion
- 3D IC and TSV technologies
- Intermetallics and Advanced Alloy Properties
- Advancements in Solid Oxide Fuel Cells
- Corrosion Behavior and Inhibition
- Electrodeposition and Electroless Coatings
- Microstructure and mechanical properties
- Metallurgical Processes and Thermodynamics
- Aluminum Alloys Composites Properties
- Refrigeration and Air Conditioning Technologies
- Machine Learning in Materials Science
- Polymer Surface Interaction Studies
- Composite Structure Analysis and Optimization
- Metallic Glasses and Amorphous Alloys
- Heat Transfer and Optimization
- Metal and Thin Film Mechanics
- Adsorption and Cooling Systems
- Conducting polymers and applications
- Injection Molding Process and Properties
- Structural Load-Bearing Analysis
- Membrane-based Ion Separation Techniques
Huazhong University of Science and Technology
2021-2024
Chinese Academy of Sciences
2016-2017
Abstract The effects of elements In, Bi and Sb with1, 2, 3, 4 5 wt.% added to pure Sn metal were investigated, in order study their influence on melting behavior, microstructure mechanical properties. findings indicate that the addition reduces undercooling Sn. After adding three Sn/Cu solder joints, remains predominantly composed β-Sn phase Cu6Sn5 phase, aligning with microstructures corresponding based bulk alloys. difference arises when is up wt.%, leading precipitation particles. element...
The Sn-Ag-Cu (SAC) solder alloys with a low Ag (Ag < 3 wt.%) content have attracted great attention owing to their cost, increased ability in bulk compliance, and plastic energy dissipation. However, some of mechanical properties are generally lower than the SAC higher content. Adding alloying elements is an effective approach for improving alloys. In this study, effect Bi, Sb, Ti on Sn-1 wt.%Ag-0.5 wt.%Cu (SAC105) was investigated. solders four compositions: SAC105-1 wt.%Bi, wt.%Sb,...
Bi, In and Ti were added to Sn-3.8Ag-0.7Cu (SAC387) solder alloy optimize the mechanical performance. The alloying effects of on microstructure, thermal properties SAC387 based alloys investigated. results demonstrate that adding 3.5 wt % Bi could refine properties, improve tensile strength. Meanwhile, ductility reduced evidently. Adding 2.8 into SAC387–3.5 %Bi increase both strength ductility, which is attributed beneficial effect addition, as solubility in β-Sn matrix. melting point was...
In this study, we employ coarse-grained molecular dynamics simulations to explore the microstructure of MSA (methanesulfonic acid)-type electroplating solution, containing Sn(MSA)2 as primary salt, stabilizer, amphiphilic alkylphenol ethoxylate (APEO) surfactants and cinnamaldehyde (CA) brightener agents, well water solvent. Our simulation indicates that temperature variations can significantly affect structural properties solution adsorption behavior its key components onto substrate....
Computational screening of 231 adsorbent/water working pairs from experimental water adsorption isotherm database for AHPs is carried out based on effective coefficient performance and temperature lift under practical condition.