A5076443908- Heat Transfer and Optimization
- Multilevel Inverters and Converters
- Silicon Carbide Semiconductor Technologies
- Engineering Applied Research
- Aerodynamics and Fluid Dynamics Research
- Electronic Packaging and Soldering Technologies
- Electric and Hybrid Vehicle Technologies
- Advanced Aircraft Design and Technologies
- Aluminum Alloys Composites Properties
- Heat Transfer Mechanisms
- Integrated Circuits and Semiconductor Failure Analysis
- Brake Systems and Friction Analysis
- Semiconductor materials and devices
- Additive Manufacturing and 3D Printing Technologies
- Induction Heating and Inverter Technology
- Building Energy and Comfort Optimization
- Aluminum Alloy Microstructure Properties
- Aerodynamics and Acoustics in Jet Flows
- Electromagnetic Compatibility and Noise Suppression
- Additive Manufacturing Materials and Processes
- Turbomachinery Performance and Optimization
- Advanced DC-DC Converters
- Vehicle emissions and performance
- Advanced Battery Technologies Research
- Computational Fluid Dynamics and Aerodynamics
University of Arkansas at Fayetteville
2018-2024
Bangladesh University of Engineering and Technology
2017
This paper presents the design and evaluation of a phase-leg power electronic building block (PEBB) with 150-kVA rated by using 3-level T-type neutral-point-clamped (3L-TNPC) inverter for high-speed motor drives. Model-based pre-design evaluations module selections are first introduced to evaluate feasibility improve efficiency. Based on selected modules, novel busbar structure is proposed stray inductance 11.2 nH. Besides these, non-metallic cold plate designed evaluated. It shows less...
This study aims to provide an additive manufacturing-based pathway for addressing issues concerned with the reliability of high-density electronic packaging. It compares performance a non-metallic, additively manufactured heat spreader that conventional cold plate. CFD software is first used evaluate spreaders respect cooling capability. Furthermore, device experimentally tested in flow loop and its compared Initial simulation results show plastic sinks uniform profile maintain lower maximum...
Abstract Electronic packaging for automotive applications are at particular risk of thermomechanical failure due to the naturally harsh conditions it is exposed to. With rise electric and hybrid vehicles (EVs HEVs), combined with a desire miniaturize, challenge removing enough heat from electronic devices in evolving. This paper closely examines new challenges thermal management various driving environments aims classify each existing cooling method terms performance. Particular focus placed...
The single expansion ramp nozzle (SERN) is severely overexpanded when the vehicle at low speed, which hinders its ability to provide optimal configurations for combined cycle engines. over-expansion leads flow separation as a result of shock wave/boundary-layer interaction (SWBLI). Flow separation, and presence shocks themselves, in performance loss SERN, leading reduced thrust increased pressure losses. This study investigates effectiveness wall cooling enhancing an SERN by controlling...
Abstract With the increase of electronic device power density, thermal management and reliability are becoming increasingly important. First, increased density challenges capability conventional heat sinks to adequately dissipate heat. Secondly, higher frequency switching in wide bandgap modules is introducing new issues electromagnetic interference (EMI) which metallic removal systems will couple create damaging current ringing. Lastly, lightweight required meet increasing needs mobile...
Power output to electric traction drive systems varies over a wide range during real-world operation. As result, the inverters, responsible for converting direct current battery (DC) alternating (AC) motor operation, experience temperature changes that are important consider in thermal design of whole system, as well implications reliability actual use. Because on device & system reliability, it is necessary appropriate management control their temperatures meet product goals. This study...
Abstract The reliable operation of electronic equipment is strongly related to the thermal and mechanical conditions it exposed during operation. In order ensure a long lifetime components, imperative that any packaging design takes into careful consideration appropriateness various management schemes application-specific requirements in keep temperatures within certain limits. exact requirement varies with application, designs for automotive applications are at particular risk failure due...
Abstract Monitoring and predicting temperatures at critical locations of a power electronic system is important for safety, reliability, efficiency. As the market share vehicles with electric powertrains continues to increase, there also an economic cost failing components. For inverters present in such drive system, exceeding temperature limit certain components, as DC-link capacitors Silicon carbide MOSFETs, can lead failure system. In application, extracting using sensors from dies...
Abstract Monitoring and predicting temperatures at critical locations of a power electronic system is important for safety, reliability efficiency. As the market share vehicles with electric powertrains continue to increase, there also an economic cost failing components. For inverters present in such drive system, exceeding temperature limit certain components, as DC-link capacitors Silicon carbide MOSFETs, can lead failure system. In application, extracting using sensors from dies require...