A5108406073- Electronic Packaging and Soldering Technologies
- High Entropy Alloys Studies
- Welding Techniques and Residual Stresses
- Additive Manufacturing Materials and Processes
- High-Temperature Coating Behaviors
- Advanced Welding Techniques Analysis
- Advanced materials and composites
- Hydrogen embrittlement and corrosion behaviors in metals
- 3D IC and TSV technologies
- Microstructure and Mechanical Properties of Steels
- High Temperature Alloys and Creep
- Metal and Thin Film Mechanics
- Copper Interconnects and Reliability
- Metal Alloys Wear and Properties
- Intermetallics and Advanced Alloy Properties
- Aluminum Alloys Composites Properties
- Metallurgical and Alloy Processes
- Boron and Carbon Nanomaterials Research
- Aluminum Alloy Microstructure Properties
- Chalcogenide Semiconductor Thin Films
- 2D Materials and Applications
- Semiconductor materials and interfaces
- Nuclear Materials and Properties
- MXene and MAX Phase Materials
- Microstructure and mechanical properties
Shanghai Jiao Tong University
2016-2025
Purdue University West Lafayette
2024
Fujian Normal University
2024
Fujian Institute of Research on the Structure of Matter
2018-2022
National University of Singapore
2022
Chinese Academy of Sciences
2018-2022
Tianjin University
2022
Fuzhou University
2022
UNSW Sydney
2015-2018
Materials Science & Engineering
2015-2017
To accurately and quantitatively reveal the physical mechanism underlying formation of microstructure during coaxial powder-fed laser cladding, a three-dimensional comprehensive model, coupling laser-powder interaction, temperature field, flow is developed to identify effects multiphysics on characteristics. The high-speed camera numerical simulation are employed characterize powder distribution, which converted into corresponding cladding layer growth rate applied solve rise behavior molten...
The strong effects of Zn addition on the reaction in Sn/Cu systems are widely known. Nevertheless, micro-mechanism for accumulation behavior, phase evolution and void formation Sn-xZn/Cu remain unclear. In this work, effect interface behavior is investigated. Structures prepared by between Sn-xZn solders (x = 0, 0.2, 0.5 0.8 wt.%) electroplated Cu (EP Cu) joints. During thermal aging Sn/EP joints, many voids formed inside Cu3Sn phase, especially close to Cu3Sn/EP interface. Whereas were...
Refilled friction stir spot welding is proposed to replace solve the problem of keyhole in joining light metals. However, it rather challenging ensure mechanical property refilled joints because hook defect. In this study, a novel method was use graphene nanosheets strengthen tip defect and improve overall properties joint. The AA2014 aluminum alloy with 0.6%wt were fabricated by welding. results show that tensile/shear strength joint increases 31% fracture toughness also improved nearly 20%...
Vacuum hot-compression bonding (VHCB) is a promising solid-phase technology, but its feasibility and applicability in high entropy alloy (HEA) are still unclear. Herein, the VHCB process of CoCrFeMnNi HEA was investigated, interfacial quality comprehensively evaluated via microstructure characterization tensile test. Results exhibit that enables to obtain high-quality joints, excellent performance attributed dissolution oxide particles (IOPs) (MnCr2O4) migration grain boundaries (IGBs). The...
Polyaniline (PANI) as a flexible matrix has been widely used in sensor applications, while the usage of pure PANI is hampered due to its insufficient electrical conductivity and limited surface...