A5036907578- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- Electronic Packaging and Soldering Technologies
- Photonic and Optical Devices
- Quantum optics and atomic interactions
- Metallurgical Processes and Thermodynamics
- Metallurgy and Material Forming
- Manufacturing Process and Optimization
- Advanced machining processes and optimization
- Advanced Surface Polishing Techniques
- Quantum and electron transport phenomena
- Orbital Angular Momentum in Optics
- Advanced Antenna and Metasurface Technologies
- Metal Forming Simulation Techniques
- Materials Engineering and Processing
- Advancements in PLL and VCO Technologies
- Additive Manufacturing and 3D Printing Technologies
- Wind Energy Research and Development
- Spectroscopy and Laser Applications
- Terahertz technology and applications
- Semiconductor Quantum Structures and Devices
- Electric Motor Design and Analysis
- Interconnection Networks and Systems
Rensselaer Polytechnic Institute
2012-2016
Research Institute of Technology (Russia)
2013
Bridge University
2013
Tohoku University
2013
Peking University
2009-2010
Wuhan University of Science and Technology
2006
We have measured the spin-dependent nanometer-sized displacements of spin Hall effect reflected light from a planar air-glass interface. In case vertical polarization, displacement is found to increase with incident angle and subsequently decrease after approximately 48 deg, while in horizontal it changes rapidly near Brewster angle. For fixed 30 decreases zero as polarization approaches 39 deg 0 (the polarization) then increases opposite direction until 90 polarization).
We theoretically and experimentally study the spin Hall effect of reflected light at an air-uniaxial crystal interface. The spin-dependent nanometer-sized displacements depend not only on incident polarization angle beam, but also orientation optic axis. experimental results are in perfect agreement with theoretical predictions for vertical horizontal incidence.
This paper reports on modeling and analysis of power delivery network (PDN) impedance switching noise in through silicon via (TSV)-based 3-D integration. PDN is simulated SPICE with the combination lumped-element models distributed-element models, where elements are extracted from full-wave electromagnetic modeling. explicitly distinguishes contributions off-chip on-chip PDN, reveals TSV-induced resonant effect associated chip stack. The simultaneously noises analyzed different frequency...
Terahertz (THz) air-biased-coherent-detection (ABCD) uses a local oscillator to enhance THz-wave detection sensitivity by mixing an optical field, THz and biased electric field (local oscillator) in air. The width of the electrodes providing oscillator, longitudinal distribution waves, both play important roles overall sensitivity. By analyzing effect Gouy phase shift on at location, we determine optimal electrode observe enhancement efficiency factor two relative traditional THz-ABCD system...
Accurate modeling and estimation of 3-D power network electrical performance are vitally important to aid integration packaging design. This paper, for the first time, combines electromagnetic (EM) simulation program with integrated circuit emphasis simulations evaluate a network, which consists Cu through-silicon-vias (TSVs), solders, micro-solders, on-chip grids. We intentionally partition real stack-up structure into separated components, electromagnetically extract all passive elements...
This letter reports on compact models of voltage ( <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">IR</i> ) drops in a power delivery network (PDN) for through-silicon-via-based 3-D integration and packaging. The PDN is modeled with SPICE to investigate the dc distribution chip stacks. Analytical formulas are derived estimating two typical types vertical interconnect arrangements: uniform peripheral distributions. With good agreements, analytical...
This paper reports on modeling of the power delivery in TSV-based 3D systems, i.e., vertically integrated ICs with uniformly-distributed high-aspect-ratio through-silicon vias (TSVs). The voltage drop and di/dt noise are modeled to evaluate impact TSV density aspect ratio (AR). frequency dependency parasitics is fullwave EM simulator, performance network (PDN) analyzed domain. PDNs low-AR high-AR TSVs compared for trade-off analysis terms area occupation, which critical design delivery.
This paper reports on modeling of simultaneous switching noise (SSN) in 3D TSV-based system with multiple IC chips stacked and connected through TSVs. TSVs other components are modeled using full-wave electromagnetic tools to extract equivalent circuit models. Power distribution network (PDN) combining on-chip off-chip simulated SPICE. The voltage generated by current is analyzed exanimate the impact TSV geometric parameters such as dimensions, pitch, number. also extracted for potential...
This paper reports on power delivery modeling for 3D systems where through-silicon vias (TSVs) are not uniformly distributed, but arranged at the peripheries of circuit blocks and die edges. The voltage drop (IR) di/dt noise modeled compared with those given by distributed TSVs. impact TSV density block size, their tradeoffs evaluated.
This paper reports on modeling of simultaneous switching noise (SSN) in power distribution network (PDN) for 3D systems, where multiple IC chips are stacked and connected by through-silicon vias (TSVs). The noises generated current during the transition from idle state to active analyzed with both on-chip off-chip PDNs. SSN is decomposed into different frequency components their characteristics discussed. silent extracted evaluate interference a chip stack. Decoupling capacitors stagger...
This paper reports on the vertical noise coupling between a clock wire in digital IC and channel routing wires analog 3D mixed signal integration. Full wave electromagnetic simulations are employed to evaluate coupling. The mechanism is discussed with transfer impedance. Insights interconnects integration offered possible solutions provided reduce noise.