A5100389333- Metallurgy and Material Forming
- High Temperature Alloys and Creep
- Microstructure and mechanical properties
- Fatigue and fracture mechanics
- Magnesium Alloys: Properties and Applications
- Aluminum Alloys Composites Properties
- Electronic Packaging and Soldering Technologies
- Nuclear Materials and Properties
- Aluminum Alloy Microstructure Properties
- Microstructure and Mechanical Properties of Steels
- Metal Forming Simulation Techniques
- Advanced Welding Techniques Analysis
- Titanium Alloys Microstructure and Properties
- 3D IC and TSV technologies
- Advanced Thermoelectric Materials and Devices
- High-Velocity Impact and Material Behavior
- Mechanical stress and fatigue analysis
- Fusion materials and technologies
- Intermetallics and Advanced Alloy Properties
- Thermal properties of materials
- Fuel Cells and Related Materials
- Metal Alloys Wear and Properties
- Mechanical Behavior of Composites
- Nuclear reactor physics and engineering
- Adhesion, Friction, and Surface Interactions
Heilongjiang University of Science and Technology
2025
Guilin University of Technology
2025
Tianjin University
2015-2024
Tianjin Special Equipment Supervision and Inspection Technology Research Institute
2021-2024
State Key Laboratory of Chemical Engineering
2023-2024
Tianjin Medical University
2024
Harbin Institute of Technology
2010-2024
Tongji University
2024
Wuhan University of Technology
2007-2023
China National Petroleum Corporation (China)
2019-2023
An improved Anand constitutive model is proposed to describe the inelastic deformation of lead-free solder Sn-3.5Ag used in joints microelectronic packaging. The new accurately predicted overall trend steady-state stress-strain behavior for temperature range from 233 K 398 and strain rate 0.005 s/sup -1/ 0.1 -1/. h/sub 0,/ a constant original model, was set function model. Comparison experimental results simulated verified that with modifying 0/ reasonably relationships.
Recently, to accurately study the transient thermal behavior of power modules, a measurement system was developed investigate insulated-gate bipolar transistor (IGBT) modules attached by nanosilver paste and two kinds lead-free solders. We found that impedance IGBT 9% lower than using SAC305 SN100C with 40-ms heating pulse. In addition, finite-element analysis is employed simulate performance devices. The simulation shows also A convenient way introduced well predict module. calculated...