A5052307710- Advanced Photocatalysis Techniques
- Mesoporous Materials and Catalysis
- TiO2 Photocatalysis and Solar Cells
- Supercapacitor Materials and Fabrication
- ZnO doping and properties
- Metal-Organic Frameworks: Synthesis and Applications
- Tribology and Wear Analysis
- Catalysis for Biomass Conversion
- Nanofabrication and Lithography Techniques
- Pigment Synthesis and Properties
- Polyoxometalates: Synthesis and Applications
- Industrial Vision Systems and Defect Detection
- Electrochemical sensors and biosensors
- Adsorption and biosorption for pollutant removal
- Oxidative Organic Chemistry Reactions
- Conducting polymers and applications
- Advanced Surface Polishing Techniques
- Synthesis and properties of polymers
- Integrated Circuits and Semiconductor Failure Analysis
- Gas Sensing Nanomaterials and Sensors
- Carbon dioxide utilization in catalysis
- Advanced oxidation water treatment
- Water Quality Monitoring and Analysis
Sirim Berhad
2022-2023
Universiti Sains Malaysia
2013-2020
Defects or deformations on the polyimide layer of a particular die can be caused by many factors. Additionally, it is rather inaccurate to determine extent damage whole just observing analysing topmost layer. Classical physical failure analysis approach would usually employ tools such as optical microscopy, SEM-EDX and FIB cross section. In rare cases, STEM-EDX, Auger, XPS AFM also employed. Most these (with exception FIB) deals with top surface analyses prove futile in investigating layers...
Abstract Viewing the cross section of wafers with glass carriers has always been a challenging task. Add on to observing and determining glue coverage is an uphill struggle due fragile nature glue. The traditional technique cleaving equipped neither promising nor highly successful. In addition mentioned disadvantages, presence carrier would mean wafer diamond scriber, dangerous possibility fragmentation which could be potential safety hazard. Time consuming, low success rate, lack finesse...