A5091063418- Electronic Packaging and Soldering Technologies
- Intermetallics and Advanced Alloy Properties
- Aluminum Alloys Composites Properties
- Aluminum Alloy Microstructure Properties
- Phytochemicals and Antioxidant Activities
- Meat and Animal Product Quality
- Organic Chemistry Cycloaddition Reactions
- Advanced materials and composites
- melanin and skin pigmentation
- Synthesis and Characterization of Heterocyclic Compounds
- 3D IC and TSV technologies
- Synthesis and biological activity
Higher Technological Institute
2017-2022
The present investigation informs a descriptive study of 1-(4-Hydroxyphenyl) -3-phenylprop-2-en-1-one compound, by using density functional theory at B3LYP method with 6-311G** basis set. oxygen atoms and π-system revealed high chemical reactivity for the title compound as electron donor spots active sites an electrophilic attack. Quantum parameters such hardness (η), softness (S), electronegativity (χ), electrophilicity (ω) were yielded descriptors molecule’s behavior. optimized molecular...
Abstract The Sn–3.8Ag-0.7Cu −1.0 wt% Zn (SACZ) plain solder alloy was reinforced by 0.3 of TiO 2 nanoparticles (NP). SEM, XRD, DSC, and stress-strain characterization techniques were used to examine the synthesized samples. morphology samples is uniform grain size SACZ-TiO sample refined compared solder. addition improved crystallinity SACZ sample. Furthermore, melting temperature prepared has same value even if its pasty range decreased adding NP. mechanical properties examined investigated...