A5051646804- Advanced Surface Polishing Techniques
- Metal and Thin Film Mechanics
- Graphene research and applications
- Advanced ceramic materials synthesis
- Diamond and Carbon-based Materials Research
- 2D Materials and Applications
- Advanced materials and composites
- Magnesium Oxide Properties and Applications
- Carbon Nanotubes in Composites
- Adhesion, Friction, and Surface Interactions
- Boron and Carbon Nanomaterials Research
- Aluminum Alloys Composites Properties
- Force Microscopy Techniques and Applications
- Integrated Circuits and Semiconductor Failure Analysis
UCLouvain
2018-2025
Abstract Fail-safe design of devices requires robust integrity assessment procedures which are still absent for 2D materials, hence affecting transfer to applications. Here, a combined on-chip tension and cracking method, associated data reduction scheme have been developed determine the fracture toughness strength monolayer-monodomain-freestanding graphene. Myriads specimens generated providing statistical data. The crack arrest tests provide definitive 4.4 MPa $$\sqrt{{{{{{\rm{m}}}}}}}$$...
Amorphous alumina is hard but brittle like all ceramic type materials which affects durability under impact or scratch. Here we show that layers below 100 nm thickness when stacked with aluminum interlayers exhibit exceptional performances including toughness equal to 300 J.m−2 determined by on chip nanomechanics. This almost two orders of magnitude higher than bulk and any other thin coatings. In addition, a hardness above 8 GPa combines fracture strain 5%. The origin this superior set...
Binary ZrCu nanocomposite amorphous films are synthetized by pulsed laser deposition (PLD) under vacuum (2 × 10−3 Pa) and 10 Pa He pressure, leading to fully compact nanogranular morphologies, respectively. Then, post-thermal annealing treatments carried out explore thermal stability crystallization phenomena together with the evolution of mechanical properties. Compact exhibit larger partial starting at 420 °C, still be completed 550 while early-stage 300 °C 485 °C. The microstructural...
Abstract An on-chip fracture mechanics method is extended to characterize subcritical crack growth in submicron freestanding films. The relies on a self-actuated concept based MEMS fabrication principles. configuration consists of notched specimen attached actuator beams involving high internal stress. Upon release, initiates at the notch, propagates, and arrests. Several improvements are worked out limit mode III component avoid kinking. applied 140-nm-thick SiO 2 films under different...