One critical obstacle of current conductive adhesives is their unstable contact resistance with nonnoble metal finished components during high temperature and humidity aging. It commonly accepted that oxide formation at the interface between adhesive surface responsible for shift. Two different mechanisms, simple oxidation galvanic corrosion, both can cause formation, but no prior work has been conducted to confirm which mechanism dominant one. Therefore, this study aimed identifying main...

Conductive adhesives are composites of polymer matrixes and metal fillers (conductive elements). Silver (Ag) flakes widely used as for electrically conductive (ECAs). Generally, there is a thin layer organic lubricant coated on the commercial Ag flake surface. This needed eliminating particle agglomeration while dispersing filler into polymeric resin. Therefore influences rheology, conductivity, other properties ECA's. The nature interaction between surface were studied by diffuse...

Isotropic conductive adhesives (ICAs) are usually composites of adhesive resins with fillers (mainly silver flakes). The pastes before cure have low electrical conductivity. become highly only after the cured and solidified. conductivity mechanisms in were discussed. Experiments carefully designed order to determine roles shrinkage (Ag) flake lubricant removal on achievement during cure. establishment selected corresponding studied. Then, developments some metallic ICA external pressures...

Isotropic conductive adhesives (ICAs) are usually composites of adhesive resins with fillers (mainly silver flakes). The pastes before cure have low electrical conductivity. become highly only after the cured and solidified. mechanisms conductivity achievement in were discussed. Experiments carefully designed order to determine roles shrinkage (Ag) flake lubricant removal on during cure. establishment selected corresponding studied. Then developments some metallic ICA external pressures...

Variations of volume resistivity three electrically conductive adhesives (Ag-filled epoxy, Ag-filled cyanate ester, and Ni-filled epoxy) during 85/spl deg/C/85%RH aging were studied. Volume the two ECAs decreased slightly at beginning then remained stable. However, epoxy increased substantially. Joint resistance variations these with different metals (Ag, Cu, Sn) also studied by using a specially designed test vehicle. The Ag Cu wires did not show appreciable joint increase 1000-hour aging....

The typical underfill enhances the solder life of flip chip structures by up to an order magnitude. With increasing packaging applications requiring interconnection, much industry interest has been devoted development better materials, which are more cost-effective and provide performance than current commercial materials. This paper presents highlights a recent DARPA-funded program develop new materials for low-cost applications.

Surface mount conductive adhesives (SMCAs) provide an environmentally friendly solution for interconnections in electronic applications. In addition, SMCAs offer other attractive technical advantages over conventional Sn/Pb metal solders including low temperature processing and fine pitch capability. However, there have been major obstacles preventing from becoming a general replacement the electronics industry. Unstable electrical conductivity, (contact resistance), under elevated humidity...

Silver (Ag) flakes are widely used as fillers for electrically conductive adhesives (ECAs). The Ag need to be pretreated with organic lubricants ensure the proper rheology of ECAs. Lubricants on influence rheology, conductivity and other properties surface composition a flake was investigated by X-ray photoelectron spectroscopy. nature lubricant interaction between were studied diffuse reflectance infrared Thermal decomposition also differential scanning calorimetry. In addition, effects...

In the last few years, flip chip technology has been increasingly employed in a variety of applications microelectronics industry. Comparing to conventional wirebonding technology, provides lower profile, faster signal transfer, and higher I/O density. One key materials used is underfill encapsulant, which enhances reliability device by more than an order magnitude. Currently, underfilling carried out at package level, e.g., each be processed individually after solder reflow. The encapsulant...

This paper investigates the application of artificial intelligence (AI) to wireless technology, specifically in context beam management (BM) advanced 5th-generation (5G) communication system. Our focus lies aligning our study with ongoing discussions within Third Generation Partnership Project (3GPP) as December 2022. Instead evaluating performance specific AI models, we take user equipment (UE) receiver (Rx) prediction an illustrative example AI-based BM. We explore various aspects model...

Surface mount conductive adhesives (SMCAs) provide an environmentally friendly solution for interconnections in electronic applications. In addition, SMCAs offer other attractive technical advantages over conventional metal solders including low temperature processing, fine pitch capability, and enhanced thermal cycling performance. However, one key obstacle to general replacement of by applications is the poor impact resistance adhesive interconnections, which characterized industry...

Due to distribution shift, deep learning based methods for image dehazing suffer from performance degradation when applied real-world hazy images. In this paper, we consider a framework on conditional diffusion models improved generalization real haze. First, find that optimizing the training objective of models, i.e., Gaussian noise vectors, is nontrivial. The spectral bias networks hinders higher frequency modes in vectors being learned and hence impairs reconstruction details. To tackle...

Silver (Ag) flakes are widely used as conductive fillers for isotropic adhesives. provides superior conductivity and has reasonable costs associated with it compared to other precious metals utilized in the electronics industry. As a result, production of silver powders developed into an industry its own. The typically fabricated lubricated certain organic compounds such fatty acids. lubricants on surface play important role performance In particular, improvements rheology electrical have...

One of the key materials used in flip chip packaging is underfill encapsulant, which enhances reliability device by more than an order magnitude. This paper discusses fundamental adhesion issues are critical to package. study found that surface properties strongly depend on preparation conditions. The effects wet cleaning and dry cleaning, combination both were systematically studied. Although wetting improved after UV/O/sub 3/ treatment or O/sub 2/ plasma treatment, strength passivation...

Electrically conductive adhesives (ECAs) are composites of polymer matrices and fillers. Silver (Ag) flakes widely used as fillers for adhesives. Generally, there is a thin layer organic lubricant residue on the commercial Ag flake surface. This influences rheology, conductivity other properties ECAs. The nature interaction between surface were studied by diffuse reflectance infrared spectroscopy (DRIR). Thermal decomposition was differential scanning calorimetry (DSC) thermogravimetric...

Silver through-hole (STH) technology is a method to create an electrical interconnect between the top and bottom of printed circuit board (PCB). STH has gained continually gaining acceptance worldwide because process low-cost, reliable, environmentally benign. The detailed for connection described in this paper. Even though produce boards mature, performance current ink relies on different types PCB's. Exposure solder baths or thermal cycling becomes problematic with stability conductivity....

A series of novel underfill materials has been developed. These non-epoxy, thermoplastic-based satisfy all the basic requirements for materials: fast flow, cure, and reworkable. In addition, these new show high modulus, low thermal expansion coefficient, glass transition temperature (T/sub g/) comparable to epoxies. The exhibit excellent flow behavior, taking only 10 seconds a quarter inch full array die. Fast cure can be achieved within 5 minutes at 150/spl deg/C. Another distinct feature...

Trends in the electronics industry, requiring products to be smaller, lighter, and cheaper, are driving development of integral passive technology. New design system, test manufacturing processes provide new challenges opportunity employ materials. In general, metal/ceramic based materials better resistance stability, however, high processing temperatures, (up 800/spl deg/C), make them unusable with organic substrates. contrast, polymeric (e.g. polymer thick films or PTFs), a wide range...

Flip chip as the smallest packaging design has been used in more and electronic applications. underfill is an essential component for reliability of package. Currently, dispensing process done on each individual level after solder interconnects have made. The device then to go through a separate curing harden material. current underfilling cumbersome one cost drivers flip application. In wafer packaging, made over whole step. After dicing, reflow will be accomplished also saving substantial....