PowerSynth is a multiobjective optimization tool for rapid design and verification of power semiconductor modules. By using reduced order models the calculation electrical parasitics layout thermal coupling between devices, optimal trace die placement can be simultaneously achieved orders magnitude faster than conventional finite element analysis (FEA) techniques. An overview tool, its modeling methods, model validation, module are presented. The validated against FEA simulations physical...

As a critical energy-conversion system component, power semiconductor modules and their layout optimization has been identified as crucial step in achieving the maximum performance density for wide bandgap technologies (i.e., GaN SiC). New packaging are also introduced to produce reliable efficient multichip module (MCPM) designs push current limits. The complexity of MCPM is surpassing capability manual, iterative design process an optimum with agile development requirements. An electronic...

Moving toward an electrified world requires ultrahigh-density power converters. With the adoption of wide-bandgap semiconductors (e.g., SiC and GaN), next-generation converters are on horizon. However, complexity compact high-speed is beyond current industry-standard design flow based manual iterative steps. Therefore, research automation optimization has been identified as emerging topic in electronics society. Among different components converter, physical modules proven critical for...

A constraint-aware layout engine is developed for PowerSynth to explore heterogeneous power module synthesis and optimization considering reliability. For this purpose, the corner stitching data structure with constraint graph evaluation extended layouts generic, scalable, efficient algorithms place route components including active devices, sensors, controllers, other passive components. Unlike VLSI, in modules design, compaction not optimum target because of thermal reliability issues...

Recent studies in power electronic design automation have introduced various models for parasitic extraction of multichip module layouts. However, none these considers the eddy current effect direct-bonded-copper substrate, accounting 40%–50% errors result. This work introduces a methodology eddy-current consideration through numerical simulation and regression modeling. The model utilized characterization process this is fast memory-efficient compared to finite element approach. can improve...

Multi-chip power module (MCPM) layout design automation has been identified as one of the primary research interests in electronics community with advent wide bandgap circuits. MCPM physical requires a time-consuming iterative procedure that is so far explored manually based on experience designers. Though number components and routing layers limited electronics, careful required because thermal reliability issues. In this paper, benefits hierarchical methodology are demonstrated over...

With the on-going trend of electrification transport, ultra-high-density power electronics with advanced 2.5D and 3D packaging are drawing attention. At present, module design is still a manual time-consuming procedure. Floorplanning, placement, routing, parasitic extraction need to be performed carefully enhance performance without sacrificing reliability. Inspired by automation tools for VLSI circuits, can dramatically reduce engineering time costs. As fabrication on horizon further...

In the last few years, design automation for multi-chip power modules (MCPMs) has become a trending research topic in electronics community. Many different re-search efforts have demonstrated advantages of bringing Computer-Aided Design (CAD) flow into MCPMs and optimization. Among these works, PowerSynth shown to most complete mature CAD MCPMs. This paper will go through some recent development PowerSynth. Modeling layout generation algorithm be discussed paper. The results 3D optimization...

Modern power electronics are experiencing significant demand for ultra-high-power density in the grid, data center, automotive industries, and aerospace applications. To satisfy increasing demand, innovative packaging technologies multi-chip modules (MCPMs) proposed by leveraging advantages from wide bandgap (WBG) devices (i.e., SiC, GaN). Since higher more vulnerable to electromigration (EM) risk, MCPM layout optimization requires EM consideration along with electro-thermal aspects. In this...

High-performance Multi-Chip Power Modules (MCPMs) are essential for high-density and efficient power conversion. Meanwhile, the chip layout design methodology fundamentally determine thermal reliability performance. Hign-density modules typically consist of wide-bandgap (WBG) semiconductor die, soldering materials, baseplate, heatsink packed on a single substrate. To great extent, depends these material electrothermal-mechanical properties during variable operating conditions. Appropriate...

Electrical parasitics, especially parasitic inductance, play an essential role in enhancing power module design performance through reducing voltage overshoot and switching losses. In this paper, a new electrical extraction model is developed, inspired by the loop-based method from VLSI. This shows only within 10% error compared to FastHenry while being orders of magnitude more efficient run time memory. For same design, takes less than 0.5 seconds on machine achieve similar accuracy. also...

PowerSynth has been developed to significantly accelerate power module design through a multi-objective layout synthesis and optimization process. It uses series of generation algorithms various electrical thermal models automatically synthesize layouts create Pareto surface solutions with optimum performance. Recent advanced modules are designed types components integrated on multiple device layers minimize the parasitics increase density. With more compact tighter constraints, becomes...

In this paper, an analytical model has been developed for the vacuum field-effect transistor (VFET). Mathematical expressions drive in voltage and current derived. A modeled based on minimum density space charge limited emission. Analytical of channel incorporates device operating physics such as emission Fowler-Nordheim tunneling. The numerically verified with practical data available. Proposed provides opportunity to evaluate characteristics determine future projections well.

Multi-chip power module (MCPM) layout design automation has become an emerging research field in the electronics society. MCPM physical is currently a trial-and-error procedure that heavily relies on designers' experience to produce reliable solution. To push boundary of energy efficiency and density, novel packaging technologies are with increasing complexity. As this manual process becomes bottleneck productivity, industry calling for more intelligence CAD tools, especially advanced...

Abstract The reliable operation of electronic equipment is strongly related to the thermal and mechanical conditions it exposed during operation. In order ensure a long lifetime components, imperative that any packaging design takes into careful consideration appropriateness various management schemes application-specific requirements in keep temperatures within certain limits. exact requirement varies with application, designs for automotive applications are at particular risk failure due...

As power densification demands are placing electronic packages under greater reliability risk, the consequence of complementary or interacting stresses in producing failure becoming increasingly significant. such, it is important that methods and package designs consider how multiple-stress interactions may impact product life. Here, coordination between a novel accelerated testing method design automation efforts has demonstrated successful optimization approach for wire-bonded 2D module...

As power densification demands are placing electronic packages under greater reliability risk, the consequences of complementary or interacting stresses in producing failure becoming increasingly significant. such, it is important that methods and package designs consider how multiplestress interactions may impact product life. Here, coordination between a novel accelerated testing method design automation efforts has demonstrated successful optimization approach for wire-bonded 2D module...

Multi-Chip Power Modules (MCPM) are a critical component in power conversion applications. modules and their layout optimization have been considered crucial step to achieving maximum performance. PowerSynth 2 (PS2) is an electronic design automation (EDA) tool for the generation of module layouts. Currently, v2.0 uses NSGA-II Randomization optimization. However, existing implementation not aware hierarchy, resulting less desirable solution space than Randomization. To address this...

Working under the NSF-sponsored POETS REU program, students are given opportunity to work at University of Arkansas on advanced research projects such as development a software tool called PowerSynth, which can optimize power electronic module layout.This is first that automates multi-chip (MCPM) design flow, and optimization results hardware-validated.The new version PowerSynth has required creation graphical user interface (GUI).A detailed description GUIs flow implementation presented...